摘要:
A transducer is provided herein which comprises an unbalanced proof mass (51), and which is adapted to sense acceleration in at least two mutually orthogonal directions. The proof mass (51) has first (65) and second (67) opposing sides that are of unequal mass.
摘要:
A transducer is provided herein which comprises an unbalanced proof mass (51), and which is adapted to sense acceleration in at least two mutually orthogonal directions. The proof mass (51) has first (65) and second (67) opposing sides that are of unequal mass.
摘要:
A MEMS device that has a sensitivity to a stimulus in at least one sensing direction includes a substrate, a movable mass with corner portions suspended in proximity to the substrate, at least one suspension structure coupled approximately to the corner portions of the movable mass for performing a mechanical spring function, and at least one anchor for coupling the substrate to the at least one suspension structure. The at least one anchor is positioned approximately on a center line in the at least one sensing direction.
摘要:
A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.
摘要:
A MEMS device includes a substrate; a movable mass suspended in proximity to the substrate; and at least one suspension structure coupled to the movable mass for performing a mechanical spring function. The at least one suspension structure has portions that move in tandem when the MEMS device is subject to at least one stimulus in a sensing direction, and further includes at least one link between the portions that move in tandem.
摘要:
An electronic component includes a support substrate (101), a fixed electrode (113) overlying the support substrate (101), a movable electrode (123, 423) overlying the support substrate and the first electrode (113) wherein the first and second electrodes (113, 123, and 423) form a capacitor with a sensing area, an anchor (122, 422) coupled to the support substrate (101), and beams (125, 425) coupling different attachment points (129) of the second electrode (123, 423) to the anchor (122, 422) wherein the different attachment points (129) form a simply connected polygon and wherein a portion of the sensing area is located within the simply connected polygon.
摘要:
A differential capacitor structure (10) formed overlying a substrate (12) having a middle layer (24) disposed between a lower layer (18) and an upper layer (28). The lower layer (18) is a static layer that is formed on the substrate (12), the middle layer (24) has a moveable component and is a dynamic layer attached to the substrate (12) using semi-circular tether supports (42), and the upper layer is a static layer that is anchored to the substrate (12). The semi-circular tether supports (42) are formed from a homogeneous material and provide structural stiffness to support the middle layer (24) in space and also provide stress relief.
摘要:
A process for making an inverted silicon-on-insulator semiconductor device having a pedestal structure. After the processing of polysilicon layers, dielectric layers, an epitaxial region and a nitride layer, a second substrate is bonded to the nitride layer and the first substrate is removed. This allows for an epitaxial region which is isolated from the substrate.
摘要:
A method and structure for adding mass with stress isolation to MEMS. The structure has a thickness of silicon material coupled to at least one flexible element. The thickness of silicon material can be configured to move in one or more spatial directions about the flexible element(s) according to a specific embodiment. The apparatus also includes a plurality of recessed regions formed in respective spatial regions of the thickness of silicon material. Additionally, the apparatus includes a glue material within each of the recessed regions and a plug material formed overlying each of the recessed regions.
摘要:
A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.