摘要:
A multi-layer H2 sensor includes a carbon nanotube layer, and a ultra-thin metal or metal alloy layer in contact with the nanotube layer. The ultra-thin metal or metal alloy layer is preferably from 10 to 50 angstroms thick. An electrical resistance of the layered sensor increases upon exposure to H2 and can provide detection of hydrogen gas (H2) down to at least 10 ppm, The metal or metal alloy layer is preferably selected from the group consisting of Ni, Pd and Pt, or mixtures thereof. Multi-layered sensors and can be conveniently operated at room temperature.
摘要:
Embodiments of the invention include sensors comprising AlGaAs/GaAs high electron mobility transistors (HEMTs), inGaP/GaAs HEMTs. InAlAs/InGaAs HEMTs, AlGaAs/InGaAs PHEMTs, InAlAs/InGaAs PHEMTs, Sb based HEMTs, or InAs based HEMTs, the HEMTs having functionalization at a gate surface with target receptors. The target receptors allow sensitivity to targets (or substrates) for detecting breast cancer, prostate cancer, kidney injury, chloride, glucose, metals or pEI where a signal is generated by the HEMI when a solution is contacted with the sensor. The solution can be blood, saliva, urine, breath condensate, or any solution suspected of containing any specific analyte for the sensor.
摘要:
Embodiments of the invention include sensors comprising AlGaAs/GaAs high electron mobility transistors (HEMTs), inGaP/GaAs HEMTs. InAlAs/InGaAs HEMTs, AlGaAs/InGaAs PHEMTs, InAlAs/InGaAs PHEMTs, Sb based HEMTs, or InAs based HEMTs, the HEMTs having functionalization at a gate surface with target receptors. The target receptors allow sensitivity to targets (or substrates) for detecting breast cancer, prostate cancer, kidney injury, chloride, glucose, metals or pEI where a signal is generated by the HEMI when a solution is contacted with the sensor. The solution can be blood, saliva, urine, breath condensate, or any solution suspected of containing any specific analyte for the sensor.
摘要:
Embodiments of the present invention provide binding molecule-functionalized high electron mobility transistors (HEMTs) that can be used to detect toxins, pathogens and other biological materials. In a specific embodiment, an antibody-functionalized HEMT can be used to detect botulinum toxin. The antibody can be anchored to a gold-layered gate area of the HEMT through immobilized thioglycolic acid. Embodiments of the subject detectors can be used in field-deployable electronic biological applications based on AlGaN/GaN HEMTs.
摘要翻译:本发明的实施方案提供可用于检测毒素,病原体和其他生物材料的结合分子官能化的高电子迁移率晶体管(HEMT)。 在具体实施方案中,抗体功能化的HEMT可用于检测肉毒杆菌毒素。 抗体可以通过固定化的巯基乙酸锚定在HEMT的金层门区。 本发明的检测器的实施例可以用于基于AlGaN / GaN HEMT的现场可部署电子生物学应用中。
摘要:
The subject invention concerns nanorods, compositions and substrates comprising nanorods, and methods of making and using nanorods and nanorod compositions and substrates. In one embodiment, the nanorod is composed of Zinc oxide (ZnO). In a further embodiment, a nanorod of the invention further comprises SiO2 or TiO2. In a specific embodiment, a nanorod of the invention is composed of ZnO coated with SiO2. Nanorods of the present invention are useful as an adhesion-resistant biomaterial capable of reducing viability in anchorage-dependent cells.
摘要:
The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.
摘要:
In-containing III/V semiconductor materials (e.g., InGaP) can be dry etched in BCl.sub.3 in ECR apparatus. We have discovered that addition of N.sub.2 to the BCl.sub.3 can result in substantially higher etch rate (e.g., more than 50% higher). Etching is substantially without incubation period, and the resulting surface can be very smooth (e.g., RMS roughness less than 5 nm, even less than 2.5 nm). Exemplarily, the novel etching step is used in the manufacture of a InGaP/GaAs transistor.
摘要翻译:含In III / V半导体材料(例如,InGaP)可以在ECR设备中在BCl3中进行干蚀刻。 我们已经发现,向BCl 3中添加N2可导致显着更高的蚀刻速率(例如,高于50%以上)。 蚀刻基本上没有潜伏期,并且所得表面可以非常光滑(例如,RMS粗糙度小于5nm,甚至小于2.5nm)。 示例性地,新颖的蚀刻步骤用于制造InGaP / GaAs晶体管。
摘要:
In accordance with the invention, aluminum-containing layers are grown by molecular beam processes using as an arsenic precursor phenylarsine (PhAs). Because PhAs is more reactive than arsine and less reactive than arsenic, it decomposes selectively on III-V surfaces but not on mask materials. Thus in contrast to conventional processes, growth using PhAs permits selective growth on unmasked gallium arsenide surfaces but inhibits growth on typical mask materials such as silicon nitride.
摘要:
The present applicants have discovered that a layer predominantly comprising tungsten can be formed into precise patterns having substantially vertical walls by using titanium as a mask and plasma etching in a fluorine-containing plasma such as CF.sub.4 or SF.sub.6. The success of the process is believed attributable to the occurrence of an etch stop reaction on the sidewalls of the tungsten. The products of the reaction inhibit horizontal etching. After the tungsten is etched, the titanium mask can be selectively removed, as by etching in dilute HF. Each step in the process can be effected without subjecting the workpiece to voltage magnitudes in excess of 200 volts or temperatures outside the range between room temperature and 200.degree. C.