公开(公告)号：US20190301049A1

公开(公告)日：2019-10-03

申请号：US16370265

申请日：2019-03-29

Applicant: Applied Materials, Inc.

Inventor： Nolan Zimmerman ,  Greg Wilson ,  Andrew Anten ,  Richard W. Plavidal ,  Eric J. Bergman ,  Tricia Youngbull ,  Timothy Gale Stolt ,  Sam Lee

IPC: C25D21/08 ,  C25D5/48 ,  C25D7/12 ,  H01L21/02 ,  H01L21/288

Abstract: Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.

公开(公告)号：US20190321861A1

公开(公告)日：2019-10-24

申请号：US16386646

申请日：2019-04-17

Applicant: Applied Materials, Inc.

Inventor： Joseph A. Jonathan ,  Kyle M. Hanson ,  Jason Rye ,  James Brown ,  Greg Wilson ,  Eric J. Bergman ,  Tricia A. Youngbull ,  Timothy Gale Stolt

IPC: B08B1/00 ,  C25D17/00

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

公开(公告)号：US20160355941A1

公开(公告)日：2016-12-08

申请号：US15174735

申请日：2016-06-06

Applicant: APPLIED Materials, Inc.

Inventor： Bioh Kim ,  Marvin Bernt ,  Greg Wilson ,  Paul R. McHugh

IPC: C25D5/02 ,  H01L21/288 ,  C25D7/12 ,  C25D21/10 ,  C25D3/56

CPC classification number: C25D5/02 ,  C25D3/56 ,  C25D5/18 ,  C25D7/123 ,  C25D21/10 ,  H01L21/2885 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/05173 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/0105

Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.

Abstract translation: 控制电势，电流密度，搅拌和沉积速率以沉积金属合金，例如锡基焊料合金或磁性合金，在沉积的金属合金特征中的不同位置处的合金金属的重量比的变化最小。 替代实施例包括形成金属合金特征的工艺，其中特征内的合金金属的重量比的变化不一定最小化，而是被控制以提供期望的变化。 除了金属合金之外，替代实施例包括用于改善单个金属特征沉积的方法。