公开(公告)号：US20170051423A1

公开(公告)日：2017-02-23

申请号：US15232970

申请日：2016-08-10

Applicant: APPLIED Materials, Inc.

Inventor： Paul Van Valkenburg ,  Robert Mikkola ,  John L. Klocke ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle Moran Hanson ,  Eric J. Bergman

IPC: C25D5/02 ,  C25D21/10 ,  C25D17/06 ,  C25D17/00 ,  C25D5/22

CPC classification number: C25D21/10 ,  C25D5/02 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D17/06

Abstract: In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.

Abstract translation: 在电镀装置中，桨或搅拌器搅动容器中的电解质以在晶片的表面提供高速流体流动。 搅拌器被设计和/或移动以也可以选择性地将晶片的一部分（例如晶片的边缘）从容器中的电场屏蔽。 通过省略或缩短搅拌器中的狭缝，和/或通过使搅拌器与晶片的旋转同步移动，可以将搅拌器的平均位置暂时移向晶片的一侧来实现选择性屏蔽。

公开(公告)号：US11697887B2

公开(公告)日：2023-07-11

申请号：US17078413

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Nolan L. Zimmerman ,  Charles Sharbono ,  Gregory J. Wilson ,  Paul R. McHugh ,  Paul Van Valkenburg ,  Deepak Saagar Kalaikadal ,  Kyle M. Hanson

IPC: C25D17/10 ,  C25D21/12 ,  C25D21/18 ,  C25D7/12 ,  C25D17/00

CPC classification number: C25D17/10 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/18

Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

公开(公告)号：US20160237584A1

公开(公告)日：2016-08-18

申请号：US14620984

申请日：2015-02-12

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  John L. Klocke ,  Randy A. Harris ,  Bridger Hoerner ,  Paul Van Valkenburg

IPC: C25D5/22 ,  C25D5/34 ,  C25D17/00 ,  C25D17/06 ,  H01L21/288 ,  C25D7/12

CPC classification number: C25D5/34 ,  C25D5/022 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004

Abstract: A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.

Abstract translation: 一种用于处理晶片的方法包括将晶片保持在面朝上位置，其中密封环在接触圆周上接触晶片。 液体珠被施加到整个接触圆周上，液体珠接触晶片和密封环。 然后将晶片倒置成下降位置，降低成与电解质接触并镀上导电膜。 当晶片浸入电解质中时，液体珠的形成有助于置换气泡，这减少了电镀缺陷。

公开(公告)号：US20230167573A1

公开(公告)日：2023-06-01

申请号：US18159041

申请日：2023-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D17/001 ,  C25D21/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/007

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US11268208B2

公开(公告)日：2022-03-08

申请号：US16870290

申请日：2020-05-08

Applicant: APPLIED Materials, Inc.

Inventor： Paul R McHugh ,  Gregory J Wilson ,  Kyle M Hanson ,  John L Klocke ,  Paul Van Valkenburg ,  Eric J Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R Borjesson

IPC: C25D17/12 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US11578422B2

公开(公告)日：2023-02-14

申请号：US17583004

申请日：2022-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US20220127747A1

公开(公告)日：2022-04-28

申请号：US17078413

申请日：2020-10-23

Applicant: Applied Materials, Inc.

Inventor： Nolan L. Zimmerman ,  Charles Sharbono ,  Gregory J. Wilson ,  Paul R. McHugh ,  Paul Van Valkenburg ,  Deepak Saagar Kalaikadal ,  Kyle M. Hanson

IPC: C25D17/10 ,  C25D17/00 ,  C25D21/12

Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.

公开(公告)号：US20210348296A1

公开(公告)日：2021-11-11

申请号：US16870290

申请日：2020-05-08

Applicant: APPLIED Materials, Inc.

Inventor： Paul R McHugh ,  Gregory J Wilson ,  Kyle M Hanson ,  John L Klocke ,  Paul Van Valkenburg ,  Eric J Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R Borjesson

IPC: C25D17/12 ,  C25D5/08 ,  C25D21/12 ,  C25D17/00

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US11982008B2

公开(公告)日：2024-05-14

申请号：US18159041

申请日：2023-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D21/12

CPC classification number: C25D17/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D21/12

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US20220145489A1

公开(公告)日：2022-05-12

申请号：US17583004

申请日：2022-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.