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    EPI BASE RING
    1.
    发明申请
    EPI BASE RING 审中-公开
    EPI基座

    公开(公告)号：US20160230276A1

    公开(公告)日：2016-08-11

    申请号：US15136119

    申请日：2016-04-22

    Applicant: Applied Materials, Inc.

    Inventor： Steve ABOAGYE ,  Paul BRILLHART ,  Surajit KUMAR ,  Anzhong CHANG ,  Satheesh KUPPURAO ,  Mehmet Tugrul SAMIR ,  David K. CARLSON

    IPC: C23C16/455 ,  C23C16/458

    CPC classification number: C23C16/45502 ,  C23C16/4411 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/481

    Abstract: Embodiments described herein relate to a base ring assembly for use in a substrate processing chamber. In one embodiment, the base ring assembly comprises a ring body sized to be received within an inner circumference of the substrate processing chamber, the ring body comprising a loading port for passage of the substrate, a gas inlet, and a gas outlet, wherein the gas inlet and the gas outlet are disposed at opposing ends of the ring body, and an upper ring configured to dispose on a top surface of the ring body, and a lower ring configured to dispose on a bottom surface of the ring body, wherein the upper ring, the lower ring, and the ring body, once assembled, are generally concentric or coaxial.

    Abstract translation: 本文所述的实施例涉及用于衬底处理室中的基座环组件。 在一个实施例中，基环组件包括尺寸适于容纳在基板处理室的内圆周内的环体，环体包括用于通过基板的装载口，气体入口和气体出口，其中， 气体入口和气体出口设置在环体的相对端，并且配置成设置在环体的顶表面上的上环和被配置为设置在环体的底表面上的下环，其中， 一旦组装，上环，下环和环体大致同心或同轴。

    INJECT AND EXHAUST DESIGN FOR EPI CHAMBER FLOW MANIPULATION
    3.
    发明申请
    INJECT AND EXHAUST DESIGN FOR EPI CHAMBER FLOW MANIPULATION 审中-公开
    用于EPI室流程操作的注入和排除设计

    公开(公告)号：US20140326185A1

    公开(公告)日：2014-11-06

    申请号：US14257547

    申请日：2014-04-21

    Applicant: Applied Materials, Inc.

    Inventor： Shu-Kwan LAU ,  Mehmet Tugrul SAMIR

    IPC: C23C16/52 ,  C23C16/00

    CPC classification number: C23C16/45563 ,  C23C16/4412

    Abstract: The embodiments described herein generally relate to a flow control in a process chamber. The process chamber can include combinations of a flow control exhaust and a broad inject. The flow control exhaust and the broad inject can provide for controlled flow of process gases, as the gases both enter and leave the chamber, as well as controlling the gases already present in the chamber. Therefore, the overall deposition profile can be maintained more uniform.

    Abstract translation: 本文描述的实施例通常涉及处理室中的流量控制。 处理室可以包括流量控制排气和宽喷射的组合。 当气体进入和离开室时，流量控制排气和宽喷射可以提供工艺气体的受控流动，以及控制已经存在于腔室中的气体。 因此，整体沉积轮廓可以保持更均匀。

    LINER FOR EPI CHAMBER
    6.
    发明申请
    LINER FOR EPI CHAMBER 审中-公开
    衬垫用于EPI室

    公开(公告)号：US20160068997A1

    公开(公告)日：2016-03-10

    申请号：US14826065

    申请日：2015-08-13

    Applicant: Applied Materials, Inc.

    Inventor： Shu-Kwan LAU ,  Mehmet Tugrul SAMIR ,  Aaron MILLER

    IPC: C30B25/14 ,  C23C16/455 ,  C30B25/08 ,  C23C16/44

    CPC classification number: C30B25/14 ,  C23C16/4408 ,  C23C16/45574 ,  C23C16/45591 ,  C30B35/00

    Abstract: Embodiments disclosed herein describe a liner assembly including a plurality of individually separated gas passages. The liner assembly provides control of flow parameters, such as velocity, density, direction and spatial location, across a substrate being processed. The processing gas across the substrate being processed may be specially tailored for individual processes with a liner assembly according to the present embodiments.

    Abstract translation: 本文公开的实施例描述了包括多个单独分离的气体通道的衬套组件。 衬套组件提供对正在被处理的衬底上的流动参数（例如速度，密度，方向和空间位置）的控制。 正在处理的衬底上的处理气体可以针对根据本实施例的衬套组件针对各个工艺进行专门的定制。

    FLOW CONTROLLED LINER HAVING SPATIALLY DISTRIBUTED GAS PASSAGES
    7.
    发明申请
    FLOW CONTROLLED LINER HAVING SPATIALLY DISTRIBUTED GAS PASSAGES 有权
    具有空气分配气体通道的流量控制衬管

    公开(公告)号：US20140322897A1

    公开(公告)日：2014-10-30

    申请号：US14259898

    申请日：2014-04-23

    Applicant: Applied Materials, Inc.

    Inventor： Mehmet Tugrul SAMIR ,  Shu-Kwan LAU

    IPC: H01L21/67 ,  H01L21/02

    CPC classification number: H01L21/67017 ,  C23C16/4401 ,  C23C16/455 ,  C23C16/45519 ,  H01L21/67115 ,  H01L21/67253 ,  Y10T137/87265

    Abstract: Embodiments of the present disclosure provide a liner assembly including a plurality of individually separated gas passages. The liner assembly enables tenability of flow parameters, such as velocity, density, direction and spatial location, across a substrate being processed. The processing gas across the substrate being processed may be specially tailored for individual processes with a liner assembly according to embodiment of the present disclosure.

    Abstract translation: 本公开的实施例提供了一种衬套组件，其包括多个单独分离的气体通道。 衬套组件使得能够处理正在处理的衬底上的流动参数（例如速度，密度，方向和空间位置）的可维护性。 正在处理的衬底上的处理气体可以根据本公开的实施例专门针对具有衬套组件的各个工艺进行定制。

    THERMAL COUPLED QUARTZ DOME HEAT SINK
    8.
    发明申请
    THERMAL COUPLED QUARTZ DOME HEAT SINK 审中-公开

    公开(公告)号：US20170338135A1

    公开(公告)日：2017-11-23

    申请号：US15673801

    申请日：2017-08-10

    Applicant: Applied Materials, Inc.

    Inventor： Joseph M. RANISH ,  Mehmet Tugrul SAMIR ,  Paul BRILLHART

    IPC: H01L21/67 ,  C23C16/46 ,  C23C16/44

    CPC classification number: H01L21/67115 ,  C23C16/4411 ,  C23C16/463

    Abstract: Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.

    SUSCEPTOR SUPPORT
    9.
    发明申请
    SUSCEPTOR SUPPORT 审中-公开

    公开(公告)号：US20170275777A1

    公开(公告)日：2017-09-28

    申请号：US15470268

    申请日：2017-03-27

    Applicant: Applied Materials, Inc.

    Inventor： Richard O. COLLINS ,  Errol Antonio C. SANCHEZ ,  David K. CARLSON ,  Mehmet Tugrul SAMIR

    IPC: C30B25/12 ,  C23C16/458 ,  C23C16/48

    CPC classification number: C30B25/12 ,  C23C16/4583 ,  C23C16/4585 ,  C23C16/481

    Abstract: Embodiments described herein generally relate to a susceptor support for supporting a susceptor in a deposition process. The susceptor support includes a shaft, a plate with a first major surface coupled to the shaft, and a support element extending from a second major surface of the plate. The plate may be made of a material that is optically transparent to the radiation energy from a plurality of energy sources disposed below the plate. The plate may have a thickness that is small enough to minimize radiation transmission loss and large enough to be thermally and mechanically stable to support the susceptor during processing. The thickness of the plate may range from about 2 mm to about 20 mm.

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