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公开(公告)号：US20070235854A1
公开(公告)日：2007-10-11
申请号：US11277991
申请日：2006-03-30
IPC分类号： H01L23/48
CPC分类号： H01L23/49503 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/4911 , H01L2924/00014 , H01L2924/01014 , H01L2924/01031 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided forming a ring above a paddle and an external interconnect, mounting an integrated circuit die on the paddle, connecting the integrated circuit die and the external interconnect, the external interconnect and the ring, and the ring and the integrated circuit die, and encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
摘要翻译： 提供了一种集成电路封装系统，其形成在桨上方的环和外部互连件，将集成电路管芯安装在桨上，连接集成电路管芯和外部互连，外部互连和环以及环和集成 并且封装集成电路管芯，环以及外部互连和桨的一部分。
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公开(公告)号：US20070235215A1
公开(公告)日：2007-10-11
申请号：US11278070
申请日：2006-03-30
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/49822 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06589 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K3/3436 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , H05K2201/10689 , Y10T29/4913 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
摘要翻译： 一种集成电路封装系统，包括形成多层衬底，以及在多层衬底上附着多个集成电路。
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公开(公告)号：US20070194424A1
公开(公告)日：2007-08-23
申请号：US11307723
申请日：2006-02-17
CPC分类号： H01L25/03 , H01L24/73 , H01L25/0657 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an integrated circuit package system with die on base package comprising forming a base package comprising, forming a substrate, mounting a first integrated circuit on the substrate, encapsulating the integrated circuit and the substrate with a molding compound, and testing the base package, attaching a bare die to the base package, connecting electrically the bare die to the substrate and encapsulating the bare die and the base package.
摘要翻译： 本发明提供了一种集成电路封装系统，其具有基底封装上的管芯，包括形成基底封装，其包括：形成衬底，将第一集成电路安装在衬底上，用模塑料封装集成电路和衬底，以及测试基底 封装，将裸芯片附接到基底封装，将裸裸片电连接到衬底并封装裸裸片和基底封装。
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公开(公告)号：US20070181982A1
公开(公告)日：2007-08-09
申请号：US11307386
申请日：2006-02-04
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/49579 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/1601 , H01L2224/81141 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15151
摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。
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公开(公告)号：US20070158792A1
公开(公告)日：2007-07-12
申请号：US11306693
申请日：2006-01-06
IPC分类号： H01L23/495 , H01L23/02 , H01L23/52
CPC分类号： H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27013 , H01L2224/2919 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the die paddle.
摘要翻译： 提供了一种集成电路封装系统，其将膜连接到管芯焊盘，向膜施加粘合剂，以及将集成电路管芯粘合到粘合剂和膜上并附接到管芯焊盘。
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6.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS 审中-公开集成电路包装系统，具有高度厚度的厚度的DIE-ATTACH PAD公开(公告)号：US20070176271A1
公开(公告)日：2007-08-02
申请号：US11307349
申请日：2006-02-01
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L2224/32014 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided. A leadframe is provided having a die-attach pad. Elevated buttons are formed on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
摘要翻译： 提供集成电路封装系统。 提供具有管芯附接垫的引线框架。 升高的按钮形成在芯片附接垫的顶表面上，其被配置为在其上的升高位置支撑IC芯片。
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公开(公告)号：US20070170555A1
公开(公告)日：2007-07-26
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
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公开(公告)号：US20070170554A1
公开(公告)日：2007-07-26
申请号：US11338328
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L23/3135 , H01L23/495 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
摘要翻译： 提供了一种集成电路封装系统，其从无铅引线框架形成引线，并且封装所述引线以将第一模塑料与第二模塑料一起封装，用于支撑集成电路模具。
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公开(公告)号：US20070170570A1
公开(公告)日：2007-07-26
申请号：US11307129
申请日：2006-01-24
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system provides a known good die module by providing a leadframe, providing a first die, attaching the first die to the leadframe, and encapsulating at least the first die. A second die is attached to the known good die module such that the known good die module is a substrate for the second die. The second die is electrically attached to the known good die module. At least the second die is additionally encapsulated.
摘要翻译： 集成电路封装系统通过提供引线框架提供已知的良好管芯模块，提供第一管芯，将第一管芯附接到引线框架，以及至少封装第一管芯。 第二模具连接到已知的良好模具模块，使得已知的良好模具模块是用于第二模具的基板。 第二个模具电连接到已知的好的模具模块。 至少第二个管芯被另外封装。
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公开(公告)号：US20070170558A1
公开(公告)日：2007-07-26
申请号：US11307101
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package system is provided providing a lead frame having a die paddle, attaching a first integrated circuit on the die paddle of the lead frame, connecting first electrical interconnects between the first integrated circuit and the lead frame, encapsulating the first integrated circuit and the first electrical interconnects, attaching a second integrated circuit on the die paddle of the first integrated circuit, connecting second electrical interconnects between the second integrated circuit and the lead frame, and encapsulating the second integrated circuit and the second electrical interconnects.
摘要翻译： 提供一种堆叠集成电路封装系统，其提供具有管芯焊盘的引线框架，将引线框架的管芯焊盘上的第一集成电路连接到第一集成电路和引线框架之间，将第一集成电路封装在第一集成电路 以及第一电互连，将第二集成电路连接到第一集成电路的管芯焊盘上，连接第二集成电路和引线框架之间的第二电互连，以及封装第二集成电路和第二电互连。
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