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公开(公告)号:US20070205496A1
公开(公告)日:2007-09-06
申请号:US11799771
申请日:2007-05-03
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号: H01L23/02
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20050285246A1
公开(公告)日:2005-12-29
申请号:US11140312
申请日:2005-05-27
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号: H01L23/02 , H01L23/31 , H01L23/367 , H01L23/498 , H01L25/10
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.
摘要翻译: 微电子封装包括具有面,触点和外周边的微电子元件,以及覆盖并与微电子元件的第一面间隔开的柔性基板,柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括暴露在所述柔性基板的表面处并与所述微电子元件电互连的多个导电柱,其中至少一个所述导电柱设置在所述柔性基板的外部区域中,并且柔性层设置在所述柔性基板之间 微电子元件和柔性基板的第一面,其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的支撑元件,由此支撑元件覆盖在柔性基板的外部区域上。
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公开(公告)号:US07453157B2
公开(公告)日:2008-11-18
申请号:US11140312
申请日:2005-05-27
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译: 微电子封装包括具有面,触点和外周边的微电子元件,以及覆盖并与微电子元件的第一面间隔开的柔性基板,柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱,其暴露在所述柔性基板的表面处并与所述微电子元件电互连,其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中,并且设置柔性层 在微电子元件的第一面和柔性基板之间,其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料,由此封装模具材料覆盖在柔性基板的外部区域上。
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公开(公告)号:US08329581B2
公开(公告)日:2012-12-11
申请号:US13183122
申请日:2011-07-14
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号: H01L21/44
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US07999397B2
公开(公告)日:2011-08-16
申请号:US12789683
申请日:2010-05-28
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20110269272A1
公开(公告)日:2011-11-03
申请号:US13183122
申请日:2011-07-14
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号: H01L21/56
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20100258956A1
公开(公告)日:2010-10-14
申请号:US12789683
申请日:2010-05-28
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号: H01L23/48
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US07745943B2
公开(公告)日:2010-06-29
申请号:US11799771
申请日:2007-05-03
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20080185705A1
公开(公告)日:2008-08-07
申请号:US11895191
申请日:2007-08-23
申请人: Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
发明人: Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
IPC分类号: H01L23/48
CPC分类号: H01L23/4985 , H01L23/49811 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L24/48 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1357 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83194 , H01L2224/83365 , H01L2224/83385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.
摘要翻译: 微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板,从第一表面突出的导电柱和在第二表面可接触的导电端子,至少一些导电端子 并且所述导电柱电互连,并且所述导电端子中的至少一些偏离所述导电柱。 柔性基板的第一表面与微电子元件的第一面并置,使得导电柱从柔性基板朝向微电子元件的第一面突出。 导电柱与微电子元件的触点电互连,并且至少一些导电端子可相对于微电子元件移动。
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公开(公告)号:US07268426B2
公开(公告)日:2007-09-11
申请号:US10783314
申请日:2004-02-20
申请人: Michael Warner , Lee Smith , Belgacem Haba , Glenn Urbish , Masud Beroz , Teck-Gyu Kang
发明人: Michael Warner , Lee Smith , Belgacem Haba , Glenn Urbish , Masud Beroz , Teck-Gyu Kang
CPC分类号: G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/12105 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45099 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2224/85399 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H2009/0019 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.
摘要翻译: 封装的半导体芯片包括诸如具有大导热体的芯片载体的特征,其可以焊接到电路板上,以便为电路板提供增强的导热性和电磁屏蔽,以及导电外壳,其部分地或完全地围绕 封装芯片提供额外的散热和屏蔽。 封装单元可以包括有源半导体芯片和无源元件,期望地包括芯片形式,其包括电阻器和电容器。 电感器可以全部或部分地设置在芯片载体上。
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