公开(公告)号：US6046901A

公开(公告)日：2000-04-04

申请号：US72196

申请日：1998-05-04

Applicant: Benjamin R. Davis ,  Brian A. Webb

Inventor： Benjamin R. Davis ,  Brian A. Webb

IPC: H01L23/64 ,  H05K1/03 ,  H05K1/16 ,  H05K3/40 ,  H01G4/005 ,  H01G4/228 ,  H05K1/18

CPC classification number: H05K1/162 ,  H01L23/642 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K2201/09309 ,  H05K3/403

Abstract: An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).

Abstract translation: 电子组件（10）包括具有两个主表面（12,15）和一对电极（13,14）的片状电容器（11）。 多个导电迹线（20-23,25-28）形成在主表面的一个（12）上。 多个导电迹线中的一些电耦合到第一电极（14），并且多个导电迹线中的一些耦合到该对电极的第二电极（14）。 电子电路元件（16,17,18）耦合到多个导电迹线（20-23,25-28），从而形成电子组件（10）。

公开(公告)号：US6088215A

公开(公告)日：2000-07-11

申请号：US963492

申请日：1997-11-03

Applicant: Brian A. Webb ,  Benjamin R. Davis

Inventor： Brian A. Webb ,  Benjamin R. Davis

IPC: H01G4/232 ,  H05K3/32 ,  H01G4/228 ,  H01G4/30

CPC classification number: H01G4/232 ,  H05K3/328

Abstract: A capacitor (30) compatible with wirebonding processes and a method for manufacturing the capacitor (30). The capacitor (30) includes a first plurality of conductive layers and a second plurality of conductive layers spaced apart by a plurality of dielectric layers. The first plurality of conductive layers is electrically connected to a peripheral contact (74) of the capacitor (30). The second plurality of conductive layers is electrically connected to an interior portion of the capacitor (30). The first plurality of conductive layers is interleaved with the second plurality of conductive layers.

Abstract translation: 与引线键合工艺兼容的电容器（30）和用于制造电容器（30）的方法。 电容器（30）包括第一多个导电层和由多个电介质层隔开的第二多个导电层。 第一多个导电层电连接到电容器（30）的周边触点（74）。 第二多个导电层电连接到电容器（30）的内​​部。 第一多个导电层与第二多个导电层交错。

公开(公告)号：US5475778A

公开(公告)日：1995-12-12

申请号：US139181

申请日：1993-10-21

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: G02B6/42 ,  H04B10/12 ,  H04B10/13 ,  H04B10/135 ,  H04B10/14 ,  G02B6/28 ,  B29D11/00

CPC classification number: G02B6/4249

Abstract: A smart optical connector (100) sends and recieves optical signals over optical fibers (200, 202). The smart otical connector (100) is capable of converting electrical signals to optical signals for transmission, and capable of converting optical signals to electrical signals for reception. Addtionally, the smart optical connector (100) comprises circuitry (217) for modifying the format of the electrical signals-to provide compatibility between various equiptment (414, 416, 418) which require differing formats.

Abstract translation: 智能光连接器（100）通过光纤（200,202）发送和接收光信号。 智能连接器（100）能够将电信号转换成光信号进行传输，并能将光信号转换成电信号进行接收。 另外，智能光连接器（100）包括用于修改电信号的格式的电路（217），以提供需要不同格式的各种等式（414,416,418）之间的兼容性。

公开(公告)号：US5808325A

公开(公告)日：1998-09-15

申请号：US671864

申请日：1996-06-28

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L23/28 ,  H01L23/48 ,  H01L25/16 ,  H01L33/58 ,  H01L33/62 ,  H01S5/00 ,  H01S5/022 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01S5/02244 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L33/58 ,  H01S5/02228

Abstract: A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.

Abstract translation: 封装组件（31）具有包括定位凸缘（30）的引线框架（10），安装在引线框架上的诸如激光二极管的光发射器（22）以及封装光传输器和一部分 引线框架的定位凸缘设置在封装的外部。 定位法兰用作参考基准，用于在制造过程中对准光发射机的相对高度和横向位置。 此外，当安装到光学终端产品中的其他部件时，定位凸缘用作将包装组件与其他标准光学部件配合的参考基准。

公开(公告)号：US4903401A

公开(公告)日：1990-02-27

申请号：US331972

申请日：1989-04-03

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L21/00

CPC classification number: H01L21/67144 ,  Y10T29/49121 ,  Y10T428/12896

Abstract: A method of making a leadframe useful in packaging semiconductor devices eliminates silver bleed between adjacent leads of the leadframe. This is accomplished by leaving excess leadframe material along the edges of the leads prior to silver plating the flag area and the portion of the leads adjacent to the flag area. After the plating operation, this excess leadframe material is removed thereby leaving silver free leads which will be exposed outside of a resulting encapsulated semiconductor package.

Abstract translation: 制造用于封装半导体器件的引线框架的方法消除引线框架的相邻引线之间的银渗漏。 这是通过在镀银标志区域和引线的与标记区域相邻的部分进行镀银之前沿引线的边缘留下多余的引线框材料而实现的。 在电镀操作之后，去除这种多余的引线框架材料，从而留下将被暴露在所得封装的半导体封装外部的无银引线。

公开(公告)号：US5973337A

公开(公告)日：1999-10-26

申请号：US917121

申请日：1997-08-25

Applicant: James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

Inventor： James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

IPC: H01L23/28 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L23/315 ,  H01L23/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107

Abstract: A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).

Abstract translation: 耦合到球栅阵列基板（11）并由光学透射材料（29,31）封装的半导体器件（10）。 球栅阵列基板（11）在顶表面上具有导电互连（14）和半导体接收区（17）以及底表面上的焊盘（13）。 光电子部件（24）安装在半导体接收区域（17）上并用光学透射材料（29,31）封装。 在焊盘（13）上形成焊球（18）。

公开(公告)号：US5590232A

公开(公告)日：1996-12-31

申请号：US390209

申请日：1995-02-16

Applicant: Robert M. Wentworth ,  David Galloway ,  Garland D. Cotney ,  Brian A. Webb

Inventor： Robert M. Wentworth ,  David Galloway ,  Garland D. Cotney ,  Brian A. Webb

IPC: G02B6/42 ,  G02B6/00 ,  G02B6/36

CPC classification number: G02B6/4292 ,  G02B6/4249

Abstract: An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.

Abstract translation: 一种光学封装，包括壳体，其限定安装区域，其中形成在所述壳体中的引线各自具有在所述安装区域中的第一端和在所述壳体外部的第二端。 其上具有光子器件的半导体裸片安装在安装区域中并电连接到引线。 光子器件的有源光区域可通过安装区域访问。 光纤对准结构安装在用于接收光纤的安装区域中，并将光纤与光子器件的有源光区域对准。

公开(公告)号：US20080125228A1

公开(公告)日：2008-05-29

申请号：US11606717

申请日：2006-11-29

Applicant: Scott B. Ware ,  Brian A. Webb

Inventor： Scott B. Ware ,  Brian A. Webb

IPC: A63F9/24

CPC classification number: A63F13/828 ,  A63F13/10 ,  A63F13/12 ,  A63F13/35

Abstract: The evaluation of players in the context of a fantasy sports league is disclosed. In order to evaluate whether a fantasy team owner should add one player to the starting lineup of the team and drop another, player stat predictions are first used to predict end-of-season stats for the current starting lineup of a team. Historical and current league stat/point functions may then be used to determine how many points the team is expected to earn during the course of a full season based on the predicted end-of-season stats. This same methodology is then applied to a proposed revised lineup to determine how many points the revised team is expected to earn during the course of a full season. The difference between the projected point totals for the current team and the revised team are an indication of the value of this specific transaction to this specific team.

Abstract translation: 披露了在幻想运动联盟背景下对球员的评价。 为了评估一个幻想团队所有者是否应该将一名球员添加到球队的首发阵容中，并且放弃另一个球员，球员统计预测首先用于预测球队当前阵容的季末统计数据。 根据预测的季末统计数据，历史和现有的联赛统计/积分函数可用于确定团队在整个赛季期间预计将获得多少积分。 然后，将相同的方法应用于拟议的修订阵容，以确定在整个赛季期间修改后的球队预计将获得多少积分。 现有团队和经过修订的团队的预计总点数之间的差异，表明了这个特定团队的具体交易价值。

公开(公告)号：US06171877B2

公开(公告)日：2001-01-09

申请号：US09099022

申请日：1998-06-17

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L2100

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/02228 ,  H01S5/02244 ,  H01L2924/00012

Abstract: A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.

Abstract translation: 包装组件（31）具有包括定位凸缘（30）的引线框架（10），安装在引线框架上的诸如激光二极管的光发射器（22）以及包围光发送器和一部分 引线框架的定位凸缘设置在封装的外部。 定位法兰用作参考基准，用于在制造过程中对准光发射机的相对高度和横向位置。 此外，当安装到光学终端产品中的其他部件时，定位凸缘用作将包装组件与其他标准光学部件配合的参考基准。

公开(公告)号：US5963782A

公开(公告)日：1999-10-05

申请号：US904989

申请日：1997-08-01

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44 ,  G01R31/26 ,  H01L21/48 ,  H01L21/50 ,  H01L21/66

CPC classification number: H01L23/3107 ,  H01L23/4951 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/181

Abstract: A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).

Abstract translation: 可以通过提供引线框架（12）来制造半导体部件，引线框架（12）具有引线（13）和与至少一个引线（13）基本上共面的标志（14），其中标志（14）具有孔（15）。 电子基板（11）粘附到标志（14），其中电子基板（11）的周边具有接合焊盘（21），其中接合焊盘（21）面向标志（14），其中电子基板 （11）覆盖所述孔（15），并且其中所述标记（14）不在所述接合焊盘（21）上。 接下来，焊盘（21）被引线接合到引线（13），然后电子基板（11）和引线框架（12）用包装材料（17）封装，其中包装材料（17）具有开口 （23），并且没有覆盖标记（14）中的孔（15）。