公开(公告)号：US08052521B2

公开(公告)日：2011-11-08

申请号：US12163754

申请日：2008-06-27

Applicant: Brian A. Webb ,  Miles A. Libbey, IV

Inventor： Brian A. Webb ,  Miles A. Libbey, IV

IPC: A63F13/12

CPC classification number: A63F13/85 ,  A63F13/12 ,  A63F13/65 ,  A63F13/79 ,  A63F13/828 ,  A63F2300/407 ,  G06Q40/04

Abstract: Techniques are provide for linking actions in an online fantasy sports game to a currency balance associated with a user of the game. The techniques adjust the balance by a first quantity in response to a sports player action, where the first quantity is based upon the player action, and adjust the balance by a second quantity in response to transfer of a sports player to or from a fantasy sports team associated with the user, where the second quantity is based upon a value of the sports player; and, prevent transfer of the sports player to the fantasy sports team in response to the second quantity being greater than the balance. The currency balance may be increased by the first quantity in response to the sports player action. The sports player action may include scoring a number of game points, and the first quantity may be based upon the number of game points.

Abstract translation: 提供了将在线幻想运动游戏中的动作与与游戏用户相关联的货币平衡的技术。 所述技术根据运动员的动作来调节平衡，其中第一数量是基于玩家动作的第一数量，并且响应于运动员转移到幻想运动或从幻想运动转移到第二数量来调整余额第二数量 与用户相关联的团队，其中第二数量基于运动员的价值; 并且防止体育运动员响应于第二数量大于平衡而转移到幻想运动队。 根据体育选手的行动，货币余额可能会增加第一个数量。 运动员动作可以包括对多个游戏点进行评分，并且第一数量可以基于游戏点的数量。

公开(公告)号：US20090325685A1

公开(公告)日：2009-12-31

申请号：US12163754

申请日：2008-06-27

Applicant: Brian A. Webb ,  Miles A. Libbey, IV

Inventor： Brian A. Webb ,  Miles A. Libbey, IV

IPC: A63F9/24

CPC classification number: A63F13/85 ,  A63F13/12 ,  A63F13/65 ,  A63F13/79 ,  A63F13/828 ,  A63F2300/407 ,  G06Q40/04

Abstract: Techniques are provide for linking actions in an online fantasy sports game to a currency balance associated with a user of the game. The techniques adjust the balance by a first quantity in response to a sports player action, where the first quantity is based upon the player action, and adjust the balance by a second quantity in response to transfer of a sports player to or from a fantasy sports team associated with the user, where the second quantity is based upon a value of the sports player; and, prevent transfer of the sports player to the fantasy sports team in response to the second quantity being greater than the balance. The currency balance may be increased by the first quantity in response to the sports player action. The sports player action may include scoring a number of game points, and the first quantity may be based upon the number of game points.

Abstract translation: 提供了将在线幻想运动游戏中的动作与与游戏用户相关联的货币平衡的技术。 所述技术根据运动员的动作来调节平衡，其中第一数量是基于玩家动作的第一数量，并且响应于运动员转移到幻想运动或从幻想运动转移到第二数量来调整余额第二数量 与用户相关联的团队，其中第二数量基于运动员的价值; 并且防止体育运动员响应于第二数量大于平衡而转移到幻想运动队。 根据体育选手的行动，货币余额可能会增加第一个数量。 运动员动作可以包括对多个游戏点进行评分，并且第一数量可以基于游戏点的数量。

公开(公告)号：US6088215A

公开(公告)日：2000-07-11

申请号：US963492

申请日：1997-11-03

Applicant: Brian A. Webb ,  Benjamin R. Davis

Inventor： Brian A. Webb ,  Benjamin R. Davis

IPC: H01G4/232 ,  H05K3/32 ,  H01G4/228 ,  H01G4/30

CPC classification number: H01G4/232 ,  H05K3/328

Abstract: A capacitor (30) compatible with wirebonding processes and a method for manufacturing the capacitor (30). The capacitor (30) includes a first plurality of conductive layers and a second plurality of conductive layers spaced apart by a plurality of dielectric layers. The first plurality of conductive layers is electrically connected to a peripheral contact (74) of the capacitor (30). The second plurality of conductive layers is electrically connected to an interior portion of the capacitor (30). The first plurality of conductive layers is interleaved with the second plurality of conductive layers.

Abstract translation: 与引线键合工艺兼容的电容器（30）和用于制造电容器（30）的方法。 电容器（30）包括第一多个导电层和由多个电介质层隔开的第二多个导电层。 第一多个导电层电连接到电容器（30）的周边触点（74）。 第二多个导电层电连接到电容器（30）的内​​部。 第一多个导电层与第二多个导电层交错。

公开(公告)号：US6051848A

公开(公告)日：2000-04-18

申请号：US033166

申请日：1998-03-02

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L31/0203 ,  H01L31/167 ,  H01L33/54 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/58 ,  H01L31/0203 ,  H01L31/167 ,  H01L2224/48247 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L33/54 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02248 ,  H01S5/02288 ,  H01S5/06825 ,  H01S5/183

Abstract: An optical device package (18) includes an optical transmitter die (10) encapsulated within mold material (20). The mold material (20) allows light emitted from the optical transmitter (10) to pass through the package (18) and can have a lens pattern (22) molded therein to focus the light emitted from the optical transmitter. The mold material (20) can also have coupling patterns (32) formed therein to allow a supplemental lens assembly (28) to be coupled thereto so that supplemental lens patterns (30) formed in the supplemental lens assembly (28) can focus the light emitted from the optical transmitter (10). The optical device package (18) can also include an optical receiver (40) enclosed within the mold material (20) and mounted on a substrate (42) with the optical transmitter (10) to provide a complete optical product in one package (18).

Abstract translation: 光学器件封装（18）包括封装在模具材料（20）内的光学发射器模具（10）。 模具材料（20）允许从光学发射器（10）发射的光通过封装（18）并且可以具有模制在其中的透镜图案（22）以聚焦从光学发射器发射的光。 模具材料（20）还可以具有形成在其中的耦合图案（32），以允许辅助透镜组件（28）与其耦合，使得形成在补充透镜组件（28）中的补充透镜图案（30）可以聚焦光 从光发射器（10）发射。 光学器件封装（18）还可以包括封装在模具材料（20）内的光学接收器（40），并且安装在具有光学发射器（10）的基底（42）上以在一个封装（18）中提供完整的光学产品 ）。

公开(公告)号：US5821692A

公开(公告)日：1998-10-13

申请号：US757002

申请日：1996-11-26

Applicant: Stephen P. Rogers ,  Franky So ,  Song Q. Shi ,  Brian A. Webb

Inventor： Stephen P. Rogers ,  Franky So ,  Song Q. Shi ,  Brian A. Webb

IPC: H01L51/52 ,  H05B33/04 ,  H01J1/62

CPC classification number: H05B33/04 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/529

Abstract: An organic electroluminescent device array encapsulating package including an organic electroluminescent device on a supporting substrate. A cover having a rim engaging the supporting substrate is spaced from and hermetically encloses the organic electroluminescent device. A dielectric liquid having benign chemical properties fills the space between the cover and the organic electroluminescent device, providing both an efficient medium for heat transmission and an effective barrier to oxygen and moisture.

Abstract translation: 一种在支撑衬底上包括有机电致发光器件的有机电致发光器件阵列封装封装。 具有接合支撑衬底的边缘的盖子与气密地包围有机电致发光器件隔开。 具有良好化学性质的介电液体填充了盖和有机电致发光器件之间的空间，为传热提供了有效的介质和有效的氧气和湿气屏障。

公开(公告)号：US5413965A

公开(公告)日：1995-05-09

申请号：US119555

申请日：1993-09-13

Applicant: Brian A. Webb ,  Robert M. Wentworth

Inventor： Brian A. Webb ,  Robert M. Wentworth

IPC: H01L21/54 ,  H01L23/22 ,  H01L23/42 ,  H01L21/56

CPC classification number: H01L23/22 ,  H01L21/54 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49146

Abstract: A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

Abstract translation: 一种含液体微电子器件封装的制造方法。 该方法包括以下步骤：提供（32）包括微电子器件（22）的底座（16）和围绕基座（16）围绕设置的密封区域，提供（34）盖子（12）并提供（34）密封剂 （14）设置在基部（16）和盖（12）之间。 该方法还包括以下步骤：将基底（16），密封剂（14）和盖（12）浸入温度高于密封剂活化温度的液体（24）中并保持（38）基底（16）， 密封剂（14）和液体（24）中的盖子（12）足以允许液体（24）进入基部（16）和盖（12）之间的时间，并加热并由此激活密封剂（14） 。 该方法还包括从液体（24）中移除（40）底座（16），盖子（12）和密封剂（14）以提供密封的含液体的微电子器件封装（10）。

公开(公告)号：US5808325A

公开(公告)日：1998-09-15

申请号：US671864

申请日：1996-06-28

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L23/28 ,  H01L23/48 ,  H01L25/16 ,  H01L33/58 ,  H01L33/62 ,  H01S5/00 ,  H01S5/022 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01S5/02244 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L33/58 ,  H01S5/02228

Abstract: A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.

Abstract translation: 封装组件（31）具有包括定位凸缘（30）的引线框架（10），安装在引线框架上的诸如激光二极管的光发射器（22）以及封装光传输器和一部分 引线框架的定位凸缘设置在封装的外部。 定位法兰用作参考基准，用于在制造过程中对准光发射机的相对高度和横向位置。 此外，当安装到光学终端产品中的其他部件时，定位凸缘用作将包装组件与其他标准光学部件配合的参考基准。

公开(公告)号：US4903401A

公开(公告)日：1990-02-27

申请号：US331972

申请日：1989-04-03

Applicant: Brian A. Webb

Inventor： Brian A. Webb

IPC: H01L21/00

CPC classification number: H01L21/67144 ,  Y10T29/49121 ,  Y10T428/12896

Abstract: A method of making a leadframe useful in packaging semiconductor devices eliminates silver bleed between adjacent leads of the leadframe. This is accomplished by leaving excess leadframe material along the edges of the leads prior to silver plating the flag area and the portion of the leads adjacent to the flag area. After the plating operation, this excess leadframe material is removed thereby leaving silver free leads which will be exposed outside of a resulting encapsulated semiconductor package.

Abstract translation: 制造用于封装半导体器件的引线框架的方法消除引线框架的相邻引线之间的银渗漏。 这是通过在镀银标志区域和引线的与标记区域相邻的部分进行镀银之前沿引线的边缘留下多余的引线框材料而实现的。 在电镀操作之后，去除这种多余的引线框架材料，从而留下将被暴露在所得封装的半导体封装外部的无银引线。

公开(公告)号：US6046901A

公开(公告)日：2000-04-04

申请号：US72196

申请日：1998-05-04

Applicant: Benjamin R. Davis ,  Brian A. Webb

Inventor： Benjamin R. Davis ,  Brian A. Webb

IPC: H01L23/64 ,  H05K1/03 ,  H05K1/16 ,  H05K3/40 ,  H01G4/005 ,  H01G4/228 ,  H05K1/18

CPC classification number: H05K1/162 ,  H01L23/642 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K2201/09309 ,  H05K3/403

Abstract: An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).

Abstract translation: 电子组件（10）包括具有两个主表面（12,15）和一对电极（13,14）的片状电容器（11）。 多个导电迹线（20-23,25-28）形成在主表面的一个（12）上。 多个导电迹线中的一些电耦合到第一电极（14），并且多个导电迹线中的一些耦合到该对电极的第二电极（14）。 电子电路元件（16,17,18）耦合到多个导电迹线（20-23,25-28），从而形成电子组件（10）。

公开(公告)号：US5973337A

公开(公告)日：1999-10-26

申请号：US917121

申请日：1997-08-25

Applicant: James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

Inventor： James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

IPC: H01L23/28 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L23/315 ,  H01L23/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107

Abstract: A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).

Abstract translation: 耦合到球栅阵列基板（11）并由光学透射材料（29,31）封装的半导体器件（10）。 球栅阵列基板（11）在顶表面上具有导电互连（14）和半导体接收区（17）以及底表面上的焊盘（13）。 光电子部件（24）安装在半导体接收区域（17）上并用光学透射材料（29,31）封装。 在焊盘（13）上形成焊球（18）。