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公开(公告)号：US08381393B2
公开(公告)日：2013-02-26
申请号：US12655406
申请日：2009-12-30
IPC分类号： H01K3/10
CPC分类号： H01L23/49833 , H01L23/49811 , H01L23/49822 , H01L23/4985 , H01L24/16 , H01L24/81 , H01L2224/81192 , H01L2224/81801 , H01L2924/01078 , H01L2924/14 , Y10T29/49117 , Y10T29/49124 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括将贴片附接到插入器，在插入器的顶表面上方和顶部表面上形成至少一个互连结构; 以及将柔性连接器附接到所述至少一个互连结构。
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2.发明授权Microelectronic package and method for a compression-based mid-level interconnect 有权用于基于压缩的中级互连的微电子封装和方法公开(公告)号：US08278752B2
公开(公告)日：2012-10-02
申请号：US12646854
申请日：2009-12-23
CPC分类号： H01L23/49833 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , Y10T29/49133
摘要： A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233, 234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.
摘要翻译： 微电子封装包括具有第一表面区域（125）的第一衬底（120）和具有第二表面区域（135）的第二衬底（130）。 第一衬底包括在第一表面处具有第一间距（127）的第一组互连（126）和在第二表面（222）处具有第二间距（129）的第二组互连（128）。 第二衬底使用第二组互连件耦合到第一衬底，并且包括具有第三间距（237）的第三组互连（236）和用微孔（240）彼此连接的内部导电层（233,234）。 第一间距小于第二间距，第二间距小于第三间距，第一表面积小于第二表面积。
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公开(公告)号：US20110157808A1
公开(公告)日：2011-06-30
申请号：US12655406
申请日：2009-12-30
CPC分类号： H01L23/49833 , H01L23/49811 , H01L23/49822 , H01L23/4985 , H01L24/16 , H01L24/81 , H01L2224/81192 , H01L2224/81801 , H01L2924/01078 , H01L2924/14 , Y10T29/49117 , Y10T29/49124 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括将贴片附接到插入器，在插入器的顶表面上方和顶部表面上形成至少一个互连结构; 以及将柔性连接器附接到所述至少一个互连结构。
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4.发明申请MICROELECTRONIC PACKAGE AND METHOD FOR A COMPRESSION-BASED MID-LEVEL INTERCONNECT 有权用于基于压缩的中间级互连的微电子封装和方法公开(公告)号：US20110147913A1
公开(公告)日：2011-06-23
申请号：US12646854
申请日：2009-12-23
IPC分类号： H01L23/522 , H01L21/50
CPC分类号： H01L23/49833 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , Y10T29/49133
摘要： A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233,234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.
摘要翻译： 微电子封装包括具有第一表面区域（125）的第一衬底（120）和具有第二表面区域（135）的第二衬底（130）。 第一衬底包括在第一表面处具有第一间距（127）的第一组互连（126）和在第二表面（222）处具有第二间距（129）的第二组互连（128）。 第二衬底使用第二组互连件耦合到第一衬底，并且包括具有第三间距（237）的第三组互连（236）和用微孔（240）彼此连接的内部导电层（233,234）。 第一间距小于第二间距，第二间距小于第三间距，第一表面积小于第二表面积。
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公开(公告)号：US08389337B2
公开(公告)日：2013-03-05
申请号：US12655588
申请日：2009-12-31
IPC分类号： H01L23/60
CPC分类号： H05K1/112 , G06F1/183 , H01L21/561 , H01L21/563 , H01L23/49833 , H01L24/16 , H01L24/81 , H01L2224/73203 , H01L2924/01046 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过热压粘合将贴片结构附接到插入件，在布置在插入件的顶表面上的互连结构的阵列周围形成底部填充物，固化底部填充物，然后将裸片附接到贴片结构。
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公开(公告)号：US20130141859A1
公开(公告)日：2013-06-06
申请号：US13753863
申请日：2013-01-30
CPC分类号： H05K1/112 , G06F1/183 , H01L21/561 , H01L21/563 , H01L23/49833 , H01L24/16 , H01L24/81 , H01L2224/73203 , H01L2924/01046 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过热压粘合将贴片结构附接到插入件，在布置在插入件的顶表面上的互连结构的阵列周围形成底部填充物，固化底部填充物，然后将裸片附接到贴片结构。
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公开(公告)号：US08659171B2
公开(公告)日：2014-02-25
申请号：US13753863
申请日：2013-01-30
IPC分类号： H01L23/52
CPC分类号： H05K1/112 , G06F1/183 , H01L21/561 , H01L21/563 , H01L23/49833 , H01L24/16 , H01L24/81 , H01L2224/73203 , H01L2924/01046 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过热压粘合将贴片结构附接到插入件，在布置在插入件的顶表面上的互连结构的阵列周围形成底部填充物，固化底部填充物，然后将裸片附接到贴片结构。
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公开(公告)号：US07629680B2
公开(公告)日：2009-12-08
申请号：US11387512
申请日：2006-03-22
IPC分类号： H01L23/52
CPC分类号： H05K1/0262 , H05K3/4602 , H05K3/4641 , H05K2201/0919 , H05K2201/0969
摘要： In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed.
摘要翻译： 在一些实施例中，呈现直接电力输送到电子封装中。 在这方面，引入具有设计成与电力电缆物理连接的导电衬底芯的衬底。 还公开并要求保护其他实施例。
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9.发明授权Method of forming a substrate core with embedded capacitor and structures formed thereby 有权用嵌入式电容器形成衬底芯的方法和由此形成的结构公开(公告)号：US09572258B2
公开(公告)日：2017-02-14
申请号：US11027386
申请日：2004-12-30
申请人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
发明人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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10.发明申请公开(公告)号：US20160212272A1
公开(公告)日：2016-07-21
申请号：US14602246
申请日：2015-01-21
CPC分类号： H04M3/567 , G06F3/165 , G06F3/167 , G06T19/006 , H04M3/568 , H04N7/147 , H04N21/41407 , H04N21/42202 , H04N21/439 , H04S1/00 , H04S7/303 , H04S7/304 , H04S2400/11 , H04S2420/01
摘要： A user device for generating a scene, the user device comprising: an object determiner configured to determine an object for the scene, the object being associated with at least one audio signal; a relative position/orientation determiner configured to determine a relative position/orientation between the user device's user and the object; an audio position processor configured to spatially audio signal process the at least one audio signal to generate at least two channel audio signal based on the relative position/orientation.
摘要翻译： 一种用于生成场景的用户设备，所述用户设备包括：对象确定器，被配置为确定所述场景的对象，所述对象与至少一个音频信号相关联; 配置为确定用户设备的用户与对象之间的相对位置/取向的相对位置/方向确定器; 配置为空间音频信号的音频位置处理器处理所述至少一个音频信号以基于所述相对位置/取向产生至少两个声道音频信号。
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