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    METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
    1.
    发明申请
    METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION 有权

    公开(公告)号：US20220320051A1

    公开(公告)日：2022-10-06

    申请号：US17719361

    申请日：2022-04-12

    申请人： Bridgelux, Inc.

    发明人： Wenhui Zhang ,  Tao Tong ,  Zhengqing Gan

    IPC分类号： H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56 ,  H01L33/54

    摘要： Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

    Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
    2.
    发明授权
    Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration 有权

    公开(公告)号：US10381333B2

    公开(公告)日：2019-08-13

    申请号：US16019443

    申请日：2018-06-26

    申请人： Bridgelux, Inc.

    发明人： Wenhui Zhang ,  Tao Tong ,  Zhengqing Gan

    IPC分类号： H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

    摘要： Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

    MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER
    4.
    发明申请
    MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER 有权
    用于去除硅胶闪光层的微珠喷砂工艺

    公开(公告)号：US20130337592A1

    公开(公告)日：2013-12-19

    申请号：US13972887

    申请日：2013-08-21

    申请人： Bridgelux, Inc.

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon

    IPC分类号： H01L33/58

    CPC分类号： H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

    摘要翻译： 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

    Substrate free LED package
    5.
    发明授权
    Substrate free LED package 有权

    公开(公告)号：US10714533B2

    公开(公告)日：2020-07-14

    申请号：US15453856

    申请日：2017-03-08

    申请人： BRIDGELUX, INC.

    发明人： Mike Kwon ,  Gerry Keller ,  Scott West ,  Tao Tong ,  Babak Imangholi

    IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L33/52 ,  H01L33/58 ,  H01L23/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/54 ,  H01L21/56

    摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

    Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
    6.
    发明授权
    Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate 有权

    公开(公告)号：US10325890B2

    公开(公告)日：2019-06-18

    申请号：US15968686

    申请日：2018-05-01

    申请人： Bridgelux, Inc.

    发明人： R. Scott West ,  Tao Tong ,  Mike Kwon ,  Michael Solomensky

    IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/58 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/50

    摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

    SUBSTRATE FREE LED PACKAGE
    8.
    发明申请
    SUBSTRATE FREE LED PACKAGE 审中-公开

    公开(公告)号：US20170244008A1

    公开(公告)日：2017-08-24

    申请号：US15453856

    申请日：2017-03-08

    申请人： BRIDGELUX, INC.

    发明人： Mike Kwon ,  Gerry Keller ,  Scott West ,  Tao Tong ,  Babak Imangholi

    IPC分类号： H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

    摘要： A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

    LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
    9.
    发明申请
    LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION 审中-公开
    包含优化镜头配置的发光二极管阵列的发光组件

    公开(公告)号：US20160204087A1

    公开(公告)日：2016-07-14

    申请号：US15075027

    申请日：2016-03-18

    申请人： Bridgelux, Inc.

    发明人： Wenhui Zhang ,  Tao Tong ,  Zhengqing Gan

    IPC分类号： H01L25/075 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58 ,  H01L33/50

    CPC分类号： H01L25/0753 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00

    摘要： Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

    摘要翻译： 发光组件包括多个发光二极管（LED）管芯，其布置并连接到共同的衬底上以形成具有期望的最佳堆积密度的LED阵列。 LED管芯彼此连接并连接到基板上的着陆焊盘，用于经由互连装置从外部电源接收电力。 组件包括透镜结构，其中每个LED管芯包括设置在其上的光学透镜，其被配置为促进最佳光透射。 每个光学透镜的直径在相应LED芯片的尺寸的约1.5至3倍之间，并且成形为半球形。 圆角片与相邻的光学透镜是一体的并插入在相邻的光学透镜之间，并且在相邻的光学透镜之间提供足够的空间，使得相邻光学透镜的直径彼此不相交。