公开(公告)号：US5594234A

公开(公告)日：1997-01-14

申请号：US337798

申请日：1994-11-14

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Jesse Clark ,  Steven P. Laverde ,  Hai Tran

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Jesse Clark ,  Steven P. Laverde ,  Hai Tran

IPC分类号： H01L23/50 ,  H01L23/495 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K1/0206 ,  H01L23/49503 ,  H01L23/49551 ,  H01L2224/06165 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/341

摘要： The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.

摘要翻译： 本发明是可用于当前生产过程中的单件式深层封闭式引线框架（10）。 单个引线框架（10）具有模具安装焊盘（12），其形成有安装半导体管芯（20）的凹陷或空腔。 翼（14,15,17,18）将管芯焊盘锁定在设备封装（21）中并增加潜在湿气路径（34a）的长度。 芯片焊盘（12）提供模具安装焊盘（12）与外部散热器的直接热接触，从而消除了对封装内部的热段的需要。 暴露的裸片焊盘（12）也可以用作与RF电路接地层的RF接地连接。

公开(公告)号：US06365980B1

公开(公告)日：2002-04-02

申请号：US09513121

申请日：2000-02-25

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

IPC分类号： H01L2348

CPC分类号： H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6655 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device comprising a thermally conductive foil including a chip mount portion having first and second surfaces; an integrated circuit chip attached to said first surface; a body of encapsulation material molded around said chip and said first surface such that it leaves said second surface exposed; and said second surface comprising means for forming thermal contact, thereby creating a path for dissipating thermal energy from said chip. Said means for thermal contact comprise a configuration of said second surface suitable for direct thermal attachment to a heat sink. Alternatively, said means for thermal contact comprise a configuration of said second surface suitable for thermal attachment including solder balls between the chip and the heat sink.

摘要翻译： 一种半导体器件，包括导热箔，其包括具有第一和第二表面的芯片安装部分; 附接到所述第一表面的集成电路芯片; 围绕所述芯片和所述第一表面模制的封装材料体，使得其离开所述第二表面; 并且所述第二表面包括用于形成热接触的装置，由此产生用于从所述芯片消散热能的路径。 所述用于热接触的装置包括适于直接热附接到散热器的所述第二表面的构造。 或者，所述用于热接触的装置包括适于热附接的所述第二表面的构造，包括在芯片和散热器之间的焊球。

公开(公告)号：US06365976B1

公开(公告)日：2002-04-02

申请号：US09511320

申请日：2000-02-23

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis ,  David R. Kee ,  Richard E. Johnson

IPC分类号： H01L2348

CPC分类号： H01L21/4853 ,  H01L21/565 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/85001 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device, especially a Ball Grid Array or Chip Scale Package, comprising an integrated circuit chip having at least one input/output terminal; a body of encapsulation material molded around said chip, forming a generally flat surface including at least one dimple having a suitable size and shape to receive a solder ball or solder paste; and said dimple having an electrically conductive solderable surface connected to said terminal.

摘要翻译： 一种半导体器件，特别是球栅阵列或芯片级封装，包括具有至少一个输入/输出端的集成电路芯片; 围绕所述芯片模制的封装材料体，形成包括具有合适尺寸和形状的至少一个凹坑的大致平坦的表面以接收焊球或焊膏; 并且所述凹坑具有连接到所述端子的导电可焊接表面。

公开(公告)号：US5376909A

公开(公告)日：1994-12-27

申请号：US65691

申请日：1993-05-21

申请人： Stephen R. Nelson ,  Buford H. Carter, Jr. ,  Tammy J. Lahutsky ,  Glen R. Haas ,  Dennis D. Davis ,  Charles W. Suckling ,  Glenn Collinson

发明人： Stephen R. Nelson ,  Buford H. Carter, Jr. ,  Tammy J. Lahutsky ,  Glen R. Haas ,  Dennis D. Davis ,  Charles W. Suckling ,  Glenn Collinson

IPC分类号： H01L23/04 ,  H01L23/02 ,  H01L23/12 ,  H01L23/433 ,  H01L23/495 ,  H01L23/66 ,  H01L23/28

CPC分类号： H01L23/66 ,  H01L23/4334 ,  H01L23/49541 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025

摘要： This is a package [10] for an rf device [11] operable with a characteristic impedance providing a plurality of terminals [12-19] and [101] for effecting circuit connections to the device, the connection between at least one of the terminals and the device being matched in relation to the characteristic impedance. Other devices and methods are also disclosed.

摘要翻译： 这是一种可用于具有提供多个终端[12-19]和[101]的特征阻抗的射频设备[11]的封装[10]，用于实现到该设备的电路连接，至少一个终端 并且该器件相对于特性阻抗匹配。 还公开了其它装置和方法。

公开(公告)号：US06401765B1

公开(公告)日：2002-06-11

申请号：US09643368

申请日：2000-08-22

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis

IPC分类号： B21F4500

CPC分类号： H01L23/49503 ,  H01L21/4842 ,  H01L2924/0002 ,  H01L2924/00

摘要： A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to the first tool for forming a side of the exposed pad, and a third tool coupled to the first tool for forming another side of the exposed pad.

摘要翻译： 一种用于在裸露焊盘中形成特征的模块化工具，其具有位于引线框架中的泄放槽和焊盘表面的边缘之间的焊盘表面，该引线框架包括用于在焊盘表面下形成暴露焊盘的底部的第一工具， 到用于形成暴露焊盘的一侧的第一工具，以及联接到第一工具的第三工具，用于形成暴露焊盘的另一侧。

公开(公告)号：US06211462B1

公开(公告)日：2001-04-03

申请号：US09434867

申请日：1999-11-04

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis

IPC分类号： H01L2302

CPC分类号： H04W8/12 ,  H01L23/3107 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H04W8/06 ,  H04W12/06 ,  H04W12/12 ,  Y02D70/1222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die mount pad is exposed through the package backside and serves both as a ground plane and as a heat spreader. The external leads are flat and extend beyond the package edge so that good solder connections to a printed wiring board can be made and inspected. The lead tips exposed beyond the package further provide a position for mold clamping and for test probing the device.

摘要翻译： 本发明提供了一种用于RF电路的低电感半导体封装，其具有平坦的引线框架，其内部引线向上形成为非常接近管芯安装焊盘。 模具安装垫通过封装背面暴露，并且用作接地平面和散热器。 外部引线是扁平的并且延伸超过封装边缘，使得可以制造和检查与印刷线路板的良好焊接连接。 暴露在封装外的引线尖端还提供了用于模具夹紧和测试探测器件的位置。

公开(公告)号：US06465274B2

公开(公告)日：2002-10-15

申请号：US09862009

申请日：2001-05-21

申请人： Buford H. Carter, Jr. ,  Dennis D. Davis

发明人： Buford H. Carter, Jr. ,  Dennis D. Davis

IPC分类号： H01L2144

CPC分类号： H01L21/4842 ,  H01L23/49503 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for forming a stamped groove in a lead frame including a tool for coining the groove in the lead frame. The tool has a shoulder to control swelling of the lead frame surface near the groove.

公开(公告)号：US6072230A

公开(公告)日：2000-06-06

申请号：US926150

申请日：1997-09-09

申请人： Buford H. Carter, Jr. ,  Jesse E. Clark ,  David R. Kee

发明人： Buford H. Carter, Jr. ,  Jesse E. Clark ,  David R. Kee

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49551 ,  H01L23/49544 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181

摘要： The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.

摘要翻译： 本发明涉及可用于当前半导体器件生产中的单件引线框架。 引线框架具有水平面中的多个段，不同水平面中的芯片安装焊盘以及将所述芯片安装焊盘与所述引线框架连接的另外多个段。 后面的多个段具有被设计为基于固有材料特性而允许弯曲和拉伸超出简单伸长极限的几何形状。 所述引线框架的芯片安装焊盘通过被设计成延伸穿过封装封装而提供与外部导热体或散热器的直接热接触。 暴露的芯片焊盘也可以用作接地连接。