DISPLAY DEVICE
    5.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号:US20130114013A1

    公开(公告)日:2013-05-09

    申请号:US13490978

    申请日:2012-06-07

    IPC分类号: H01L33/08 G02F1/136

    CPC分类号: H01L27/1225 H01L29/7869

    摘要: A display device includes a first substrate, a gate line disposed on the first substrate and including a gate electrode, a gate insulating layer disposed on the gate line, a semiconductor layer disposed on the gate insulating layer, a data line disposed on the semiconductor layer and connected to a source electrode, a drain electrode disposed on the semiconductor layer and facing the source electrode and a passivation layer disposed on the data line, in which the semiconductor layer is formed of an oxide semiconductor including indium, tin, and zinc. The indium is present in an amount of about 5 atomic percent (at %) to about 50 at % , and a ratio of the zinc to the tin is about 1.38 to about 3.88.

    摘要翻译: 显示装置包括:第一基板,设置在第一基板上的栅极线,包括栅电极,设置在栅极线上的栅极绝缘层,设置在栅极绝缘层上的半导体层,设置在半导体层上的数据线 并连接到源电极,设置在半导体层上并面对源电极的漏电极和设置在数据线上的钝化层,其中半导体层由包含铟,锡和锌的氧化物半导体形成。 铟以约5原子%(at%)至约50原子%的量存在,并且锌与锡的比例为约1.38至约3.88。

    OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR
    9.
    发明申请
    OXIDE FOR SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR, SEMICONDUCTOR LAYER OF THIN-FILM TRANSISTOR HAVING SAID OXIDE, AND THIN-FILM TRANSISTOR 审中-公开
    薄膜晶体管半导体层氧化物,具有氧化硅的薄膜晶体管的半导体层和薄膜晶体管

    公开(公告)号:US20130341617A1

    公开(公告)日:2013-12-26

    申请号:US14004020

    申请日:2012-03-08

    IPC分类号: H01L29/12

    摘要: The oxide of the present invention for thin-film transistors is an In—Zn—Sn-based oxide containing In, Zn, and Sn, wherein when the respective contents (atomic %) of metal elements contained in the In—Zn—Sn-based oxide are expressed by [Zn], [Sn], and [In], the In—Zn—Sn-based oxide fulfills the following expressions (2) and (4) when [In]/([In]+[Sn])≦0.5; or the following expressions (1), (3), and (4) when [In]/([In]+[Sn])≧0.5. [In]/([In]+[Zn]+[Sn])≦0.3 - - - (1), [In]/([In]+[Zn]+[Sn])≦1.4×{[Zn]/([Zn]+[Sn])}−0.5 - - - (2), [Zn]/([In]+[Zn]+[Sn])≦0.83 - - - (3), and 0.1≦[In]/([In]+[Zn]+[Sn]) - - - (4). According to the present invention, oxide thin films for thin-film transistors can be obtained, which provide TFTs with excellent switching characteristics, and which have high sputtering rate in the sputtering and properly controlled etching rate in the wet etching.

    摘要翻译: 用于薄膜晶体管的本发明的氧化物是含有In,Zn和Sn的In-Zn-Sn系氧化物,其中,当In-Zn-Sn系中含有的金属元素的含量(原子% 当[In] /([In] + [Sn])[Zn],[In] + [Sn]表示[Zn],[Sn]和[In]时,In-Zn-Sn系氧化物满足下述(2) ])@ 0.5; 或[In] /([In] + [Sn])> = 0.5时的以下表达式(1),(3)和(4)。 [In] + [Zn] + [Sn])@ 0.3 - - - (1),[In] /([In] + [Zn] + [Sn])@ 1.4×{[Zn] /([Zn]+[Sn])}-0.5 - - - (2),[Zn] /([In] + [Zn] + [Sn])@ 0.83 - - - (3) In] /([In] + [Zn] + [Sn]) - - - (4)。 根据本发明,可以获得用于薄膜晶体管的氧化物薄膜,其提供具有优异的开关特性的TFT,并且在溅射中具有高溅射速率并且在湿蚀刻中具有适当控制的蚀刻速率。