-
1.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLANARITY CONTROL AND METHOD OF MANUFACTURE THEREOF 有权具有平面控制的集成电路包装系统及其制造方法公开(公告)号：US20130099367A1
公开(公告)日：2013-04-25
申请号：US13526802
申请日：2012-06-19
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L21/568 , H01L21/4832 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/73 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , Y10T29/4921 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation.
摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有部分去除部分的引线框架，其包括：导体图案，其具有在引线框架的顶部框架表面上的下表面，接触突起和在下表面上的支撑引线 导电图案，用于在封装工艺期间支撑引线框架的部分去除部分的支撑引线以及接触突起的底表面上的接触焊盘; 在导电图案上方安装集成电路管芯; 在集成电路管芯和导电图案上施加封装，导电图案的下表面从封装暴露; 以及去除所述引线框架的至少一部分以形成接触引线并暴露所述封装的底表面。
-
2.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND METHOD OF MANUFACTURE THEREOF 有权具有岛屿终端的集成电路包装系统及其制造方法公开(公告)号：US20120018866A1
公开(公告)日：2012-01-26
申请号：US13188456
申请日：2011-07-21
申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
发明人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.
摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。
-
3.发明授权Integrated circuit packaging system with planarity control and method of manufacture thereof 有权具有平面度控制的集成电路封装系统及其制造方法公开(公告)号：US09293351B2
公开(公告)日：2016-03-22
申请号：US13526802
申请日：2012-06-19
IPC分类号： H01L21/44 , H01L21/48 , H01L21/56 , H01L23/495
CPC分类号： H01L21/568 , H01L21/4832 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/73 , H01L2224/16245 , H01L2224/32145 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , Y10T29/4921 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation.
摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有部分去除部分的引线框架，其包括：导体图案，其具有在引线框架的顶部框架表面上的下表面，接触突起和在下表面上的支撑引线 导电图案，用于在封装工艺期间支撑引线框架的部分去除部分的支撑引线以及接触突起的底表面上的接触焊盘; 在导电图案上方安装集成电路管芯; 在集成电路管芯和导电图案上施加封装，导电图案的下表面从封装暴露; 以及去除所述引线框架的至少一部分以形成接触引线并暴露所述封装的底表面。
-
4.发明授权公开(公告)号：US08802501B2
公开(公告)日：2014-08-12
申请号：US13188456
申请日：2011-07-21
申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
发明人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
IPC分类号： H01L21/48
CPC分类号： H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.
摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。
-
5.发明授权Integrated circuit packaging system with leadframe and method of manufacture thereof 有权具有引线框的集成电路封装系统及其制造方法公开(公告)号：US09190349B1
公开(公告)日：2015-11-17
申请号：US13930261
申请日：2013-06-28
IPC分类号： H01L21/00 , H01L23/28 , H01L23/495 , H01L23/00
CPC分类号： H01L21/4828 , H01L21/4825 , H01L23/49517 , H01L23/49541 , H01L23/49548 , H01L24/81 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit packaging system and method of manufacture thereof including: providing an unplated leadframe having a contact protrusion; depositing a solder resist on the contact protrusion; forming a contact pad and traces by etching the unplated leadframe; applying a trace protection layer on the contact pad and the traces; removing the solder resist; forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and depositing an external connector directly on the top surface of the contact pad.
摘要翻译： 一种集成电路封装系统及其制造方法，包括：提供具有接触突起的未平坦化的引线框架; 在所述接触突起上沉积阻焊剂; 通过蚀刻未镀层的引线框形成接触焊盘和迹线; 在接触焊盘和迹线上施加迹线保护层; 去除阻焊剂; 通过将所述接触焊盘的顶表面蚀刻到所述迹线保护层的顶表面下方的凹陷距离，在所述迹线保护层中形成凹陷; 以及将外部连接器直接沉积在接触垫的顶表面上。
-
6.发明授权Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof 有权具有模制网格阵列机构的集成电路封装系统及其制造方法公开(公告)号：US08987064B2
公开(公告)日：2015-03-24
申请号：US13740151
申请日：2013-01-11
IPC分类号： H01L21/00 , H01L23/48 , H01L21/56 , H01L23/495 , H01L21/48
CPC分类号： H01L21/56 , H01L21/4832 , H01L21/563 , H01L21/565 , H01L23/3107 , H01L23/4951 , H01L23/49582 , H01L25/105 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an insulation cover on the lead-frame and on the metal connector; connecting an integrated circuit die over the insulation cover; forming a top encapsulation on the integrated circuit die with the peripheral mounting region exposed from the top encapsulation; forming a routing layer, having a conductive land, from the lead-frame; and forming a bottom encapsulation partially encapsulating the routing layer and the insulation cover.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有安装在其上的具有周边安装区域的金属连接器的引线框架; 在引线框架和金属连接器上形成绝缘盖; 在绝缘盖上连接集成电路芯片; 在集成电路芯片上形成顶部封装，其中外围安装区域从顶部封装暴露; 从所述引线框架形成具有导电焊盘的布线层; 以及形成部分地封装所述布线层和所述绝缘盖的底部封装。
-
7.发明授权Integrated circuit packaging system with pad connection and method of manufacture thereof 有权具有垫连接的集成电路封装系统及其制造方法公开(公告)号：US08633063B2
公开(公告)日：2014-01-21
申请号：US13426442
申请日：2012-03-21
CPC分类号： H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/05554 , H01L2224/16245 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/01028 , H01L2924/01046 , H01L2924/01079 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a central lead adjacent to the peripheral lead; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and attaching a heatsink to the central lead under the integrated circuit.
摘要翻译： 一种集成电路封装系统的制造方法，其特征在于，具备：外周引线底面，外周引线顶面，周边引线非水平侧，周边引线水平脊，周边引线导体板等的外周引线， 外围引线水平脊从外围引线非水平侧突出; 形成邻近外围引线的中心引线; 在外围引线顶侧形成第一顶部分布层; 将集成电路连接到第一顶部分布层; 将绝缘层直接施加在第一顶部分配层的底部范围和周边引线水平脊的周边引线脊下侧; 并将散热器附接到集成电路下的中心引线。
-
8.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND LEADFRAME ETCHING AND METHOD OF MANUFACTURE THEREOF 有权具有封装和铅笔蚀刻的集成电路包装系统及其制造方法公开(公告)号：US20130249065A1
公开(公告)日：2013-09-26
申请号：US13425277
申请日：2012-03-20
IPC分类号： H01L23/495 , H01L21/98
CPC分类号： H01L23/3107 , H01L21/4832 , H01L21/568 , H01L23/49548 , H01L23/49582 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2225/1023 , H01L2225/1088 , H01L2225/1094 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting region; applying a mounting structure in the mounting region; mounting an integrated circuit die on the mounting structure; forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure; forming a lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of the integrated circuit die; and removing the mounting structure for exposing the integrated circuit die.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有安装区域的引线框架; 在安装区域中施加安装结构; 将集成电路管芯安装在安装结构上; 在所述集成电路管芯上形成封装并具有封装腔，所述密封腔由所述安装结构形成; 形成具有来自所述引线框架的引线突起的引线，所述引线突起在所述集成电路管芯的水平面下方; 以及去除用于暴露集成电路管芯的安装结构。
-
9.发明授权Integrated circuit packaging system with leads and method of manufacture thereof 有权具有引线的集成电路封装系统及其制造方法公开(公告)号：US08525325B2
公开(公告)日：2013-09-03
申请号：US13326090
申请日：2011-12-14
IPC分类号： H01L23/10
CPC分类号： H01L23/4334 , H01L21/4832 , H01L23/3107 , H01L23/49517 , H01L23/49575 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/85 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85 , H01L2224/96 , H01L2225/0651 , H01L2225/06558 , H01L2225/06568 , H01L2225/1029 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead; forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead; mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side; forming an encapsulation directly on the inactive side and the interior top side; and forming an insulation layer directly on the active side and a portion of the interior bottom side.
摘要翻译： 一种集成电路封装系统的制造方法，包括：形成引线; 形成具有内部顶侧和内底侧的内部导电层，内部底侧直接在引线上; 将集成电路安装在引线上，该集成电路具有无效侧和有源侧; 直接在非活动侧和内侧顶侧形成封装; 以及直接在活性侧和内底侧的一部分上形成绝缘层。
-
10.发明授权Integrated circuit packaging system with lead encapsulation and method of manufacture thereof 有权具有铅封装的集成电路封装系统及其制造方法公开(公告)号：US08519518B2
公开(公告)日：2013-08-27
申请号：US12890409
申请日：2010-09-24
IPC分类号： H01L23/495
CPC分类号： H01L21/4832 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85439 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
摘要翻译： 一种集成电路封装系统的制造方法，包括：形成封装焊盘; 在所述封装焊盘附近形成引线，所述引线在引线主体顶侧具有孔和从引线非水平侧突出的引线脊; 在封装桨上安装集成电路; 将电连接器连接到引线和集成电路; 并在孔内形成填充层。
-
-
-
-
-
-
-
-
-
搜索结果
398 条记录 (耗时 0.032 秒)
