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公开(公告)号：US11792917B2
公开(公告)日：2023-10-17
申请号：US17694070
申请日：2022-03-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
CPC classification number: H05K1/0231 , H01L25/162 , H05K1/0225 , H05K1/148 , H05K2201/09227 , H05K2201/1003 , H05K2201/1006 , H05K2201/10015 , H05K2201/10378 , H05K2201/10545
Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.
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公开(公告)号：US20150305149A1
公开(公告)日：2015-10-22
申请号：US14688881
申请日：2015-04-16
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Shoji Matsumoto , Seiji Hayashi
IPC: H05K1/03 , H01B3/40 , H05K1/02 , H01L23/498 , H05K1/18
CPC classification number: H01B3/40 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2224/73204 , H05K1/0231 , H05K3/284 , H05K3/3436 , H05K2201/0209 , H05K2201/10977
Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.
Abstract translation: 印刷电路板具有安装在印刷线路板上的印刷线路板和半导体封装。 印刷线路板和半导体封装与多个焊球连接。 覆盖多个焊球的底部填充材料填充在印刷线路板和半导体封装之间。 底部填充材料的相对介电常数为8.6以上且54.4以下。 因此，在不增加安装面积的情况下，减小了在面外方向的布线中产生的串扰噪声。
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公开(公告)号：US20140305688A1
公开(公告)日：2014-10-16
申请号：US14250211
申请日：2014-04-10
Applicant: CANON KABUSHIKI KAISHA
Inventor： Shoji Matsumoto , Seiji Hayashi , Takuya Kondo
CPC classification number: H05K1/115 , H05K1/0251 , H05K2201/096 , H05K2201/0979 , H05K2201/10545
Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.
Abstract translation: 印刷布线板包括：第一导电层，与第一导电层相对配置的间隙的第二导电层，第三导电层，第一通孔导体和第二通路导体以及第三信号布线图案。 第一信号布线图案布置在第一导电层上，第二信号布线图案布置在第二导电层上，第三信号布线图案布置在第三导电层上。 第三导电层通过绝缘层布置在第一导电层和第二导电层之间。 布置成相互相邻的第一通孔导体和第二通孔导体将第一信号布线图案连接到第二信号布线图案。 第三信号布线图案将第一通孔导体连接到第二通孔导体。
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公开(公告)号：US20230283890A1
公开(公告)日：2023-09-07
申请号：US18316253
申请日：2023-05-12
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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公开(公告)号：US20180211743A1
公开(公告)日：2018-07-26
申请号：US15924897
申请日：2018-03-19
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Shoji Matsumoto , Seiji Hayashi
IPC: H01B3/40 , H01L23/498 , H05K3/28 , H05K3/34 , H05K1/02
Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.
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Patent Agency Ranking
公开(公告)号：US09560758B2
公开(公告)日：2017-01-31
申请号：US14250211
申请日：2014-04-10
Applicant: CANON KABUSHIKI KAISHA
Inventor： Shoji Matsumoto , Seiji Hayashi , Takuya Kondo
CPC classification number: H05K1/115 , H05K1/0251 , H05K2201/096 , H05K2201/0979 , H05K2201/10545
Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.
Abstract translation: 印刷布线板包括：第一导电层，与第一导电层相对配置的间隙的第二导电层，第三导电层，第一通孔导体和第二通孔导体以及第三信号布线图案。 第一信号布线图案布置在第一导电层上，第二信号布线图案布置在第二导电层上，第三信号布线图案布置在第三导电层上。 第三导电层通过绝缘层布置在第一导电层和第二导电层之间。 布置成相互相邻的第一通孔导体和第二通孔导体将第一信号布线图案连接到第二信号布线图案。 第三信号布线图案将第一通孔导体连接到第二通孔导体。
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公开(公告)号：US09192044B2
公开(公告)日：2015-11-17
申请号：US13862038
申请日：2013-04-12
Applicant: CANON KABUSHIKI KAISHA
Inventor： Seiji Hayashi , Takuya Kondo , Shoji Matsumoto
CPC classification number: H05K1/0216 , H01L23/49827 , H01L23/49838 , H01L2224/48227 , H05K1/0228 , H05K1/0242 , H05K1/0298 , H05K1/11 , H05K1/114 , H05K1/116 , H05K1/14 , H05K1/141 , H05K1/162 , H05K1/18 , H05K2201/0939 , H05K2201/09418 , H05K2201/09454 , H05K2201/09463 , H05K2201/09636 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734
Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.
Abstract translation: 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。
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公开(公告)号：US20220321781A1
公开(公告)日：2022-10-06
申请号：US17703440
申请日：2022-03-24
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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公开(公告)号：US20220304144A1
公开(公告)日：2022-09-22
申请号：US17694070
申请日：2022-03-14
Applicant: CANON KABUSHIKI KAISHA
Inventor： Takuya Kondo , Takashi Numagi , Nobuaki Yamashita
Abstract: An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.
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公开(公告)号：US12219246B2
公开(公告)日：2025-02-04
申请号：US18316253
申请日：2023-05-12
Applicant: CANON KABUSHIKI KAISHA
Inventor： Nobuaki Yamashita , Takuya Kondo , Takashi Numagi
Abstract: An electric circuit includes a first power-supply line, a second power-supply line, a ground line, a first circuit, a second circuit, an RC series circuit, a capacitor, and a noise filter. The first circuit is configured to be electrically connected to the first power-supply line via a first power-supply terminal and electrically connected to the ground line via a first ground terminal. The second circuit is configured to be electrically connected to the second power-supply line via a second power-supply terminal and electrically connected to the ground line via a second ground terminal. The RC series circuit is disposed between the first power-supply terminal and the first ground terminal. The capacitor is disposed between the second power-supply terminal and the second ground terminal. The noise filter is disposed between the first power-supply line and the second power-supply line.
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