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公开(公告)号：US09713264B2
公开(公告)日：2017-07-18
申请号：US14576107
申请日：2014-12-18
申请人： Intel Corporation
CPC分类号： H05K3/0082 , H05K1/116 , H05K3/422 , H05K3/424 , H05K3/4647 , H05K3/4679 , H05K2201/09463 , H05K2201/09854 , H05K2203/0505
摘要： A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.
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2.发明授权公开(公告)号：US09521747B2
公开(公告)日：2016-12-13
申请号：US14363823
申请日：2012-12-14
发明人： Michael Rasp , Konrad Wagner
CPC分类号： H05K1/0296 , F21V19/0005 , F21V19/003 , F21Y2101/00 , F21Y2115/10 , H01L2224/48091 , H01L2224/73265 , H05K1/0268 , H05K1/05 , H05K1/115 , H05K3/0061 , H05K2201/09463 , H05K2201/0949 , H05K2201/09663 , H05K2201/10106 , H05K2201/10409 , H05K2201/10886 , H05K2203/162 , H05K2203/173 , H01L2924/00014
摘要： A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out.
摘要翻译： 连接板包括至少一个切口，用于将连接板固定到安装板和彼此电隔离的多个接触表面，其中当连接板通过紧固件处于紧固状态时，接触表面彼此电连接 延伸穿过切口。
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公开(公告)号：US09192044B2
公开(公告)日：2015-11-17
申请号：US13862038
申请日：2013-04-12
发明人： Seiji Hayashi , Takuya Kondo , Shoji Matsumoto
CPC分类号： H05K1/0216 , H01L23/49827 , H01L23/49838 , H01L2224/48227 , H05K1/0228 , H05K1/0242 , H05K1/0298 , H05K1/11 , H05K1/114 , H05K1/116 , H05K1/14 , H05K1/141 , H05K1/162 , H05K1/18 , H05K2201/0939 , H05K2201/09418 , H05K2201/09454 , H05K2201/09463 , H05K2201/09636 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734
摘要： First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.
摘要翻译： 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。
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公开(公告)号：US20120090878A1
公开(公告)日：2012-04-19
申请号：US13303769
申请日：2011-11-23
IPC分类号： H05K1/00
CPC分类号： G06F1/182 , G11B5/40 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K1/116 , H05K3/44 , H05K2201/09463 , H05K2201/09554
摘要： A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
摘要翻译： 悬浮基板包括金属基板，形成在金属基板上的绝缘层，具有用于接地端子的开口和形成在绝缘层上的接地导体。 接地端子形成材料放置在接地端子的开口中，形成连接金属基板和接地导体的接地端子。 接地导体不包围用于接地端子的开口的圆周的一部分。
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公开(公告)号：US08097811B2
公开(公告)日：2012-01-17
申请号：US12062730
申请日：2008-04-04
CPC分类号： G06F1/182 , G11B5/40 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K1/116 , H05K3/44 , H05K2201/09463 , H05K2201/09554
摘要： A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
摘要翻译： 悬浮基板包括金属基板，形成在金属基板上的绝缘层，具有用于接地端子的开口和形成在绝缘层上的接地导体。 接地端子形成材料放置在接地端子的开口中，形成连接金属基板和接地导体的接地端子。 接地导体不包围用于接地端子的开口的圆周的一部分。
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公开(公告)号：US07090132B2
公开(公告)日：2006-08-15
申请号：US10440729
申请日：2003-05-19
IPC分类号： G06K7/10
CPC分类号： G06K7/10584 , G06K7/10722 , G06K7/10801 , G06K7/10861 , G06K7/14 , H05K1/116 , H05K1/18 , H05K3/244 , H05K2201/09072 , H05K2201/09463 , H05K2201/0949 , H05K2201/09645 , H05K2201/09809 , H05K2201/10121
摘要： An optical reader in one embodiment can include a substrate defining an opening and solder pads coupled to the substrate proximate the opening. A laser diode including first, second, and third electrical leads can also be coupled to the substrate. First, second and third solder pads can be provided on the substrate and the first, second, and third electrical leads of the laser diode can be coupled to the first, second, and third solder pads. An optical reader in another embodiment can include a substrate having a first surface and a second surface. A laser diode assembly configured to emit a laser beam can be coupled to the first surface and an illumination assembly that can include light emitting diodes can be coupled to the second surface.
摘要翻译： 在一个实施例中的光学读取器可以包括限定开口的基板和在开口附近耦合到基板的焊盘。 包括第一，第二和第三电引线的激光二极管也可以耦合到衬底。 首先，可以在衬底上提供第二和第三焊盘，并且激光二极管的第一，第二和第三电引线可以耦合到第一，第二和第三焊盘。 在另一实施例中的光学读取器可以包括具有第一表面和第二表面的基底。 被配置为发射激光束的激光二极管组件可以耦合到第一表面，并且可以包括发光二极管的照明组件可以耦合到第二表面。
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7.发明授权Method and apparatus for soldering and soldering land of a printed circuit board 失效用于焊接和焊接印刷电路板的焊盘的方法和装置公开(公告)号：US06471109B2
公开(公告)日：2002-10-29
申请号：US09912311
申请日：2001-07-26
IPC分类号： B23K3702
CPC分类号： B23K1/0016 , B23K2101/42 , H05K1/116 , H05K3/3447 , H05K3/3468 , H05K2201/09463 , H05K2201/09854 , H05K2201/10969
摘要： A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.
摘要翻译： 一对烙铁以预定间隔固定在滑板上。 烙铁一体地移动，以相对于传送带沿矩形方向往复运动。 其中一个烙铁被传送到传送带的工作位置，另一个与传送带分离。 虽然其中一个烙铁焊接电路板，另一个被清洁。 电路板具有插入和焊接金属板的狭缝。 对于狭缝，设置由主焊盘和副焊盘构成的焊接区域。 主槽沿着狭缝的较长一侧形成。 子区域沿着狭缝的较短侧从主体区域延伸。 焊缝不会形成在狭缝周围，因此当电路板浸焊时狭缝不被焊料封闭。
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公开(公告)号：US6045025A
公开(公告)日：2000-04-04
申请号：US014567
申请日：1998-01-28
CPC分类号： B23K1/0016 , H05K1/116 , H05K3/3447 , B23K2201/42 , H05K2201/09463 , H05K2201/09854 , H05K2201/10969 , H05K3/3468
摘要： A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.
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公开(公告)号：US5713127A
公开(公告)日：1998-02-03
申请号：US488259
申请日：1995-06-07
CPC分类号： H05K3/0002 , H05K1/116 , H05K2201/09381 , H05K2201/09463 , H05K2203/056 , Y10T29/49165
摘要： The present invention increases real estate by providing non-annular lands which do not completely encircle the through holes. The non-annular lands are non-annular, that is they do not extend 360.degree. around the through hole. Preferably the non-annular lands contact no more than one side of the through holes thereby providing real estate not otherwise available using conventional lands. The present invention also relates to a method for producing such Non-annular lands.
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公开(公告)号：US5010448A
公开(公告)日：1991-04-23
申请号：US298527
申请日：1989-01-18
申请人： Tadaomi Kobari
发明人： Tadaomi Kobari
CPC分类号： H05K1/116 , H05K3/3447 , H05K2201/09463 , H05K2201/09663 , H05K2201/0969 , H05K3/3468
摘要： A printed circuit board has one or more conductor-deleted portions formed in the lands of a conductor pattern printed on an insulating substrate. The conductor-deleted portions may be one or more slits extending radially from a center hole of each land, one or more holes, or one or more notches. Preferably, the conductor-deleted portions are positioned to be in the direction of alignment of the lands. The conductor-deleted portions reduce the amount of solder adhering to the lands and prevent solder bridges between adjacent lands from forming.
摘要翻译： 印刷电路板具有形成在印刷在绝缘基板上的导体图案的焊盘中的一个或多个导体缺失部分。 导体缺失部分可以是从每个焊盘的中心孔，一个或多个孔或一个或多个凹口径向延伸的一个或多个狭缝。 优选地，导体缺失部分被定位成在焊盘的对准方向上。 导体缺失部分减少焊接到焊盘上的焊料的量，并防止相邻焊盘之间的焊料桥接成形。
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