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    Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
    1.
    发明授权
    Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same 失效
    具有用于栅极去除的特定树脂注入区域设计的模制载体环引线框架和使用其的半导体器件

    公开(公告)号：US5517056A

    公开(公告)日：1996-05-14

    申请号：US129503

    申请日：1993-09-30

    申请人： Charles G. Bigler ,  Alan H. Woosley ,  Michael B. McShane

    发明人： Charles G. Bigler ,  Alan H. Woosley ,  Michael B. McShane

    IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H01L23/02

    CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L2224/49171 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078

    摘要： A leadframe (30) having a novel resin injecting area (44) is disclosed to facilitate and control the removal of a molded gate (18) prior to excising a semiconductor device(70) from a carrier ring (14). The carrier ring has a corner which is on a diagonal with a corner of the package body (12) to form the resin injecting area. The resin injecting area of the leadframe has a hole (48) and an extension bar (50) extending from the hole to connect to a tie bar (36), which supports a die pad (32), inside the package body. The hole in the leadframe is designed for retaining a molded gate. The extension bar is designed to make the removal of a portion of a molded gate easier and more controllable. The semiconductor device can be shipped in the carrier ring with a portion of the molded gate already removed.

    摘要翻译： 公开了一种具有新型树脂注入区域（44）的引线框架（30），用于在将半导体器件（70）从载体环（14）切除之前有助于和控制模制浇口（18）的移除。 承载环具有与包装体（12）的角部对角地形成树脂注入区域的角部。 引线框架的树脂注入区域具有从孔延伸的孔（48）和延伸杆（50），以连接到在包装体内部支撑管芯焊盘（32）的连接杆（36）。 引线框中的孔用于保持模制浇口。 延伸杆被设计成使得模制门的一部分的移除更容易和更可控。 半导体器件可以在已经去除模制栅极的一部分的载体环中运输。

    Method for encapsulating semiconductor devices with package bodies
    2.
    发明授权
    Method for encapsulating semiconductor devices with package bodies 失效
    用封装体封装半导体器件的方法

    公开(公告)号：US5344600A

    公开(公告)日：1994-09-06

    申请号：US931459

    申请日：1992-08-21

    申请人： Michael B. McShane ,  Alan H. Woosley ,  Francis Primeaux

    发明人： Michael B. McShane ,  Alan H. Woosley ,  Francis Primeaux

    IPC分类号： B29C45/14 ,  H01L21/56 ,  B29C45/10

    CPC分类号： H01L21/565 ,  B29C45/14655 ,  H01L2224/48091 ,  H01L2224/48247

    摘要： A method of encapsulating a semiconductor device permits use of the same mold for various package types. In one form, a mold (34 and 36) has a first cavity (50) in which a first insert (52 and 53) is positioned, the first insert defining a length and a width of a package body which is to be formed in the mold. The first insert in the first cavity also defines a second cavity (54) in which a second insert (56 and 57) is positioned, the second insert defining a thickness of the package body. Plastic is inserted into the mold to form the package body. To form other package types, one or more inserts are replaced instead of using a different mold. In another embodiment, the inserts are adjustable. For example, rather than having to change inserts to form a package with a different thickness, the inserts are adjusted by, for instance, a screw mechanism (66) within the mold or by the addition or removal of shims (60).

    摘要翻译： 封装半导体器件的方法允许使用相同的模具用于各种封装类型。 在一种形式中，模具（34和36）具有第一空腔（50），第一插入件（52和53）定位在其中，第一插入件限定要形成的封装主体的长度和宽度 模具。 在第一腔中的第一插入件还限定第二腔（54），第二腔（54）定位有第二插入件（56和57），第二插入件限定包装体的厚度。 将塑料插入模具中以形成包装体。 为了形成其他包装类型，替换一个或多个插入件而不是使用不同的模具。 在另一个实施例中，插入件是可调节的。 例如，不需要改变插入件以形成具有不同厚度的包装件，而是通过例如模具内的螺钉机构（66）或通过添加或移除垫片（60）来调节插入件。

    Electronic device package with peripheral carrier structure of low-cost plastic
    6.
    发明授权
    Electronic device package with peripheral carrier structure of low-cost plastic 失效
    电子器件封装具有周边载体结构的低成本塑料

    公开(公告)号：US4897602A

    公开(公告)日：1990-01-30

    申请号：US258235

    申请日：1988-10-14

    申请人： Paul T. Lin ,  Michael B. McShane ,  Charles G. Bigler ,  John A. Goertz ,  Joan M. Hamilton

    发明人： Paul T. Lin ,  Michael B. McShane ,  Charles G. Bigler ,  John A. Goertz ,  Joan M. Hamilton

    IPC分类号： H01L21/68 ,  H01L21/683

    CPC分类号： H01L21/68 ,  H01L21/6835

    摘要： An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

    摘要翻译： 引线框架上的电子器件封装，其具有将引线的远端固定在刚性位置的外围载体结构。 承载结构与包装主体间隔开并允许在保护引线的同时处理和测试包装。 对于载体结构而言，与包装体相比，使用不同的，相对较低的质量和较便宜的材料来降低包装的成本，因为载体结构可以包括包装体的体积的几倍，例如四倍或更多倍 。

    Edge mounted integrated circuits with heat sink
    9.
    发明授权
    Edge mounted integrated circuits with heat sink 有权
    带散热片的边缘安装集成电路

    公开(公告)号：US08004080B2

    公开(公告)日：2011-08-23

    申请号：US12554124

    申请日：2009-09-04

    申请人： Michael B. McShane ,  Perry H. Pelley

    发明人： Michael B. McShane ,  Perry H. Pelley

    IPC分类号： H01L23/34 ,  H01L29/22

    CPC分类号： H01L23/13 ,  H01L23/538 ,  H01L24/13 ,  H01L24/14 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

    摘要： A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge and electronic circuits having ports on the second edge. The second edges are connected to the substrate. The first major surface of the second integrated circuit is parallel with the second major surface of the first integrated circuit. The heat sink has a backplane adjacent to the third edge, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit.

    摘要翻译： 模块具有基板，第一和第二集成电路以及散热器。 集成电路各自具有第一主表面，第二主表面，第一边缘，第二边缘和第三边缘，并且具有在第一边缘上具有端口的光电路，并且具有在第二边缘上的端口的电子电路。 第二边缘连接到基板。 第二集成电路的第一主表面与第一集成电路的第二主表面平行。 散热器具有与第三边缘相邻的背板，沿着第一集成电路的第一主表面的第一部分，沿着从背板延伸的第二集成电路的第二主表面的第二部分，以及在第一 第二集成电路的主表面和第一集成电路的第二主表面。