公开(公告)号：US20080193822A1

公开(公告)日：2008-08-14

申请号：US12010127

申请日：2008-01-22

申请人： Chen-Chi Martin Ma ,  Han-Lang Wu ,  Tzong-Ming Lee ,  Yu-Feng Lin ,  Chia-Hsun Lee

发明人： Chen-Chi Martin Ma ,  Han-Lang Wu ,  Tzong-Ming Lee ,  Yu-Feng Lin ,  Chia-Hsun Lee

IPC分类号： H01M8/10

CPC分类号： H01M8/1025 ,  C08J5/2275 ,  C08J2379/08 ,  C08J2381/02 ,  H01M8/1027 ,  H01M8/103 ,  H01M8/1044 ,  H01M2300/0082

摘要： The present invention discloses a polymer blend of sulfonated polymer such as poly(ether ether ketone) and poly(amide imide) for use as an proton-conducting membrane. The poly(amide imide) is prepared by conducing a ring-opening and condensation reactions of diisocyanate and 1,2,4-benzenetricarboxylic anhydride (TMA). The polymer blend has a reduced methanol uptake and methanol permeability while maintaining good proton conductivity, and thus is suitable for use as a proton-conducting membrane of a fuel cell. The present invention also discloses a process for preparing the poly(amide imide).

摘要翻译： 本发明公开了用作质子传导膜的磺化聚合物如聚（醚醚酮）和聚（酰胺酰亚胺）的聚合物共混物。 聚酰胺酰亚胺通过二异氰酸酯和1,2,4-苯三酸酐（TMA）的开环缩合反应制备。 聚合物共混物具有降低的甲醇摄取和甲醇渗透性，同时保持良好的质子传导性，因此适合用作燃料电池的质子传导膜。 本发明还公开了一种制备聚酰胺酰亚胺的方法。

公开(公告)号：US08323553B2

公开(公告)日：2012-12-04

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06 ,  B29C35/08 ,  B29C59/16

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20070161729A1

公开(公告)日：2007-07-12

申请号：US11415610

申请日：2006-05-01

申请人： Kuo-Chan Chiou ,  Tzong-Ming Lee

发明人： Kuo-Chan Chiou ,  Tzong-Ming Lee

IPC分类号： C08K5/07 ,  C08K3/04

CPC分类号： C09K19/38 ,  B82Y30/00 ,  C08K3/04 ,  C08K2201/011 ,  C09K19/52

摘要： A composition for a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. The CNT-LC thermal composite structure is formed by using carbon nanotube with high thermal conductivity and liquid crystal polymer with the well-ordered structure. The thermal interface material thereby has a high thermal conductivity. The added amount of carbon nanotube is less than the added amount of metal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible without phase separation. The thermal interface material has a phase change temperature about 45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normal operating temperature of device to reduce the thermal resistance of the entire device.

摘要翻译： 提供了用于热界面材料的组合物。 解决了常规热界面材料中低热导率和高热阻的缺点。 CNT-LC热复合结构通过使用具有高导热性的碳纳米管和具有良好结构的液晶聚合物形成。 因此，热界面材料具有高导热性。 碳纳米管的添加量小于现有技术中用于改善分散过程的金属或陶瓷粉末的添加量。 CNT-LC热复合结构和相变树脂在不相分离的情况下是相容的。 热界面材料的相变温度约为45〜75°C。器件表面的任何孔，间隙和凹痕都会在器件的正常工作温度下填充，以降低整个器件的热阻。

公开(公告)号：US20070148469A1

公开(公告)日：2007-06-28

申请号：US11374697

申请日：2006-03-13

申请人： Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

发明人： Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

IPC分类号： B32B27/38 ,  B32B27/04 ,  C08L63/00 ,  B32B37/00

CPC分类号： C08G59/38 ,  C08L63/00 ,  G01L19/147 ,  Y10T428/31511

摘要： An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.

摘要翻译： 提供一种用于压力信号传输的包封组合物，其包括柔性和低模量环氧树脂作为与具有作为填料的压力信号传输性能的塑料球组合的物质。 因此，通过利用柔性环氧树脂在压力下容易变形的性质来传递压力信号。 并且通过塑料球之间的接触增强了信号传输的效果。 封装组合物用于传输压力信号的传感器中。 封装组合物是疏水性的，因此可以防止传感器的电子设备防止水分或水分延长其使用寿命。 与使用液体传输压力信号的传统传感器相比，采用固体封装组合的传感器具有生产加工容易等优点。

公开(公告)号：US07061103B2

公开(公告)日：2006-06-13

申请号：US10707684

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L23/22 ,  H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03˜0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.

摘要翻译： 公开了一种芯片封装结构。 芯片封装结构基本上包括载体，一个或多个芯片，散热器和封装材料层。 芯片中的至少一个被倒装芯片结合并电连接到载体或另一个芯片。 在芯片和载体或其他芯片之间存在倒装芯片接合间隙。 散热器位于最上面的芯片上。 封装材料层填充倒装芯片接合间隙以及最上面的芯片和散热器之间的间隙。 离开最上面的芯片的散热器表面的一部分被暴露。 此外，封装材料层以同时成型工艺形成。 例如，将芯片与散热器隔开0.03〜0.2mm的距离，封装材料的导热率大于1.2W / m·K。

公开(公告)号：US20050087852A1

公开(公告)日：2005-04-28

申请号：US10707683

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro FUKUI ,  Tomoaki NEMOTO

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro FUKUI ,  Tomoaki NEMOTO

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

摘要翻译： 公开了一种芯片封装结构及其制造方法。 芯片封装结构主要包括载体，芯片和封装材料层。 为了制造芯片封装，提供了载体和多个芯片。 每个芯片至少具有在其上具有多个凸块的活性表面。 芯片和载体电连接。 形成填充芯片和载体之间的接合间隙并覆盖芯片和载体的封装材料层。 芯片和载体之间的封装材料层具有第一厚度，并且芯片上的封装材料层具有第二厚度。 第二厚度具有在第一厚度的一半到两倍之间的值。

公开(公告)号：US5130407A

公开(公告)日：1992-07-14

申请号：US643711

申请日：1991-01-18

申请人： Tzong-Ming Lee ,  Ker-Ming Chen

发明人： Tzong-Ming Lee ,  Ker-Ming Chen

IPC分类号： C08G59/10 ,  C08G59/26 ,  C08G59/38 ,  H05K1/03

CPC分类号： C08G59/10 ,  C08G59/26 ,  C08G59/38 ,  H05K1/0326

摘要： A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).

摘要翻译： 一种用于制造印刷电路板的改性环氧树脂组合物，包括：（1）通过使（a）具有下式的至少两个环氧基的低分子量环氧树脂，（IMAGE）+ （b）至少两个活性氢原子并由下式表示的N-杂环脂肪氨基增量剂，（c）至少一种用于催化组分（a）和 （b）。

公开(公告)号：US08268413B2

公开(公告)日：2012-09-18

申请号：US12696832

申请日：2010-01-29

申请人： Chyi-Ming Leu ,  Horng-Long Tyan ,  Tzong-Ming Lee

发明人： Chyi-Ming Leu ,  Horng-Long Tyan ,  Tzong-Ming Lee

IPC分类号： G02F1/13363

CPC分类号： C08G73/10 ,  C08G73/105 ,  Y10T428/1023 ,  Y10T428/1036 ,  Y10T428/1086

摘要： A liquid crystal display device comprises a color filter substrate and an array substrate. An optical compensation film is disposed on the color filter substrate and/or the array substrate, wherein the optical compensation film comprises a polyimide, comprising the following formula: wherein n is an integer greater than 1, and wherein when A is cyclo-aliphatic compound, B is aromatic compound or cyclo-aliphatic compound, and when A is aromatic compound, B is cyclo-aliphatic compound.

摘要翻译： 液晶显示装置包括滤色器基板和阵列基板。 光学补偿膜设置在滤色器基板和/或阵列基板上，其中光学补偿膜包括聚酰亚胺，其包含下式：其中n是大于1的整数，并且其中当A是环脂族化合物 B是芳族化合物或环脂族化合物，当A是芳族化合物时，B是环脂族化合物。

公开(公告)号：US20110253942A1

公开(公告)日：2011-10-20

申请号：US12979158

申请日：2010-12-27

申请人： Min-Tsung Kuan ,  Ming-Chia Li ,  Wen-Hsien Wang ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Fang-Yao Yeh

发明人： Min-Tsung Kuan ,  Ming-Chia Li ,  Wen-Hsien Wang ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Fang-Yao Yeh

IPC分类号： C09K11/06

CPC分类号： C09K11/06 ,  C09K2211/1416 ,  C09K2211/1466 ,  H01L31/0481 ,  H01L31/055 ,  Y02E10/52

摘要： Disclosed are encapsulation materials including an 80 to 99.5 weight percentage (wt %) of ethylene vinyl acetate copolymers (EVA) and a 0.5 to 20 weight percentage(wt %) of a photoluminescent polymer, wherein the EVA and the photoluminescent polymers are evenly blended. The encapsulation materials can be applied to packaging solar cells, and the encapsulating structure may protect the EVA from UV damage and enhance light utilization efficiency of the solar cell.

摘要翻译： 公开了包含80至99.5重量百分比（wt％）乙烯 - 乙酸乙烯酯共聚物（EVA）和0.5-20重量百分比（wt％）光致发光聚合物的包封材料，其中EVA和光致发光聚合物均匀混合。 封装材料可用于封装太阳能电池，封装结构可以保护EVA免受紫外线损伤，提高太阳能电池的光利用效率。

公开(公告)号：US20110130507A1

公开(公告)日：2011-06-02

申请号：US12954838

申请日：2010-11-26

申请人： Chyi-Ming Leu ,  Tzong-Ming Lee ,  Chih-Jen Yang

发明人： Chyi-Ming Leu ,  Tzong-Ming Lee ,  Chih-Jen Yang

IPC分类号： C08L33/24 ,  C08K3/34 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： B82Y30/00 ,  C08K3/346 ,  C08K7/00 ,  C08K9/04 ,  C08L79/08 ,  C08L81/06

摘要： An organic/inorganic hybrid material is provided, including an organic polymer, and a plurality of inorganic nano-platelets, wherein the inorganic nano-platelets are self-connected or connected via a linker to constitute an inorganic platelet network. By the formation of the inorganic network structure, the hybrid materials can keep their transparency and flexibility at a high inorganic content, and exhibit greatly reduced coefficients of thermal expansion A method for fabricating the organic/inorganic hybrid material is also provided.

摘要翻译： 提供了一种有机/无机混合材料，包括有机聚合物和多种无机纳米片，其中无机纳米血小板通过连接体自连接或连接以构成无机血小板网络。 通过无机网状结构的形成，混合材料可以保持其无机含量高的透明性和柔软性，并且显示出大大降低的热膨胀系数。还提供了制造有机/无机混合材料的方法。