公开(公告)号：US20070232026A1

公开(公告)日：2007-10-04

申请号：US11726354

申请日：2007-03-21

申请人： Chris Apanius ,  Robert Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C08F32/00 ,  C08G64/0208 ,  C09D145/00 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US20080073741A1

公开(公告)日：2008-03-27

申请号：US11903190

申请日：2007-09-20

申请人： Chris Apanius ,  Robert Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L31/0203 ,  C08F10/00

CPC分类号： H01L24/83 ,  H01L21/82 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8303 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01055 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US08816485B2

公开(公告)日：2014-08-26

申请号：US13352424

申请日：2012-01-18

申请人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L23/10 ,  H01L25/00 ,  H01L27/146

CPC分类号： H01L24/83 ,  H01L21/82 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8303 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01055 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US20120175721A1

公开(公告)日：2012-07-12

申请号：US13352424

申请日：2012-01-18

申请人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L31/0203

CPC分类号： H01L24/83 ,  H01L21/82 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8303 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01055 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US07932161B2

公开(公告)日：2011-04-26

申请号：US11726354

申请日：2007-03-21

申请人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L24/29 ,  C08F32/00 ,  C08G64/0208 ,  C09D145/00 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US08120168B2

公开(公告)日：2012-02-21

申请号：US11903190

申请日：2007-09-20

申请人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

发明人： Chris Apanius ,  Robert A. Shick ,  Hendra Ng ,  Andrew Bell ,  Wei Zhang ,  Phil Neal

IPC分类号： H01L23/10

CPC分类号： H01L24/83 ,  H01L21/82 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8303 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01055 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。

公开(公告)号：US08053515B2

公开(公告)日：2011-11-08

申请号：US11949328

申请日：2007-12-03

申请人： Edmund Elce ,  Andrew Bell ,  Brian Knapp ,  Hendra Ng ,  Larry F. Rhodes ,  Robert Shick ,  Wei Zhang ,  William DiMenna ,  Saikumar Jayaraman ,  Jianyong Jin ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Xiaoming Wu ,  Etsu Takeuchi

发明人： Edmund Elce ,  Andrew Bell ,  Brian Knapp ,  Hendra Ng ,  Larry F. Rhodes ,  Robert Shick ,  Wei Zhang ,  William DiMenna ,  Saikumar Jayaraman ,  Jianyong Jin ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Xiaoming Wu ,  Etsu Takeuchi

IPC分类号： C08G63/60

CPC分类号： C08G61/04 ,  C08F232/08 ,  G03F7/0388

摘要： A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.

摘要翻译： 聚合物包括由式I表示的第一类型的重复单元：其中X选自-CH 2 - ， - CH 2 -CH 2 - 或-O-; m是0至约5的整数; 并且对于第一类型的重复单元，R 1，R 2，R 3和R 4中的一个是含马来酰亚胺基团之一，并且对于第二类型的重复单元，R 1，R 2，R 3和R 4中的一个是受阻芳族基团， C8或更大的烷基，C4或更大的卤代烃基或全卤代羰基，C7或更高的芳烷基或杂原子烃基或卤代烃基。

公开(公告)号：US20080194740A1

公开(公告)日：2008-08-14

申请号：US11949328

申请日：2007-12-03

申请人： Edmund Elce ,  Andrew Bell ,  Brian Knapp ,  Hendra Ng ,  Larry F. Rhodes ,  Robert Shick ,  Wei Zhang ,  William DiMenna ,  Saikumar Jayaraman ,  Jianyong Jin ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Xiaoming Wu ,  Etsu Takeuchi

发明人： Edmund Elce ,  Andrew Bell ,  Brian Knapp ,  Hendra Ng ,  Larry F. Rhodes ,  Robert Shick ,  Wei Zhang ,  William DiMenna ,  Saikumar Jayaraman ,  Jianyong Jin ,  Rajesh Raja Puthenkovilakom ,  Ramakrishna Ravikiran ,  Xiaoming Wu ,  Etsu Takeuchi

IPC分类号： C08K5/45 ,  C08G73/00 ,  C08K5/1545

CPC分类号： C08G61/04 ,  C08F232/08 ,  G03F7/0388

摘要： A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.

摘要翻译： 聚合物包括由式I表示的第一类型的重复单元：其中X选自-CH 2 - ， - CH 2 -CH 2 > - 或-O-; m是0至约5的整数; 并且对于第一类型的重复单元，R 1，R 2，R 3和R 4中的一个，R 4， >是含有马来酰亚胺的基团之一，对于第二类型的重复单元，R 1，R 2，R 3和R 3中的一个，R 3，R 3， 受阻芳族基团，C 8或更高级烷基，C 4或更大的卤代烃基或全卤代羰基，C _{7个或更大的芳烷基，或杂原子烃基或卤代烃基。}

公开(公告)号：US20220110303A1

公开(公告)日：2022-04-14

申请号：US17067711

申请日：2020-10-11

申请人： Wei Zhang

发明人： Wei Zhang

IPC分类号： A01K87/02

摘要： Methods and apparatus for expanding a rod from a collapsed position to a formed position are disclosed. One such apparatus includes a plurality of segments for forming the body of the collapsible rod including with each segment coupled to each immediately adjacent segment of the plurality of segments. The apparatus may include a coupler for coupling each segment of the plurality of segments to each immediately adjacent segment of the plurality of segments. The coupler may stretch from a base segment to the tip of the apparatus and may be biased to apply a force to hold the plurality of segments in a formed position and to urge the plurality of segments into a formed position from a collapsed position. In the formed position, the plurality of segments may be aligned end-to-end to form a rod and in the collapsed position, the plurality of segments may be folded against each other such that cylindrical walls of each of the plurality of segments are positioned adjacent each other.

公开(公告)号：US20180295974A1

公开(公告)日：2018-10-18

申请号：US15731045

申请日：2017-04-12

申请人： Wei Zhang

发明人： Wei Zhang

IPC分类号： A45F4/02 ,  F41H1/02 ,  A45C15/00 ,  F41H5/08

CPC分类号： A45F4/02 ,  A45C3/001 ,  A45C7/0068 ,  A45C13/103 ,  A45C15/00 ,  A45F3/04 ,  A45F3/06 ,  F41H1/00 ,  F41H1/02 ,  F41H5/00 ,  F41H5/08

摘要： A convertible bullet-proof backpack and vest includes a body section divided into a front portion, a middle portion, and back portion. The middle portion has a head slot opening, and the front and back portions have respective sections of bullet-proof fabric integrated therein. A zipper runs around an outer perimeter of the front and back portions. In a backpack configuration, the front portion and the back portion fold toward each other and the zipper secures the outer perimeters of the front portion and the back portion together thereby forming a hollow backpack interior between them. In a bullet-proof vest configuration, the zipper is unzipped thereby allowing a user to insert their head through the head slot opening such that the front portion hangs in front of a torso of the user and the back portion hangs behind the torso of the user.