公开(公告)号：US6040626A

公开(公告)日：2000-03-21

申请号：US225153

申请日：1999-01-04

申请人： Chuan Cheah ,  Jorge Munoz ,  Dan Kinzer

发明人： Chuan Cheah ,  Jorge Munoz ,  Dan Kinzer

IPC分类号： H01L21/60 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/40 ,  H01L23/49562 ,  H01L24/36 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40091 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107

摘要： A semiconductor package includes a bottom leadframe having a bottom plate portion and at least one first terminal extending from the bottom plate portion; at least one second terminal being co-planar with the first terminal; a semiconductor power MOSFET die having a bottom surface defining a drain connection and a top surface on which a first metalized region defining a source and a second metalized region defining a gate are disposed, the bottom surface being coupled to the bottom plate of the leadframe such that the first terminal is electrically connected to the drain; a copper plate coupled to and spanning a substantial part of the first metalized region defining the source connection; and at least one beam portion being sized and shaped to couple the copper plate portion to the at least one second terminal such that it is electrically coupled to the source.

摘要翻译： 半导体封装包括具有底板部分的底部引线框架和从底板部分延伸的至少一个第一端子; 至少一个第二端子与所述第一端子共面; 具有限定漏极连接的底表面的半导体功率MOSFET管芯和顶表面，其上限定限定源极的第一金属化区域和限定栅极的第二金属化区域，所述底表面联接到引线框架的底板， 第一端子电连接到漏极; 铜板，其耦合并跨越限定所述源连接的所述第一金属化区域的主要部分; 并且至少一个梁部分的尺寸和形状被设计成将铜板部分耦合到至少一个第二端子，使得它被电耦合到源极。

公开(公告)号：US06376910B1

公开(公告)日：2002-04-23

申请号：US09361633

申请日：1999-06-23

申请人： Jorge Munoz ,  Chuan Cheah

发明人： Jorge Munoz ,  Chuan Cheah

IPC分类号： H01L2348

CPC分类号： H01L24/33 ,  H01L24/02 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/32245 ,  H01L2224/83207 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/00

摘要： A solderable back contact for semiconductor die consists of a titanium layer bonded to the bottom of the die. The free surface of the titanium layer is coated with a copper layer. A soft solder layer joins the bottom of the die to a copper lead frame by first heating the die to below the melting point of the solder, and then ultrasonically “scrubbing” the solder to cause it to bond to the die and lead frame with a minimum sized solder fillet.

摘要翻译： 用于半导体管芯的可焊接背接触件由结合到管芯底部的钛层组成。 钛层的自由表面涂有铜层。 软焊料层通过首先将管芯加热到焊料的熔点以下，然后超声波地“擦洗”焊料以使其与管芯和引线框架结合，从而将管芯的底部连接到铜引线框架 最小尺寸的焊锡圆角。

公开(公告)号：US20080087164A1

公开(公告)日：2008-04-17

申请号：US11548713

申请日：2006-10-12

申请人： Gareth P. Taylor ,  Jorge Munoz

发明人： Gareth P. Taylor ,  Jorge Munoz

IPC分类号： B01D53/22

CPC分类号： B01D19/0031 ,  A61M5/36 ,  B01D19/0036 ,  B01D19/0094

摘要： A liquid is degassed with an apparatus including a membrane contactor, where the liquid is drawn through the apparatus by gravity.

摘要翻译： 用包括膜接触器的装置对液体进行脱气，其中液体通过重力被引导通过设备。

公开(公告)号：US06776399B2

公开(公告)日：2004-08-17

申请号：US10153051

申请日：2002-05-20

申请人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

发明人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.

摘要翻译： 具有上表面和下表面的基底，所述上表面包括由第一和第二间隔开的侧边缘和前后间隔开的边缘限定的周边; 设置在所述基板的上表面上的功率半导体管芯，所述管芯包括其上设置有至少第一金属化表面的顶表面和底表面; 多个导电焊盘，仅设置在所述衬底的第二侧边缘处; 以及从第一金属化表面延伸到多个导电焊盘的多个引线接合。

公开(公告)号：US20130049079A1

公开(公告)日：2013-02-28

申请号：US13557716

申请日：2012-07-25

申请人： Jorge Munoz

发明人： Jorge Munoz

IPC分类号： H01L23/495 ,  H01L29/78

CPC分类号： H01L24/49 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40247 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49505 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to an exemplary embodiment, a small-outline package includes a power transistor having a source and a drain, the power transistor situated on a paddle of a leadframe of the small-outline package. The source of the power transistor is electrically connected to a plurality of source leads. The drain of the power transistor is electrically and thermally connected to a top side of the paddle of the leadframe, the paddle of the leadframe being exposed from a bottom surface of the small-outline package, thereby providing a direct electrical contact to the drain from a bottom side of the paddle of the leadframe.

摘要翻译： 根据示例性实施例，小外形封装包括具有源极和漏极的功率晶体管，功率晶体管位于小外形封装的引线框架的桨叶上。 功率晶体管的源极电连接到多个源极。 功率晶体管的漏极电连接并且热连接到引线框架的焊盘的顶侧，引线框架的焊盘从小外形封装的底表面露出，从而提供与漏极的直接电接触 引线框的桨叶的底侧。

公开(公告)号：US06410989B1

公开(公告)日：2002-06-25

申请号：US09225254

申请日：1999-01-04

申请人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

发明人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.

公开(公告)号：US5887776A

公开(公告)日：1999-03-30

申请号：US729791

申请日：1996-10-08

申请人： Jorge Munoz

发明人： Jorge Munoz

IPC分类号： A45F5/00

CPC分类号： A45F5/00 ,  Y10S224/93

摘要： A portable radio-cassette adapter plate which is secured to a portable radio. An offset belt clip is secured to the portable radio-cassette adapter plate by an offset belt clip tether which is adjustable in length. By clamping the offset belt clip to a waistband or belt of a user, the portable radio is suspended comfortably by the offset belt clip tether. The distance which the portable radio is suspended below the waistband or belt of the user may be varied for comfort according to personal preference.

摘要翻译： 便携式收音机适配器板，固定在便携式收音机上。 偏移带夹通过长度可调节的偏移带夹系绳固定到便携式收音机适配器板上。 通过将偏移带夹固定到使用者的腰带或皮带上，便携式收音机由偏移带夹系绳舒适地悬挂。 便携式收音机悬挂在用户的腰带或腰带之下的距离可以根据个人喜好而变化以便于舒适。

公开(公告)号：US07682421B2

公开(公告)日：2010-03-23

申请号：US11548713

申请日：2006-10-12

申请人： Gareth P. Taylor ,  Jorge Munoz

发明人： Gareth P. Taylor ,  Jorge Munoz

IPC分类号： B01D19/00

CPC分类号： B01D19/0031 ,  A61M5/36 ,  B01D19/0036 ,  B01D19/0094

摘要： A liquid is degassed with an apparatus including a membrane contactor, where the liquid is drawn through the apparatus by gravity.

摘要翻译： 用包括膜接触器的装置对液体进行脱气，其中液体通过重力被引导通过设备。

公开(公告)号：US06984890B2

公开(公告)日：2006-01-10

申请号：US10884521

申请日：2004-07-02

申请人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

发明人： Bharat Shivkumar ,  Daniel M. Kinzer ,  Jorge Munoz

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49838 ,  H01L23/528 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.

公开(公告)号：US06396127B1

公开(公告)日：2002-05-28

申请号：US09476825

申请日：2000-01-03

申请人： Jorge Munoz ,  Rod DeLeon

发明人： Jorge Munoz ,  Rod DeLeon

IPC分类号： H01L2350

CPC分类号： H01L24/40 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/20755 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a bottom leadframe having a bottom plate portion and at least one first terminal extending from the bottom plate portion; at least one second terminal being co-planar with the first terminal; a semiconductor power MOSFET die having a bottom surface defining a drain connection and a top surface on which a first metalized region defining a source and a second metalized region defining a gate are disposed, the bottom surface being coupled to the bottom plate of the leadframe such that the first terminal is electrically connected to the drain; a copper plate coupled to and spanning a substantial part of the first metalized region defining the source connection, the copper plate including at least one chamfered edge extending upward and away from the first metalized region; and at least one beam portion being sized and shaped to couple the copper plate portion to the at least one second terminal such that it is electrically coupled to the source.

摘要翻译： 半导体封装包括具有底板部分的底部引线框架和从底板部分延伸的至少一个第一端子; 至少一个第二端子与所述第一端子共面; 具有限定漏极连接的底表面的半导体功率MOSFET管芯和顶表面，其上限定限定源极的第一金属化区域和限定栅极的第二金属化区域，所述底表面联接到引线框架的底板， 第一端子电连接到漏极; 铜板，其耦合并跨越限定所述源极连接的所述第一金属化区域的主要部分，所述铜板包括向上并远离所述第一金属化区域延伸的至少一个倒角边缘; 并且至少一个梁部分的尺寸和形状被设计成将铜板部分耦合到至少一个第二端子，使得它被电耦合到源极。