Abstract:
A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generating at least one system-wide configuration file and at least one component-level configuration file using the key file. The method additionally includes generating run-time executable objects from a database of option definition files, the at least one system-wide configuration file and the at least one component-level configuration file. Furthermore, the method includes employing the run-time executable objects to configure the plasma cluster tool.
Abstract:
A method for configuring a specific plasma cluster tool having a plurality of modules. The method includes providing a set of module option definition files, the set of module option definition files containing generic configuration definitions for generic plasma cluster tools. The method further includes providing a set of tool-specific protection information, the set of tool-specific protection information including data that specifically identifies the particular plasma cluster tool for which the configuring is intended. The method further includes providing a set of tool-specific options specifications, the set of tool-specific options specifications specifying options that are specified for the specific plasma cluster tool. The method additionally includes generating a key file, the key file encapsulating configuration restrictions imposed on the specific plasma cluster tool, the key file being configured to be a required file in the configuring the specific plasma tool.
Abstract:
A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generating at least one system-wide configuration file and at least one component-level configuration file using the key file. The method additionally includes generating run-time executable objects from a database of option definition files, the at least one system-wide configuration file and the at least one component-level configuration file. Furthermore, the method includes employing the run-time executable objects to configure the plasma cluster tool.
Abstract:
A method for configuring a specific plasma cluster tool having a plurality of modules. The method includes providing a set of module option definition files, the set of module option definition files containing generic configuration definitions for generic plasma cluster tools. The method further includes providing a set of tool-specific protection information, the set of tool-specific protection information including data that specifically identifies the particular plasma cluster tool for which the configuring is intended. The method further includes providing a set of tool-specific options specifications, the set of tool-specific options specifications specifying options that are specified for the specific plasma cluster tool. The method additionally includes generating a key file, the key file encapsulating configuration restrictions imposed on the specific plasma cluster tool, the key file being configured to be a required file in the configuring the specific plasma tool.
Abstract:
A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generating at least one system-wide configuration file and at least one component-level configuration file using the key file. The method additionally includes generating run-time executable objects from a database of option definition files, the at least one system-wide configuration file and the at least one component-level configuration file. Furthermore, the method includes employing the run-time executable objects to configure the plasma cluster tool.
Abstract:
A packaging structure, packaging material and a packaging method for a battery pack including multiple battery cell units, multiple conductive units and one or more packaging materials are provided. The conductive units are electrically connected to the battery cell units. The packaging material is filled to gaps between the battery cell units and tightly bonded to surfaces of the battery cell units. The battery pack has an integrated structure. Therefore, the battery cell units do not move relative to each other, and breaking of connections between the battery cell units and a conductive metal line or sheet can be avoided.
Abstract:
An oxygen sensor bung of motor vehicle exhaust pipe comprises at least a base, a catalytic converter and a seal lid. The base has an external connection section at one end that contains a first chamber to hold the catalytic converter and is fastened by the seal lid. The external connection section has a first external thread on the surface to fasten to a holding seat of an exhaust pipe. The base has a second chamber on another end with a third internal screw hole formed inside to hold an oxygen sensor by fastening with a second external thread formed thereon. The catalytic converter includes a barrel type casing containing a beehive structure made of precious metal to increase exhaust gas process area. Therefore impurities in the exhaust gas can be reduced and timely replacement of the catalytic converter can be accomplished, and accurate detection of oxygen content can be achieved.
Abstract:
An exhaust tail pipe includes a front outer tube, an inner tube and a rear tail pipe. The inner tube has a plurality of screw holes on one side mating a plurality of apertures formed on a rear coupling portion of the front outer tube to be fastened together by a plurality of bolts. The rear coupling portion is coupled on the front end of the rear tail pipe so that the rear section of the inner tube is held at the rear end of the rear tail pipe and fastened together by welding. Such a structure allows the front outer tube and rear tail pipe to be made of different materials, thus can maintain aesthetic appeal of the appearance to enhance product value.
Abstract:
A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.
Abstract:
The mechanisms of forming a semiconductor device package described above provide a low-cost manufacturing process due to the relative simple process flow. By forming an interconnecting structure with a redistribution layer(s) to enable bonding of one or more dies underneath a package structure, the warpage of the overall package is greatly reduced. In addition, interconnecting structure is formed without using a molding compound, which reduces particle contamination. The reduction of warpage and particle contamination improves yield. Further, the semiconductor device package formed has low form factor with one or more dies fit underneath a space between a package structure and an interconnecting structure.