公开(公告)号：US20130037990A1

公开(公告)日：2013-02-14

申请号：US13208197

申请日：2011-08-11

申请人： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  B29C33/123 ,  H01L21/566 ,  H01L23/3121 ,  H01L24/96 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

摘要翻译： 模制系统的底部追逐和顶部追逐形成容纳模制载体和一个或多个装置的空腔。 模制载体被放置在由引导部件限定的期望位置。 引导部件可以完全在腔内，或者延伸到底部追逐的表面之上，并延伸到顶部追逐和底部追逐的接触边缘上，使得在顶部追逐的边缘和边缘之间存在间隙 由模制材料填充以覆盖模制载体的边缘的模制载体。 释放部件可以与顶部追逐和/或底部追逐相关联，其可以是具有释放膜的多个带辊或底部追逐内的多个真空孔，或者具有底部追逐的多个底部销 。

公开(公告)号：US09064879B2

公开(公告)日：2015-06-23

申请号：US13228244

申请日：2011-09-08

申请人： Jui-Pin Hung ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Chin-Chuan Chang ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chin-Fu Kao ,  Yi-Chao Mao ,  Szu Wei Lu

发明人： Jui-Pin Hung ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Chin-Chuan Chang ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chin-Fu Kao ,  Yi-Chao Mao ,  Szu Wei Lu

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/147 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2924/00

摘要： Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.

摘要翻译： 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。 在一个实施例中，封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜（DAF）。 多个模具附接到DAF，并且多个管芯被封装。 至少载体晶片从封装的管芯移除，并且封装的管芯被切割。

公开(公告)号：US20130062760A1

公开(公告)日：2013-03-14

申请号：US13228244

申请日：2011-09-08

申请人： Jui-Pin Hung ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Chin-Chuan Chang ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chin-Fu Kao ,  Yi-Chao Mao ,  Szu Wei Lu

发明人： Jui-Pin Hung ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Chin-Chuan Chang ,  Chen-Hua Yu ,  Shin-Puu Jeng ,  Chin-Fu Kao ,  Yi-Chao Mao ,  Szu Wei Lu

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/147 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2924/00

摘要： Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.

摘要翻译： 公开了利用新颖的芯片附着膜的半导体器件的封装方法和结构。 在一个实施例中，封装半导体器件的方法包括提供载体晶片并且在载体晶片上形成包括聚合物的管芯附着膜（DAF）。 多个模具附接到DAF，并且多个管芯被封装。 至少载体晶片从封装的管芯移除，并且封装的管芯被切割。

公开(公告)号：US09679783B2

公开(公告)日：2017-06-13

申请号：US13208197

申请日：2011-08-11

申请人： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： B29C33/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/561 ,  B29C33/123 ,  H01L21/566 ,  H01L23/3121 ,  H01L24/96 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.

公开(公告)号：US20130075892A1

公开(公告)日：2013-03-28

申请号：US13246553

申请日：2011-09-27

申请人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Ying-Ching Shih ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Weng-Jin Wu ,  Ying-Ching Shih ,  Jui-Pin Hung ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/48 ,  H01L21/6835 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/83

摘要： A method for fabricating three dimensional integrated circuits comprises providing a wafer stack wherein a plurality of semiconductor dies are mounted on a first semiconductor die, forming a molding compound layer on the first side of the first semiconductor die, wherein the plurality of semiconductor dies are embedded in the molding compound layer. The method further comprises grinding a second side of the first semiconductor die until a plurality of through vias become exposed, attaching the wafer stack to a tape frame and dicing the wafer stack to separate the wafer stack into a plurality of individual packages.

摘要翻译： 一种用于制造三维集成电路的方法包括：提供其中多个半导体管芯安装在第一半导体管芯上的晶片堆叠，在第一半导体管芯的第一侧上形成模塑料层，其中多个半导体管芯被嵌入 在模塑料层中。 该方法还包括研磨第一半导体管芯的第二面直到多个通孔露出，将晶片堆叠附着到带框架上并切割晶片堆叠以将晶片堆叠分离成多个单独的封装。

公开(公告)号：US08779599B2

公开(公告)日：2014-07-15

申请号：US13298126

申请日：2011-11-16

申请人： Jing-Cheng Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/562 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

摘要： A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically insulated from the bottom chip.

摘要翻译： 一种器件包括底部芯片和结合到底部芯片的有源顶部管芯。 虚设裸片连接到底部芯片。 虚设裸片与底部芯片电绝缘。

公开(公告)号：US20130119552A1

公开(公告)日：2013-05-16

申请号：US13298126

申请日：2011-11-16

申请人： Jing-Cheng Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/562 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

摘要： A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically insulated from the bottom chip.

摘要翻译： 一种器件包括底部芯片和结合到底部芯片的有源顶部管芯。 虚设裸片连接到底部芯片。 虚设裸片与底部芯片电绝缘。

公开(公告)号：US09960088B2

公开(公告)日：2018-05-01

申请号：US13290879

申请日：2011-11-07

申请人： Yi-Chao Mao ,  Jui-Pin Hung ,  Jing-Cheng Lin ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Yi-Chao Mao ,  Jui-Pin Hung ,  Jing-Cheng Lin ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： B24B49/10 ,  H01L21/66 ,  B24B37/013 ,  B24B7/22 ,  H01L23/31

CPC分类号： H01L22/26 ,  B24B7/228 ,  B24B37/013 ,  B24B49/10 ,  H01L22/12 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for performing grinding includes selecting a target wheel loading for wafer grinding processes, and performing a grinding process on a wafer. With the proceeding of the grinding process, wheel loadings of the grinding process are measured. The grinding process is stopped after the target wheel loading is reached. The method alternatively includes selecting a target reflectivity of wafer grinding processes, and performing a grinding process on a wafer. With a proceeding of the grinding process, reflectivities of a light reflected from a surface of the wafer are measured. The grinding process is stopped after one of the reflectivities reaches the target reflectivity.

公开(公告)号：US20130087951A1

公开(公告)日：2013-04-11

申请号：US13270957

申请日：2011-10-11

申请人： Jing-Cheng Lin ,  Hsien-Wen Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Jing-Cheng Lin ,  Hsien-Wen Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H05B6/64 ,  B29C35/08

CPC分类号： B29C35/0805 ,  B29C2035/0855 ,  H01L21/565 ,  H05B6/6491 ,  H05B6/806

摘要： An embodiment is a molding chamber. The molding chamber comprises a mold-conforming chase, a substrate-base chase, a first radiation permissive component, and a microwave generator coupled to a first waveguide. The mold-conforming chase is over the substrate-base chase, and the mold-conforming chase is moveable in relation to the substrate-base chase. The first radiation permissive component is in one of the mold-conforming chase or the substrate-base chase. The microwave generator and the first waveguide are together operable to direct microwave radiation through the first radiation permissive component.

公开(公告)号：US20130001776A1

公开(公告)日：2013-01-03

申请号：US13170973

申请日：2011-06-28

申请人： Chen-Hua Yu ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng

发明人： Chen-Hua Yu ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng

IPC分类号： H01L23/485 ,  H01L21/28

CPC分类号： H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/214

摘要： A package includes a device die having a substrate. A molding compound contacts a sidewall of the substrate. A metal pad is over the substrate. A passivation layer has a portion covering an edge portion of the metal pad. A metal pillar is over and contacting the metal pad. A dielectric layer is over the passivation layer. A package material formed of a molding compound or a polymer is over the dielectric layer. The dielectric layer includes a bottom portion between the passivation layer and the package material, and a sidewall portion between a sidewall of the metal pillar and a sidewall of the package material. A polymer layer is over the package material, the molding compound, and the metal pillar. A post-passivation interconnect (PPI) extends into the polymer layer. A solder ball is over the PPI, and is electrically coupled to the metal pad through the PPI.

摘要翻译： 封装包括具有基板的器件裸片。 模塑料与基材的侧壁接触。 金属焊盘在基板上。 钝化层具有覆盖金属焊盘的边缘部分的部分。 金属支柱已经过去并与金属垫接触。 介电层位于钝化层的上方。 由模塑料或聚合物形成的包装材料在电介质层的上面。 电介质层包括位于钝化层和封装材料之间的底部，以及在金属柱的侧壁和封装材料的侧壁之间的侧壁部分。 聚合物层在包装材料，模塑料和金属支柱之上。 后钝化互连（PPI）延伸到聚合物层中。 焊球在PPI上方，并通过PPI电耦合到金属焊盘。