利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.017 秒)

    Process and plant for electrolytically coating surface of a roll, for the continuous casting of thin metal strip, with a metal laser
    6.
    发明授权
    Process and plant for electrolytically coating surface of a roll, for the continuous casting of thin metal strip, with a metal laser 有权
    用于电镀表面的辊的工艺和设备，用于金属激光的连续铸造薄金属带

    公开(公告)号：US06228242B1

    公开(公告)日：2001-05-08

    申请号：US09147205

    申请日：1998-12-09

    申请人： Hervé Lavelaine ,  Christian Allely ,  Eric Jolivet ,  Jean-Claude Catonne ,  Yann Breviere

    发明人： Hervé Lavelaine ,  Christian Allely ,  Eric Jolivet ,  Jean-Claude Catonne ,  Yann Breviere

    IPC分类号： C25D500

    CPC分类号： C25D1/04

    摘要： Both a process and plant are provided for electrolytically coating with a metal layer the casting surface of a roll for twin-roll or single-roll continuous casting of thin metal strip. The casting surface is at least partially immersed in an electrolyte solution containing a salt of the metal to be deposited, so as to face at least one anode. The surface is placed at a cathode and a relative movement is created between the casting surface and the electrolyte solution. Insulating masks are interposed between the anode or anodes and the arrises of the casting surface, the insulating masks preventing a concentration of the lines of current on the arrises and in their vicinity.

    摘要翻译： 提供了一种工艺和设备用于用金属层进行电解涂覆，辊的铸造表面用于薄金属带的双辊或单辊连续铸造。 铸造表面至少部分地浸入含有要沉积的金属的盐的电解液中，以面对至少一个阳极。 表面被放置在阴极处，并且在铸造表面和电解质溶液之间产生相对运动。 绝缘掩模插入在阳极或阳极和铸造表面的前端之间，绝缘面罩防止电流线在集线区及其附近。

    Process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a nickel plating step and a nickel removal step
    7.
    发明授权
    Process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a nickel plating step and a nickel removal step 失效
    用于连续铸造金属的模具元件的铜或铜合金外表面的调节方法，包括镀镍步骤和脱镍步骤

    公开(公告)号：US5788824A

    公开(公告)日：1998-08-04

    申请号：US838847

    申请日：1997-04-11

    申请人： Jean-Claude Catonne ,  Christian Allely ,  Remy Nicolle ,  Gerard Raisson

    发明人： Jean-Claude Catonne ,  Christian Allely ,  Remy Nicolle ,  Gerard Raisson

    IPC分类号： B22D11/04 ,  B22D11/057 ,  B22D11/059 ,  B22D11/06 ,  C23F17/00 ,  C25D3/12 ,  C25D5/24 ,  C25D5/34 ,  C25F5/00 ,  C23C28/00 ,  C25D5/12 ,  C25D7/04

    CPC分类号： C25F5/00 ,  B22D11/0651 ,  C25D5/34

    摘要： The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein: a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out; then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel; then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel and sulfamic acid in an amount from 20 to 80 g/l, and the pH of which is less than or equal to 2; and then a new nickel plating of said surface is carried out, if appropriate preceded by a preparation of the surface of the bared copper as explained previously.

    摘要翻译： 本发明的主题是一种用于连续铸造金属的模具元件的铜或铜合金外表面的方法，包括所述表面的镀镍步骤和从其中除去镍的步骤 其中：所述表面的制备方法，连续地包括清洁所述裸露表面的操作，在氧化酸性介质中酸洗所述裸露表面的操作和使所述裸露表面变亮的操作; 然后，通过电镀进行所述裸露表面的镀镍操作，将所述元件作为阴极放置在由含有60-100g / l镍的氨基磺酸镍水溶液组成的电解液中; 然后，在使用所述元件之后，通过将所述元件作为阳极放置在由含有60-100g / m 2的氨基磺酸镍水溶液组成的电解液中，进行从所述表面电解部分或完全去除镍的操作， l的镍和氨基磺酸的量为20至80g / l，其pH值小于或等于2; 然后如前所述，如果适当的话，进行所述表面的新的镍电镀，之前是如先前所述的裸露铜的表面的制备。