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    METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING COMPOSITION
    5.
    发明申请
    METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING COMPOSITION 审中-公开
    制造具有含硅组合物的发光装置的方法

    公开(公告)号：US20070269586A1

    公开(公告)日：2007-11-22

    申请号：US11383916

    申请日：2006-05-17

    申请人： Catherine A. Leatherdale ,  D. Scott Thompson ,  Larry D. Boardman

    发明人： Catherine A. Leatherdale ,  D. Scott Thompson ,  Larry D. Boardman

    IPC分类号： B05D5/06

    CPC分类号： H01L33/58 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

    摘要： A method of making a light emitting device is disclosed. The method includes providing a light emitting diode; providing an optical element; attaching the optical element to the light emitting diode with a photopolymerizable composition, the photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation; and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

    摘要翻译： 公开了一种制造发光器件的方法。 该方法包括：提供发光二极管; 提供光学元件; 所述光聚合组合物包含含硅树脂和含金属的催化剂，其中所述含硅树脂包括与硅键合的氢和脂族不饱和键; 并施加波长为700nm以下的光化辐射，以引发含硅树脂内的氢化硅烷化。

    Method of making light emitting device with silicon-containing encapsulant
    6.
    发明授权
    Method of making light emitting device with silicon-containing encapsulant 有权
    用含硅密封剂制造发光器件的方法

    公开(公告)号：US07427523B2

    公开(公告)日：2008-09-23

    申请号：US11383885

    申请日：2006-05-17

    申请人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    发明人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    IPC分类号： H01L21/00

    CPC分类号： H01L33/52 ,  H01L23/293 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

    摘要翻译： 公开了一种制造发光器件的方法。 该方法包括提供发光二极管并形成与发光二极管接触的密封剂; 其中形成所述密封剂包括使所述发光二极管与包含含硅树脂，含金属的催化剂和表面处理的颗粒的光聚合组合物接触，所述含硅树脂包括与硅键合的氢和脂族不饱和键，所述表面处理颗粒 包括非吸收性金属氧化物颗粒，半导体颗粒或其组合，并且施加波长为700nm或更小的光化辐射以引发含硅树脂内的氢化硅烷化。

    Method of making light emitting device with silicon-containing encapsulant
    9.
    发明授权
    Method of making light emitting device with silicon-containing encapsulant 有权
    用含硅密封剂制造发光器件的方法

    公开(公告)号：US07192795B2

    公开(公告)日：2007-03-20

    申请号：US10993460

    申请日：2004-11-18

    申请人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    发明人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    IPC分类号： H01L21/00

    CPC分类号： H01L33/52 ,  H01L23/293 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

    摘要翻译： 公开了一种制造发光器件的方法。 该方法包括提供发光二极管并形成与发光二极管接触的密封剂; 其中形成所述密封剂包括使所述发光二极管与由含硅树脂和含金属的催化剂组成的可光聚合组合物接触，其中所述含硅树脂由与硅键合的氢和脂肪族不饱和键构成，并且施加光化辐射，其具有 波长为700nm以下，以引发含硅树脂内的氢化硅烷化。