公开(公告)号：US20220234073A1

公开(公告)日：2022-07-28

申请号：US17606922

申请日：2020-04-30

Applicant: DEXERIALS CORPORATION

Inventor： Takayuki SAITO ,  Masahiro NISHIMOTO ,  Ikuo MITSUSHIMA ,  Masaki KANEKO

IPC: B05D1/42 ,  B05D5/08

Abstract: A method for supplying a sliding process material to or removing it from a surface of an object to be slid using a sliding part including a plurality of sliding bodies each having a flat working surface, the sliding part is regularly moved, preferably by a second driving mechanism, in parallel with the working surfaces of the sliding bodies and in a direction different from a moving direction of the sliding bodies while the sliding bodies are regularly moved, preferably by a first driving mechanism, in parallel with the working surfaces. This configuration uniformly supplies the sliding process material to the surface of the object to be slid.

公开(公告)号：US20180079939A1

公开(公告)日：2018-03-22

申请号：US15532931

申请日：2016-02-05

Applicant: DEXERIALS CORPORATION

Inventor： Kenji KUBOTA ,  Takayuki SAITO

IPC: C09J163/08 ,  C09J7/00 ,  C09J133/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09J163/08 ,  C08G59/42 ,  C09J7/00 ,  C09J133/04 ,  C09J133/16 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/75981 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/0665 ,  H01L2924/18161 ,  H01L2924/364 ,  H01L2924/384 ,  C08K5/18 ,  C08L33/08 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/095 ,  H01L2924/0635 ,  H01L2924/01083 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2224/27 ,  H01L2224/11 ,  H01L21/78 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.

公开(公告)号：US20220250110A1

公开(公告)日：2022-08-11

申请号：US17606897

申请日：2020-04-30

Applicant: DEXERIALS CORPORATION

Inventor： Takayuki SAITO ,  Masahiro NISHIMOTO ,  Ikuo MITSUSHIMA ,  Masaki KANEKO

IPC: B05C11/02 ,  B05C13/02

Abstract: A sliding device configured to perform a sliding process on a surface of an object to be slid includes a sliding part including sliding bodies each having a flat working surface; a first driving mechanism configured to regularly move the sliding bodies in parallel with the working surfaces of the sliding bodies; and a second driving mechanism configured to regularly move the sliding part in parallel with the working surfaces in a direction different from a moving direction by the first driving mechanism while the first driving mechanism moves the sliding bodies. This enables uniform supply of the sliding process material onto the surface of the object to be slid or clean the surface of the object to be slid.

公开(公告)号：US20160194517A1

公开(公告)日：2016-07-07

申请号：US14915734

申请日：2014-09-10

Applicant: DEXERIALS CORPORATION

Inventor： Takayuki SAITO ,  Taichi KOYAMA ,  Hironobu MORIYAMA

IPC: C09D163/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09D163/00 ,  C08G59/42 ,  C08L63/00 ,  C09D133/066 ,  C09J133/04 ,  C09J133/066 ,  C09J163/08 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L21/78 ,  C08K5/14 ,  C08L33/10

Abstract: An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Abstract translation: 提供了用于安装的宽裕度的底部填充材料和使用其的制造半导体器件的方法。 底部填充材料含有环氧树脂，酸酐，丙烯酸树脂和有机过氧化物，其中在底物填充材料的熔融粘度在温度升高速率条件下测定时获得的最小熔体粘度达到温度和最小熔体粘度 5〜50℃/分钟的范围分别为100〜150℃，范围为100〜5000Pa·s。 由于在不同温度升高条件下测量的最小熔融粘度达到温度的变化小，无需严格控制热压接温度分布，就可以实现无孔安装和良好的焊接性能，并且可以实现大的安装余地。