公开(公告)号：US20100224984A1

公开(公告)日：2010-09-09

申请号：US12641713

申请日：2009-12-18

申请人： Dai SASAKI ,  Mitsuaki KATAGIRI ,  Hisashi TANIE

发明人： Dai SASAKI ,  Mitsuaki KATAGIRI ,  Hisashi TANIE

IPC分类号： H01L23/538 ,  H01L23/52

CPC分类号： H01L23/49811 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/50 ,  H01L24/86 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/50 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device according to one embodiment has a wiring circuit board, a semiconductor chip, a die attach material and bumps. The semiconductor chip is mounted on the wiring circuit board. The die attach material is provided between the wiring circuit board and the semiconductor chip. A wiring layer is provided on one surface of the wiring circuit board. Leads are extended from the wiring layer and connected to the semiconductor chip. The bumps are provided at outer positions relative to the region where the semiconductor chip of the wiring circuit board is mounted. The wiring layer in the wiring circuit board is formed on the surface opposite from the surface on which the semiconductor chip is mounted.

摘要翻译： 根据一个实施例的半导体器件具有布线电路板，半导体芯片，管芯附着材料和凸块。 半导体芯片安装在布线电路板上。 芯片附着材料设置在布线电路板和半导体芯片之间。 配线层设置在布线电路板的一个表面上。 引线从布线层延伸并连接到半导体芯片。 凸块设置在相对于安装布线电路板的半导体芯片的区域的外部位置处。 布线电路板中的布线层形成在与安装有半导体芯片的表面相反的表面上。

公开(公告)号：US20120302007A1

公开(公告)日：2012-11-29

申请号：US13538654

申请日：2012-06-29

申请人： Mitsuaki KATAGIRI ,  Hisashi TANIE ,  Jun KAYAMORI ,  Dai SASAKI ,  Hiroshi MORIYA

发明人： Mitsuaki KATAGIRI ,  Hisashi TANIE ,  Jun KAYAMORI ,  Dai SASAKI ,  Hiroshi MORIYA

IPC分类号： H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/50 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2924/00

摘要： In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.

摘要翻译： 在层叠型半导体器件中，堆叠第一半导体器件和至少一个第二半导体器件。 第一半导体器件包括布线板和安装在布线板上的第一半导体芯片。 第二半导体器件包括布线板和安装在布线板上的第二半导体芯片。 每个第二半导体器件的第二半导体芯片的厚度比第一半导体芯片的厚度厚。

公开(公告)号：US20100052133A1

公开(公告)日：2010-03-04

申请号：US12496066

申请日：2009-07-01

申请人： Hisashi TANIE ,  Hiroshi Moriya ,  Masahiro Yamaguchi ,  Emi Sawayama

发明人： Hisashi TANIE ,  Hiroshi Moriya ,  Masahiro Yamaguchi ,  Emi Sawayama

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L21/607

CPC分类号： H01L24/86 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/29 ,  H01L24/50 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/0401

摘要： A semiconductor device includes a plurality of semiconductor packages each with a semiconductor element and a flexible board. The flexible board is wider than the semiconductor element and is electrically connected to the semiconductor element. The plurality of semiconductor packages are stacked on one surface of a mother board. The semiconductor element is positioned between the flexible boards of the semiconductor packages in adjacent layers. The flexible boards in the adjacent layers are joined together at junction portions positioned at a part of the flexible boards which sticks out from an area in which the semiconductor elements and the flexible boards overlap. A reinforcing resin is provided in at least a part of the area between the flexible boards in the adjacent layers and between the junction portion of the flexible boards and the corresponding semiconductor element. The reinforcing resin contacts at least a part of the adjacent flexible board.

摘要翻译： 半导体器件包括多个半导体封装，每个半导体封装均具有半导体元件和柔性板。 柔性板比半导体元件宽，并与半导体元件电连接。 多个半导体封装堆叠在母板的一个表面上。 半导体元件位于相邻层中的半导体封装的柔性板之间。 相邻层中的柔性板在位于柔性板的从半导体元件和柔性板重叠的区域伸出的部分的接合部处接合在一起。 在相邻层中的柔性板之间的区域的至少一部分之间以及柔性板的接合部分和相应的半导体元件之间设置增强树脂。 增强树脂与相邻柔性板的至少一部分接触。

公开(公告)号：US20100193936A1

公开(公告)日：2010-08-05

申请号：US12694298

申请日：2010-01-27

申请人： Hisashi TANIE ,  Nobuhiko Chiwata ,  Motoki Wakano ,  Takeyuki Itabashi

发明人： Hisashi TANIE ,  Nobuhiko Chiwata ,  Motoki Wakano ,  Takeyuki Itabashi

IPC分类号： H01L23/488 ,  H01L23/498

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00

摘要： A novel structure capable of reducing the stress in the insulating layer in the semiconductor element and thereby securing reliability is provided. When the semiconductor element and the substrate are connected with a solder, the stress generated in the insulating layer is reduced by placing a spherical core made of a material having a greater rigidity inside the solder and satisfying the following inequalities: 1 GPa

摘要翻译： 提供了能够减小半导体元件中的绝缘层中的应力并由此确保可靠性的新型结构。 当半导体元件和衬底与焊料连接时，通过将由焊料中具有较大刚性的材料制成的球形芯放置在绝缘层中产生的应力减小，并满足以下不等式：1 GPa <（杨氏模量 的密封树脂）<30GPa，20ppm / k（包封树脂的线膨胀系数）<200ppm / k，10MPa <（室温下焊料的屈服应力）<30MPa。 在连接时，要放置在半导体元件表面上的焊盘与芯之间的焊料的厚度被调节为端子间距的1/10以下。

公开(公告)号：US20100038767A1

公开(公告)日：2010-02-18

申请号：US12538390

申请日：2009-08-10

申请人： Hiroshi MORIYA ,  Hisashi TANIE ,  Emi SAWAYAMA ,  Masahiro YAMAGUCHI

发明人： Hiroshi MORIYA ,  Hisashi TANIE ,  Emi SAWAYAMA ,  Masahiro YAMAGUCHI

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L23/49816 ,  H01L23/5385 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/15311

摘要： The semiconductor device includes a stacked semiconductor package in which end portions of a plurality of flexible substrates have bonded portions which are connected together by wirings and in which a plurality of semiconductor packages are electrically connected to a mother substrate via the bonded portions. In at least a part of a region of portions of the plurality of flexible substrates that extends from the side surfaces of each of the semiconductor elements, and that is present between side surfaces of each of the semiconductor elements and the bonded portions of the flexible substrates, the plurality of flexible substrates have a curved portion, and the shape of the curved portion of at least one flexible substrate is different from the shape of a curved portion of another flexible substrate adjacent to this flexible substrate.

摘要翻译： 半导体器件包括堆叠半导体封装，其中多个柔性基板的端部具有通过布线连接在一起的接合部，并且其中多个半导体封装经由接合部电连接到母基板。 在多个柔性基板的从每个半导体元件的侧表面延伸并且存在于每个半导体元件的侧表面和柔性基板的接合部分之间的部分的区域的至少一部分中 多个柔性基板具有弯曲部分，并且至少一个柔性基板的弯曲部分的形状不同于与该柔性基板相邻的另一柔性基板的弯曲部分的形状。