公开(公告)号：US06340630B1

公开(公告)日：2002-01-22

申请号：US09536557

申请日：2000-03-28

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

IPC分类号： A01L2144

CPC分类号： H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

摘要： A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip. The aligned mold/wafer assembly is then passed through a reflow furnace to effect the transfer of the low melting temperature solder in the mold cavities onto the tip of the high melting temperature solder bumps on the wafer. A dual metallurgical composition bump is thereby formed by the two different solder alloys.

摘要翻译： 可以在能够以低处理温度结合到另一电子设备的电子设备上形成互连的方法可以通过在形成突起的电子设备上沉积第一互连材料，然后沉积第二互连材料至少部分覆盖 所述突起，其中所述第二互连材料具有比所述第一互连材料低的流动温度。 该方法通过将熔融焊料流入具有微腔的模具中以填充空腔，然后使其固化来进行。 然后将模具与包含沉积有高熔点温度焊料凸块的芯片的硅晶片对准，使得模具的每个微腔与芯片上的每个高熔点温度焊料凸块对准。 然后将对准的模具/晶片组件通过回流炉，以将模腔中的低熔点焊料转移到晶片上的高熔点温度焊料凸块的尖端上。 由此由两种不同的焊料合金形成双金属组合物凸块。

公开(公告)号：US6127735A

公开(公告)日：2000-10-03

申请号：US710992

申请日：1996-09-25

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Bruce Lee Humphrey ,  Michael Liehr ,  William Thomas Motsiff ,  Carlos Juan Sambucetti

IPC分类号： B23K35/26 ,  H01L21/60 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H05K3/3436 ,  H05K3/3468 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3463 ,  H05K3/3478 ,  Y02P70/613

摘要： A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip. The aligned mold/wafer assembly is then passed through a reflow furnace to effect the transfer of the low melting temperature solder in the mold cavities onto the tip of the high melting temperature solder bumps on the wafer. A dual metallurgical composition bump is thereby formed by the two different solder alloys.

摘要翻译： 可以在能够以低处理温度结合到另一电子设备的电子设备上形成互连的方法可以通过在形成突起的电子设备上沉积第一互连材料，然后沉积第二互连材料至少部分覆盖 所述突起，其中所述第二互连材料具有比所述第一互连材料低的流动温度。 该方法通过将熔融焊料流入具有微腔的模具中以填充空腔，然后使其固化来进行。 然后将模具与包含沉积有高熔点温度焊料凸块的芯片的硅晶片对准，使得模具的每个微腔与芯片上的每个高熔点温度焊料凸块对准。 然后将对准的模具/晶片组件通过回流炉，以将模腔中的低熔点焊料转移到晶片上的高熔点温度焊料凸块的尖端上。 由此由两种不同的焊料合金形成双金属组合物凸块。

公开(公告)号：US6149122A

公开(公告)日：2000-11-21

申请号：US169854

申请日：1998-10-09

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  B29C33/00

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

摘要翻译： 一种用于在电子结构上形成焊料凸块的方法，包括以下步骤：首先提供由具有大于待形成的焊料凸块的厚度的模具材料的片材制成的模具，所述模具材料具有足够的光学透明度，以便 允许检查随后填充到模具材料中形成的模腔中的焊料材料，以及与模具将被配合到的基板基本相似的热膨胀系数，在该模具中形成多个模腔 模具材料片材，用焊料材料填充多个模腔，将模具冷却到足以固化多个模腔中的焊料材料的温度，将模具与电子结构紧密地定位，使得空腔面向 结构，并将模具和结构加热到足够高的温度，使得焊料材料tr 在电子结构上。

公开(公告)号：US6133633A

公开(公告)日：2000-10-17

申请号：US169249

申请日：1998-10-09

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US5775569A

公开(公告)日：1998-07-07

申请号：US741453

申请日：1996-10-31

申请人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Daniel George Berger ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  Rajesh Shankerlal Patel ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L23/485 ,  H05K3/34

CPC分类号： H05K3/3468 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

公开(公告)号：US6003757A

公开(公告)日：1999-12-21

申请号：US70120

申请日：1998-04-30

申请人： Guy Daniel Beaumont ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber

发明人： Guy Daniel Beaumont ,  Guy Paul Brouillette ,  David Hirsch Danovitch ,  Peter Alfred Gruber

IPC分类号： B23K3/06 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K3/00 ,  B23K31/02

CPC分类号： H05K3/3468 ,  B23K3/0623 ,  H01L21/67092 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/128

摘要： An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.

摘要翻译： 公开了一种用于将焊料凸起从焊料转移到焊料接收衬底的装置和方法。 该装置包括由基座构件，盖构件和用于将模具/基板组件保持在其中的可压缩构件构成的转移夹具。 通过盖构件安装多个压缩销，以在模具/基板组件上提供均匀的压力，并且由于热膨胀系数的不匹配而允许模具/衬底组件相对于转移夹具的横向运动。 可压缩构件是纤维素泡沫片材，其在晶片的整个表面上施加均匀的接合力，并确保整个晶片和模具表面之间的邻接接触。 泡沫片材还有助于模具/基材组件相对于转印夹具的基底部件的横向移动。

公开(公告)号：US6105852A

公开(公告)日：2000-08-22

申请号：US19396

申请日：1998-02-05

申请人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： B23K35/12 ,  H01L21/60 ,  H05K3/00 ,  H05K3/34 ,  H01L29/40 ,  H01L2/44

CPC分类号： H01L24/11 ,  H05K3/3468 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/002

摘要： A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

摘要翻译： 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US06332569B1

公开(公告)日：2001-12-25

申请号：US09578319

申请日：2000-05-24

申请人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

发明人： Steven A. Cordes ,  Peter Alfred Gruber ,  Egon Max Kummer ,  Stephen Roux ,  Carlos Juan Sambucetti ,  James Louis Speidell

IPC分类号： B23K3102

CPC分类号： H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/002 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H01L2224/05599

摘要： A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

摘要翻译： 提供精确的体积，精确对准的载体，用于注射成型，用于在“倒装芯片”技术中制造集成电路凸块触点。 通过将注册的开口蚀刻穿透并切割成透明载体来制造半球形腔。 半球形腔体具有相关的体积和可见的周边形状，当注射成型操作已经填充空腔时，允许简单的光学质量控制，并且简单的光学配准用于熔合到集成电路上的焊盘。

公开(公告)号：US06390439B1

公开(公告)日：2002-05-21

申请号：US09287370

申请日：1999-04-07

申请人： Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

发明人： Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

IPC分类号： B29C3300

CPC分类号： B23K3/0623 ,  B23K3/0638 ,  B23K2101/40 ,  H05K3/3457 ,  Y10T156/10

摘要： Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.

公开(公告)号：US06832747B2

公开(公告)日：2004-12-21

申请号：US10128210

申请日：2002-04-23

申请人： Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

发明人： Steven A. Cordes ,  David Hirsch Danovitch ,  Peter Alfred Gruber ,  James Louis Speidell ,  Joseph Peter Zinter

IPC分类号： B29C3300

CPC分类号： B23K3/0623 ,  B23K3/0638 ,  B23K2101/40 ,  H05K3/3457 ,  Y10T156/10

摘要： Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.

摘要翻译： 公开了用于模制用于熔融焊料筛选过程的多个焊球的混合模具和用于制备这种模具的方法。 利用用于通过沿着特定结晶平面各向异性蚀刻晶体硅衬底而形成金字塔形状的多个空腔的方法来形成本发明混合模具中使用的结晶硅面板。 在一个优选的实施例中，硅面板通过粘合方法以一种确保在硅面板和玻璃背板的顶表面之间实现共面性的方法结合到硼硅酸盐玻璃背板上。 在替代实施例中，另外的玻璃框架用于将硅面板粘合到玻璃背板，再次确保硅面板的顶表面和玻璃框架之间的共面性。 在第二替代实施例中，硅面板封装在可以是硼硅酸盐玻璃或聚合物的增量材料中。 在平整装置上进行包装，使得硅面板的顶表面和固化后的增量材料的顶表面完美平整。