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公开(公告)号：US07551439B2
公开(公告)日：2009-06-23
申请号：US11396322
申请日：2006-03-28
申请人： Darrel E. Peugh , Bruce A. Myers , Gary E. Oberlin
发明人： Darrel E. Peugh , Bruce A. Myers , Gary E. Oberlin
IPC分类号： H05K7/20
CPC分类号： H01L23/053 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , H01L2924/13055 , H01L2924/00
摘要： An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.
摘要翻译： 提供电子组件，其具有用于冷却密封隔室内的电子设备的热冷却流体，例如液体。 组件包括大致限定密封的流体隔室的壳体，设置在壳体内的电子设备和用于冷却电子设备的冷却液体。 组件包括与密封流体隔室流体连通的入口和出口端口，用于允许冷却液体通过隔室以冷却电子设备。 流体流动通道形成为与壳体内的电子装置热连通。 流体通道包括允许液体与电子设备热连通流动的通道以冷却设备。
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公开(公告)号：US07106588B2
公开(公告)日：2006-09-12
申请号：US10694191
申请日：2003-10-27
IPC分类号： H05K7/20 , H01L23/427 , H05K7/06
CPC分类号： H01L23/427 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.
摘要翻译： 本发明涉及从大功率电子设备散热的装置和方法。 该组件包括大电流衬底，诸如支撑电子器件的印刷电路板，与电子器件热耦合的热管和还形成散热器的组装壳体，以及可以热耦合的热瞬变抑制材料 与电子设备和热管。
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公开(公告)号：US06560110B1
公开(公告)日：2003-05-06
申请号：US10079760
申请日：2002-02-22
IPC分类号： H05K720
CPC分类号： H05K5/064 , H05K7/20463
摘要： A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.
摘要翻译： 提供了一种抗腐蚀电子组件10，其包括安装在基板14上并位于灌封材料18内的至少一个发热电子元件12.导热块元件24热安装到至少一个发热电子元件12上并定位 在灌封材料18内，从而提供具有改善的热耗散的耐腐蚀电子组件10。
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公开(公告)号：US20080290378A1
公开(公告)日：2008-11-27
申请号：US11804925
申请日：2007-05-21
申请人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
发明人： Bruce A. Myers , Darrel E. Peugh , Alaa A. Elmoursi , Thomas Hubert Van Steenkiste , Zhibo Zhao , Bryan A. Gillispie
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/15312 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die.
摘要翻译： 为高功率应用提供了低成本晶体管封装。 该封装为硅晶体管裸片提供高导热性和耗散能力，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。 电介质层被固定到硅晶体管管芯，用于耦合到导热缓冲器并附接到衬底。 通过生长电介质层，沉积介电层或使用等离子体喷涂来施加电介质层，将电介质层固定到管芯。 在一个方面，通过热或动力学喷涂工艺将导电层形成于硅晶体管管芯，并将介电层施加到导电层上。 电介质层也可以在晶体管制造之前或之后建立。 电和热互连有利地从硅晶体管管芯的相对侧定位。
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公开(公告)号：US07365981B2
公开(公告)日：2008-04-29
申请号：US11168882
申请日：2005-06-28
CPC分类号： H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/16251 , H01L2924/00
摘要： A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.
摘要翻译： 一种流体冷却的电子组件，包括其中具有流体入口和流体出口的底座，附接到基座以在其间形成流体容纳室的盖，其中流体容纳室与流体入口和流体出口流体连通 以及设置在所述流体容纳室内并连接到所述基座的电子设备，所述电子设备具有多个微通道，所述多个微通道适于接收通过其中的冷却流体流，其中所述盖被成形为将流体流从所述流体入口引导到 微通道，使得流体入口和流体出口之间的压降降低。
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公开(公告)号：US07538425B2
公开(公告)日：2009-05-26
申请号：US10900538
申请日：2004-07-28
IPC分类号： H01L23/34
CPC分类号： H05K1/0272 , H01L23/4334 , H01L23/473 , H01L24/48 , H01L29/0657 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/10253 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H05K1/0203 , H05K2201/064 , H05K2201/10689 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.
摘要翻译： 功率半导体器件封装使用集成流体传导微通道，用于向微通道供应液体冷却剂的一个或多个入口端口和用于排出已经通过微通道的冷却剂的一个或多个出口。 该半导体器件安装在单层或多层电路板上，该单层或多层电路板具有电气和流体互连特征，其与设备的电端子和入口端口和出口端口配合，以限定独立且自密封的微通道热交换器。
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公开(公告)号：US07215547B2
公开(公告)日：2007-05-08
申请号：US10919168
申请日：2004-08-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H05K1/0206 , H05K1/0272 , H05K3/4611 , H05K2201/064
摘要： The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.
摘要翻译： 本发明提供一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件的方法。 电子组件包括基座; 以及至少一个附接到基座的电气部件。 基座限定了一个集成的冷却系统，其具有横跨在基座内的流体通道和与流体通道热连通的至少一个热交换器。 集成冷却系统还可以包括附接到基座的泵，用于引导流体在流体通道内的流动，以及与流体通道流体连通的端口，用于从外部源接收流体。
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8.发明授权Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips 有权液冷式电力电子电路，包括直接冷却的半导体芯片的堆叠阵列公开(公告)号：US07795726B2
公开(公告)日：2010-09-14
申请号：US11799925
申请日：2007-05-03
申请人： Bruce A. Myers , Eric A. Brauer
发明人： Bruce A. Myers , Eric A. Brauer
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/074 , H01L2225/06555 , H01L2225/06562 , H01L2924/0002 , H01L2924/10158 , H01L2924/00
摘要： A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
摘要翻译： 限定电力电子电路的通道半导体芯片的堆叠阵列安装在设有用于液体冷却剂的入口和出口通道的密封容器中。 由容器支撑的引线框架端子接合半导体芯片的选定端子，并形成用于将容器安装在具有电和流体互连的电路板上的引线。
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公开(公告)号：US06822018B2
公开(公告)日：2004-11-23
申请号：US10075978
申请日：2002-02-15
申请人： Arun K. Chaudhuri , Bruce A. Myers
发明人： Arun K. Chaudhuri , Bruce A. Myers
IPC分类号： C08K904
CPC分类号： C08K3/08
摘要： An electrically-insulating polymer-based material with improved thermal conductvity so as to be suitable for use as an adhesive for mounting and conducting heat from electronic devices. The polymer-based material comprises metal particles dispersed in a matrix material. The metal particles are encapsulated by a dielectric coating so that they are electrically insulated from each other. The polymer-based material may also comprise dielectric particles dispersed in the matrix material and/or the dielectric coating for the purpose of further increasing the thermal conductivity of the polymer-based material. The material is also suitable for use as a potting compound or an encapsulation material for various electronic applications.
摘要翻译： 一种具有改进的导热性的电绝缘聚合物基材料，以便适合用作用于从电子设备安装和传导热量的粘合剂。 基于聚合物的材料包括分散在基质材料中的金属颗粒。 金属颗粒被介电涂层包封，使得它们彼此电绝缘。 为了进一步提高聚合物基材料的导热性，基于聚合物的材料还可以包含分散在基体材料和/或电介质涂层中的介电粒子。 该材料也适用于各种电子应用的灌封化合物或封装材料。
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公开(公告)号：US06779260B1
公开(公告)日：2004-08-24
申请号：US10401850
申请日：2003-03-28
IPC分类号： A05K330
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/45124 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01R13/504 , H01R13/665 , H01R43/24 , H05K3/0058 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a backplate affixed to the substrate and, in some cases, also to the connector housing or shroud. In some embodiments, the connector housing or shroud may be affixed to the substrate, and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound to bond together all components of the subassembly and form the overmolded electronic package. The subassembly of components with the exception of the backplate may alternatively be overmolded with the molding compound, and a backplate thereafter affixed to the subassembly via a compliant bonding medium.
摘要翻译： 包覆成型的电子封装包括电路承载基板和通过适当的互连布置互连的连接器壳体或护罩。 一些实施例可以包括固定到基板的背板，并且在一些情况下还可以包括连接器壳体或护罩。 在一些实施例中，连接器壳体或护罩可以固定到基底上，并且在任何情况下，组件的整个子组件都用可刚性地形成的模制化合物进行包覆模制，以将所述子组件的所有部件结合在一起并形成包覆模制的电子封装。 组件除了背板之外的组件可以替代地用模制复合物包覆成型，然后后板通过柔性粘合介质固定到子组件上。
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