公开(公告)号：US08362955B2

公开(公告)日：2013-01-29

申请号：US13231360

申请日：2011-09-13

申请人： David Adams ,  Peter Deane ,  Steven Hall

发明人： David Adams ,  Peter Deane ,  Steven Hall

IPC分类号： H01Q3/00

CPC分类号： H01Q3/00 ,  H01Q1/246 ,  H01Q3/26 ,  H01Q25/002

摘要： A beamformer is arranged to receive an input from a first antenna element and from at least one other antenna element and to generate at least a first and second output beam. The first and second output beams are combined at a connecting port such that signals received at the first antenna element are constructively combined at the connecting port and signals received at another antenna element or elements are destructively combined at the connecting port, so that a receiver connected to the connecting port may receive signals from the first antenna element and may not receive signals from the other antenna element or elements. The arrangement may also be used to transmit a signal which is fed into the connecting point from the first antenna element and not from the other antenna element or elements.

摘要翻译： 波束形成器布置成从第一天线元件和至少一个其它天线元件接收输入并且产生至少第一和第二输出光束。 第一和第二输出光束在连接端口处组合，使得在第一天线元件处接收的信号在连接端口被建设性组合，并且在另一个天线元件处接收的信号在连接端口被破坏性组合，使得接收器连接 连接端口可以从第一天线元件接收信号，并且可能不接收来自其它天线元件的信号。 该装置还可以用于从第一天线元件而不是从另一个天线元件发送馈送到连接点的信号。

公开(公告)号：US09474082B2

公开(公告)日：2016-10-18

申请号：US12614522

申请日：2009-11-09

申请人： David Bevan ,  Simon Gale ,  Julius Robson ,  Peter Deane

发明人： David Bevan ,  Simon Gale ,  Julius Robson ,  Peter Deane

IPC分类号： H04W72/00 ,  H04W72/12 ,  H04B7/04 ,  H04W72/04

CPC分类号： H04W72/121 ,  H04B7/0452 ,  H04W72/046

摘要： The invention relates to a method and apparatus for determining whether two user equipments (UEs) in a wireless network can be co-scheduled by an uplink scheduler. The method includes the determination of orthogonality factors for each pair of equipments to be considered and, from the orthogonality factors, selecting UEs to be co-scheduled.

摘要翻译： 本发明涉及一种用于确定无线网络中的两个用户设备（UE）是否可以由上行链路调度器共同调度的方法和装置。 该方法包括确定要考虑的每对设备的正交因子，并且从正交因子中选择要共同调度的UE。

公开(公告)号：US08340724B2

公开(公告)日：2012-12-25

申请号：US13295123

申请日：2011-11-14

申请人： Steve Beaudin ,  Keith Russell Edwards ,  Xiaoyun Hu ,  Peter Deane

发明人： Steve Beaudin ,  Keith Russell Edwards ,  Xiaoyun Hu ,  Peter Deane

IPC分类号： H04B1/06 ,  H04B7/00 ,  H04B1/38 ,  H04M1/00

CPC分类号： H01Q1/246 ,  H01Q21/30 ,  H04B7/08 ,  H04W88/085

摘要： The present invention allows transmission of multiple signals between masthead electronics and base housing electronics in a base station environment. At least some of the received signals from the multiple antennas are translated to being centered about different center frequencies, such that the translated signals may be combined into a composite signal including each of the received signals. The composite signal is then sent over a single feeder cable to base housing electronics, wherein the received signals are separated and processed by transceiver circuitry. Prior to being provided to the transceiver circuitry, those signals that were translated from being centered about one frequency to another may be retranslated to being centered about the original center frequency.

摘要翻译： 本发明允许在基站环境中在桅顶电子设备和基座外壳电子设备之间传输多个信号。 来自多个天线的至少一些接收信号被转换为以不同的中心频率为中心，使得经翻译的信号可以被组合成包括每个接收信号的复合信号。 然后，复合信号通过单个馈电电缆发送到基座壳体电子器件，其中接收的信号由收发器电路分离和处理。 在被提供给收发器电路之前，从一个频率中心转换到另一个频率的那些信号可以被重新翻译为以原始中心频率为中心。

公开(公告)号：US20120058720A1

公开(公告)日：2012-03-08

申请号：US13295123

申请日：2011-11-14

申请人： Steve Beaudin ,  Keith Russell Edwards ,  Xiaoyun Hu ,  Peter Deane

发明人： Steve Beaudin ,  Keith Russell Edwards ,  Xiaoyun Hu ,  Peter Deane

IPC分类号： H03D7/16 ,  H04W88/08 ,  H04B7/12

CPC分类号： H01Q1/246 ,  H01Q21/30 ,  H04B7/08 ,  H04W88/085

摘要： The present invention allows transmission of multiple signals between masthead electronics and base housing electronics in a base station environment. At least some of the received signals from the multiple antennas are translated to being centered about different center frequencies, such that the translated signals may be combined into a composite signal including each of the received signals. The composite signal is then sent over a single feeder cable to base housing electronics, wherein the received signals are separated and processed by transceiver circuitry. Prior to being provided to the transceiver circuitry, those signals that were translated from being centered about one frequency to another may be retranslated to being centered about the original center frequency.

摘要翻译： 本发明允许在基站环境中在桅顶电子设备和基座外壳电子设备之间传输多个信号。 来自多个天线的至少一些接收信号被转换为以不同的中心频率为中心，使得转换的信号可以被组合成包括每个接收信号的复合信号。 然后，复合信号通过单个馈电电缆发送到基座壳体电子器件，其中接收的信号由收发器电路分离和处理。 在被提供给收发器电路之前，从一个频率中心转换到另一个频率的那些信号可以被重新翻译为以原始中心频率为中心。

公开(公告)号：US20110115071A1

公开(公告)日：2011-05-19

申请号：US13013563

申请日：2011-01-25

申请人： Peter Smeys ,  Peter Johnson ,  Peter Deane ,  Reda R. Razouk

发明人： Peter Smeys ,  Peter Johnson ,  Peter Deane ,  Reda R. Razouk

IPC分类号： H01L23/522 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to an integrated circuit package in which one or more integrated circuits are embedded in a substrate and covered with a layer of photo-imageable epoxy. The substrate can be made of various materials, including silicon, quartz and glass. An integrated circuit is positioned within a cavity in the top surface of the substrate. The epoxy layer is formed over the top surface of the substrate and the active face of the integrated circuit. An interconnect layer is formed over the epoxy layer and is electrically coupled with the integrated circuit.

摘要翻译： 描述了用于形成集成电路封装的各种装置和方法。 本发明的一个方面涉及一种集成电路封装，其中一个或多个集成电路嵌入在基片中并被一层可光成像的环氧树脂覆盖。 基板可以由各种材料制成，包括硅，石英和玻璃。 集成电路位于衬底的顶表面中的空腔内。 环氧树脂层形成在衬底的顶表面和集成电路的有源面上。 在环氧树脂层上形成互连层并与集成电路电耦合。

公开(公告)号：US07842544B2

公开(公告)日：2010-11-30

申请号：US12479713

申请日：2009-06-05

申请人： Peter Smeys ,  Peter Johnson ,  Peter Deane

发明人： Peter Smeys ,  Peter Johnson ,  Peter Deane

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L21/50 ,  H01L21/48

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/642 ,  H01L23/645 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/112 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to a wafer level method for packaging micro-systems. A substrate prefabricated with metal vias can be provided. The substrate can also be made by forming holes in a substrate and electroplating an electrically conductive material into the holes to form the vias. Multiple microsystems are formed on a top surface of the substrate. Each microsystem is formed to include multiple layers of planarizing, photo-imageable epoxy, one or more interconnect layers and an integrated circuit. Each interconnect layer is embedded in an associated epoxy layer. The integrated circuit is positioned within at least an associated epoxy layer. The interconnect layers of the microsystems are formed such that at least some of the interconnect layers are electrically coupled with one or more of the metal vias in the substrate. Molding material is applied over the top surface of the substrate and the microsystems to form a molded structure. Portions of the substrate can be removed. The molded structure can be singulated to form individual integrated circuit packages. Each of the integrated circuit packages contains at least one microsystem. Various embodiments involve forming conductive pads on the top surface of the substrate instead of the metal vias.

摘要翻译： 描述了用于形成集成电路封装的各种装置和方法。 本发明的一个方面涉及用于封装微系统的晶片级方法。 可以提供用金属通孔预制的基板。 衬底也可以通过在衬底中形成孔并且将导电材料电镀到孔中以形成通孔来制造。 多个微系统形成在衬底的顶表面上。 每个微系统被形成为包括多层平坦化，光可光刻环氧树脂，一个或多个互连层和集成电路。 每个互连层嵌入相关联的环氧树脂层。 集成电路位于至少相关的环氧树脂层内。 微系统的互连层形成为使得至少一些互连层与衬底中的一个或多个金属通孔电耦合。 将成型材料施加在基板的顶表面和微系统上以形成模制结构。 可以去除基底的一部分。 模制结构可以被单个化以形成单独的集成电路封装。 每个集成电路封装包含至少一个微系统。 各种实施例涉及在衬底的顶表面上形成导电焊盘，而不是金属过孔。

公开(公告)号：US07086788B2

公开(公告)日：2006-08-08

申请号：US11095637

申请日：2005-03-30

申请人： William Paul Mazotti ,  Peter Deane ,  Luu Thanh Nguyen ,  Ken Pham ,  Bruce Carlton Roberts ,  Jia Liu ,  Yongseon Koh ,  John P. Briant ,  Roger William Clarke ,  Michael R. Nelson ,  Christopher J. Smith ,  Janet E. Townsend

发明人： William Paul Mazotti ,  Peter Deane ,  Luu Thanh Nguyen ,  Ken Pham ,  Bruce Carlton Roberts ,  Jia Liu ,  Yongseon Koh ,  John P. Briant ,  Roger William Clarke ,  Michael R. Nelson ,  Christopher J. Smith ,  Janet E. Townsend

IPC分类号： G02B6/36

CPC分类号： G02B6/4201 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/0219 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

摘要翻译： 描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。 具体地说，描述了光电子元件及其制造方法。 在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。 半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。 半导体芯片组件和光子器件都与基底衬底上的迹线电连接。 半导体芯片组件通常被布置成电连接到外部设备。 光子器件通常布置成与一根或多根光纤光学通信。 所描述的结构可以与各种各样的光子器件一起使用。 在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。 在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

公开(公告)号：US07073961B2

公开(公告)日：2006-07-11

申请号：US11050073

申请日：2005-02-01

申请人： William Paul Mazotti ,  Jia Liu ,  Luu Thanh Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

发明人： William Paul Mazotti ,  Jia Liu ,  Luu Thanh Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4251

摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

摘要翻译： 描述了以使得光子器件免受可能由于暴露于环境和物理处理引起的损害的方式制造光传输装置的技术。 本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。 本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。 光传输设备可以被配置为用作光接收器，检测器或收发器设备。

公开(公告)号：US06973225B2

公开(公告)日：2005-12-06

申请号：US10165548

申请日：2002-06-06

申请人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Hau Thanh Nguyen ,  John P. Briant ,  Roger Clarke ,  Michael R. Nelson ,  Janet E. Townsend

发明人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Hau Thanh Nguyen ,  John P. Briant ,  Roger Clarke ,  Michael R. Nelson ,  Janet E. Townsend

IPC分类号： H01L27/144 ,  H01L31/0203 ,  H01L31/18 ,  G02B6/12

CPC分类号： H01L27/144 ,  H01L31/0203 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： The techniques of the present invention are directed towards setting a photonic device into a groove of a substrate, which is then attached to the chip sub-assembly in a way that the resulting optoelectronic package has a low profile and the interconnects between the photonic device and the semiconductor chip are short. The technique involves partially etching a groove in a substrate to allow for positioning of a photonic device within the groove. The photonic device is connected to the chip sub-assembly through interconnects that extend through the thickness of the substrate. The photonic devices are placed on their sides so that the active facets are perpendicular to the main axis of the chip sub-assembly. In this configuration, the optical fibers can be positioned parallel to the CSA top surface, ensuring a low module profile in the process.

摘要翻译： 本发明的技术旨在将光子器件设置到衬底的凹槽中，然后将其附接到芯片子组件，使得所得光电封装具有低轮廓，并且光子器件和 半导体芯片很短。 该技术涉及部分蚀刻衬底中的凹槽以允许将光子器件定位在凹槽内。 光子器件通过延伸穿过衬底厚度的互连连接到芯片子组件。 光子器件放置在它们的侧面上，使得有源刻面垂直于芯片子组件的主轴线。 在这种配置中，光纤可以平行于CSA顶面定位，从而确保了该过程中的低模块轮廓。

公开(公告)号：US20050157990A1

公开(公告)日：2005-07-21

申请号：US11050073

申请日：2005-02-01

申请人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

发明人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

IPC分类号： G02B6/42

CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4251

摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

摘要翻译： 描述了以使得光子器件免受可能由于暴露于环境和物理处理引起的损害的方式制造光传输装置的技术。 本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。 本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。 光传输设备可以被配置为用作光接收器，检测器或收发器设备。