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    Electroformed metallization
    1.
    发明申请
    Electroformed metallization 失效
    电铸金属化

    公开(公告)号：US20050282399A1

    公开(公告)日：2005-12-22

    申请号：US10871938

    申请日：2004-06-17

    申请人： David Evans ,  John Hartzell

    发明人： David Evans ,  John Hartzell

    IPC分类号： C23C18/16 ,  C23C18/54 ,  C25D1/04 ,  C25D5/02 ,  C25D5/54 ,  G02F1/13 ,  H01L21/288 ,  H01L21/768 ,  H01J1/02 ,  H01L21/31 ,  H01L21/44 ,  H01L21/469

    CPC分类号： H01L21/288 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/1657 ,  C25D1/003 ,  C25D5/022 ,  C25D5/50 ,  H01L21/2885 ,  H01L21/76885

    摘要： A method is provided for electroforming metal integrated circuit structures. The method comprises: forming an opening such as a via or line through an interlevel insulator, exposing a substrate surface; forming a base layer overlying the interlevel insulator and substrate surface; forming a strike layer overlying the base layer; forming a top layer overlying the strike layer; selectively etching to remove the top layer overlying the substrate surface, exposing a strike layer surface; and, electroforming a metal structure overlying the strike layer surface. The electroformed metal structure is deposited using an electroplating or electroless deposition process. Typically, the metal is Cu, Au, Ir, Ru, Rh, Pd, Os, Pt, or Ag. The base, strike, and top layers can be deposited using physical vapor deposition (PVD), evaporation, reactive sputtering, or metal organic chemical vapor deposition (MOCVD).

    摘要翻译： 提供了一种电铸金属集成电路结构的方法。 该方法包括：通过层间绝缘体形成诸如通孔或线的开口，暴露衬底表面; 形成覆盖层间绝缘体和衬底表面的基层; 形成覆盖基层的冲击层; 形成覆盖所述冲击层的顶层; 选择性蚀刻以去除覆盖在衬底表面上的顶层，暴露出一层击打层表面; 并且电铸在覆盖着撞击层表面的金属结构。 使用电镀或无电沉积工艺沉积电铸金属结构。 通常，金属是Cu，Au，Ir，Ru，Rh，Pd，Os，Pt或Ag。 可以使用物理气相沉积（PVD），蒸发，反应溅射或金属有机化学气相沉积（MOCVD）来沉积基底，打击和顶层。

    Electroformed metal structure
    2.
    发明申请
    Electroformed metal structure 有权
    电铸金属结构

    公开(公告)号：US20080054469A1

    公开(公告)日：2008-03-06

    申请号：US11978909

    申请日：2007-10-30

    申请人： David Evans ,  John Hartzell

    发明人： David Evans ,  John Hartzell

    IPC分类号： H01L23/52

    CPC分类号： H01L21/288 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/1657 ,  C25D1/003 ,  C25D5/022 ,  C25D5/50 ,  H01L21/2885 ,  H01L21/76885

    摘要： A method is provided for electroforming metal integrated circuit structures. The method comprises: forming an opening such as a via or line through an interlevel insulator, exposing a substrate surface; forming a base layer overlying the interlevel insulator and substrate surface; forming a strike layer overlying the base layer; forming a top layer overlying the strike layer; selectively etching to remove the top layer overlying the substrate surface, exposing a strike layer surface; and, electroforming a metal structure overlying the strike layer surface. The electroformed metal structure is deposited using an electroplating or electroless deposition process. Typically, the metal is Cu, Au, Ir, Ru, Rh, Pd, Os, Pt, or Ag. The base, strike, and top layers can be deposited using physical vapor deposition (PVD), evaporation, reactive sputtering, or metal organic chemical vapor deposition (MOCVD).

    摘要翻译： 提供了一种电铸金属集成电路结构的方法。 该方法包括：通过层间绝缘体形成诸如通孔或线的开口，暴露衬底表面; 形成覆盖层间绝缘体和衬底表面的基层; 形成覆盖基层的冲击层; 形成覆盖所述冲击层的顶层; 选择性蚀刻以去除覆盖在衬底表面上的顶层，暴露出一层击打层表面; 并且电铸在覆盖着撞击层表面的金属结构。 使用电镀或无电沉积工艺沉积电铸金属结构。 通常，金属是Cu，Au，Ir，Ru，Rh，Pd，Os，Pt或Ag。 可以使用物理气相沉积（PVD），蒸发，反应溅射或金属有机化学气相沉积（MOCVD）来沉积基底，打击和顶层。

    Enzyme inhibitor compounds
    5.
    发明授权
    Enzyme inhibitor compounds 有权

    公开(公告)号：US09150574B2

    公开(公告)日：2015-10-06

    申请号：US14344417

    申请日：2011-09-14

    申请人： David Evans ,  Allison Carley ,  Alison Stewart ,  Michael Higginbottom ,  Edward Savory ,  Iain Simpson ,  Marianne Nilsson ,  Martin Haraldsson ,  Erik Nordling ,  Tobias Koolmeister

    发明人： David Evans ,  Allison Carley ,  Alison Stewart ,  Michael Higginbottom ,  Edward Savory ,  Iain Simpson ,  Marianne Nilsson ,  Martin Haraldsson ,  Erik Nordling ,  Tobias Koolmeister

    IPC分类号： C07D471/02 ,  A61K31/55 ,  C07D471/04

    CPC分类号： C07D471/04

    摘要： 2-{4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}ethan-1-amine; 3-aminopropyl 4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidine-1-carboxylate; 1-{4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}-4-(dimethylamino)butan-1-one; 5-amino-1-{4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}pentan-1-one; N-(2-aminoethyl)-4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidine-1-carboxamide; N-(3-aminopropyl)-4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidine-1-carboxamide; 4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]-N-[3-(dimethylamino)propyl]piperidine-1-carboxamide; 1-({4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}carbonyl)piperazine; 4-({4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}carbonyl)morpholine; 1-({4-[1-(4-chlorophenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]piperidin-1-yl}carbonyl)-1,4-diazepane; ethyl 1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-4-carboxylate; ethyl 1-[1-(4-methylphenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-4-carboxylate; 1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-4-carboxylic acid; N-(2-aminoethyl)-1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-4-carboxamide; 4-({1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidin-4yl}carbonyl)morpholine; 1-({1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidin-4-yl}carbonyl)piperazine; {4-[1-(4-methylphenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholin-3-yl}methanol; {4-[1-(4-methyl-phenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholin-2-yl}methanol; [(3R)-4-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholin-3-yl]methanol; methyl 4-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholine-3-carboxylate; N-(2-aminoethyl)-4-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholine-3-carboxamide; 2-{4-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]morpholin-3-yl}ethan-1-ol; methyl 1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-2-carboxylate; N-(2-aminoethyl)-1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidine-2-carboxamide; 1-({1-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidin-2-yl}carbonyl)piperazine; 4-[1-(4-methylphenyl)-1H-pyrrolo[2,3-c]pyridin-3-yl]morpholine; 1-(4-chlorophenyl)-3-(piperidin-4-yl)-1H-pyrrolo[2,3-c]pyridin-4-ol; N-butyl-1-(4-chlorophenyl)-N-methyl-1H-pyrazolo[3,4-c]pyridin-3-amine; 1-[4-(fluoromethyl)phenyl]-3-(oxan-4-yl)-1H-pyrazolo[3,4-c]pyridine; and 3-({4-[1-(4-chlorophenyl)-1H-pyrazolo[3,4-c]pyridin-3-yl]piperidin-1-yl}methyl)pyridine are useful for the inhibition of SSAO activity.

    Pool Construction Method
    7.
    发明申请
    Pool Construction Method 审中-公开
    池施工方法

    公开(公告)号：US20140304906A1

    公开(公告)日：2014-10-16

    申请号：US13859818

    申请日：2013-04-10

    申请人： Walter Judson Bennett ,  David Evans

    发明人： Walter Judson Bennett ,  David Evans

    IPC分类号： E04H4/14 ,  E02D3/00

    CPC分类号： E02D3/00 ,  E04H4/0037 ,  E04H4/0056 ,  E04H2004/146 ,  Y10T29/49801

    摘要： The present invention relates to a new construction method for swimming pools, surfing pools, body boarding pools, wave pools, water park pools, kayaking and white water rafting courses and pools, wake boarding pools, water skiing pools and jet skiing pools, static surfing simulators, deep water river standing wave attractions. The present invention construction method can also be used in lagoons, ponds, lakes, and rivers. The invention will save construction costs, and save pool construction time.

    摘要翻译： 本发明涉及游泳池，冲浪池，身体游泳池，波浪池，水上公园游泳池，皮划艇和白水漂流课程和游泳池，唤醒游泳池，滑水游泳池和喷气式滑雪游泳池的新的施工方法，静态冲浪 模拟器，深水河站立波浪景点。 本发明的施工方法也可用于泻湖，池塘，湖泊和河流。 本发明可节省施工成本，节约施工时间。

    Method and system for assessing a musical performance
    9.
    发明授权
    Method and system for assessing a musical performance 失效
    用于评估音乐表演的方法和系统

    公开(公告)号：US08367921B2

    公开(公告)日：2013-02-05

    申请号：US11568265

    申请日：2005-01-31

    申请人： David Evans ,  Benjamin Ruciak ,  William Thorpe

    发明人： David Evans ,  Benjamin Ruciak ,  William Thorpe

    IPC分类号： G04B13/00

    CPC分类号： G09B15/00 ,  G09B5/04

    摘要： The invention relates to a method and system for assessing a performance of a musical composition in relation to a model performance of the same composition. In particular, as even a model performance does not follow a score of a composition precisely, the present invention initially correlates the model performance to a score of the performed composition. This allows for an accurate assessment of the timing of the assessable performance, relative to the timing of the model performance. The invention is of particular use where the assessable performance is performed along with the model performance, but the two performances are remote from each other.

    摘要翻译： 本发明涉及一种用于评估与相同构图的模型演奏相关的乐曲的演奏的方法和系统。 特别地，即使模型性能也不能精确地跟随组合得分，本发明最初将模型性能与所执行的组合的得分相关联。 这样可以准确地评估可评估绩效的时间，相对于模型绩效的时间。 本发明在评估性能与模型性能一起执行时具有特别的用途，但两种性能彼此远离。

    Multi-touch detection
    10.
    发明授权
    Multi-touch detection 有权
    多点触摸检测

    公开(公告)号：US08358268B2

    公开(公告)日：2013-01-22

    申请号：US12178415

    申请日：2008-07-23

    申请人： David Evans

    发明人： David Evans

    IPC分类号： G09G5/00

    CPC分类号： G06F3/041 ,  G01S7/003 ,  G01S7/497 ,  G01S15/876 ,  G01S17/87

    摘要： A multi-touch system is provided. The multi-touch system includes a multi-touch detection area generated by a mobile device and a first communication device, the mobile device and first or second communication device being movable relative to each other. The mobile device is operable to determine a first set of coordinates for a first detectable object within the multi-touch detection area as a function of: a distance between the mobile device and the first communication device, a distance between the mobile device and first detectable object, and a distance between the first communication device and first detectable object.

    摘要翻译： 提供多点触控系统。 多点触摸系统包括由移动设备和第一通信设备生成的多点触摸检测区域，移动设备和第一或第二通信设备可相对于彼此移动。 移动设备可操作以根据以下功能确定多点触摸检测区域内的第一可检测对象的第一组坐标：移动设备与第一通信设备之间的距离，移动设备与第一可检测对象之间的距离 物体和第一通信设备与第一可检测对象之间的距离。