公开(公告)号：US06490033B1

公开(公告)日：2002-12-03

申请号：US09478149

申请日：2000-01-05

申请人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  Franklin Roy Dietz ,  Ranjani C. Muthiah ,  Sonja Radelow

发明人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  Franklin Roy Dietz ,  Ranjani C. Muthiah ,  Sonja Radelow

IPC分类号： G01J110

CPC分类号： G01B11/0675

摘要： A method of calibrating an interferometer system and a multilayer thin film used for calibrating the interferometer system. The method including measuring the step height of a gold step with the interferometer system, the multilayer thin film comprising a gold layer that defines the gold step. The multilayer thin film having an optical flat, a first layer on the surface of the optical flat, a second layer on the first layer, a test layer on a part of the second layer, and a gold layer on the test layer and on a part of the second layer uncovered by the test layer. The test layer having a test layer step, and the gold layer having a gold step over the test layer step. Also, a reference standard and a method of making the reference standard for a thin film sample with one or more component thin film layers, the reference standard having a gold layer over the surface of the thin film sample.

摘要翻译： 校准干涉仪系统和用于校准干涉仪系统的多层薄膜的方法。 该方法包括用干涉仪系统测量金台阶的台阶高度，多层薄膜包括限定金阶的金层。 所述多层薄膜具有光学平面，在光学平面的表面上的第一层，第一层上的第二层，第二层的一部分上的测试层，以及测试层上的金层 由测试层覆盖的第二层的一部分。 所述测试层具有测试层步骤，并且所述金层在所述测试层步骤上具有金阶。 此外，参考标准和制备具有一个或多个组分薄膜层的薄膜样品的参考标准的方法，参考标准在薄膜样品的表面上具有金层。

公开(公告)号：US5990560A

公开(公告)日：1999-11-23

申请号：US955686

申请日：1997-10-22

申请人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  John William Osenbach ,  Yiu-Man Wong

发明人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  John William Osenbach ,  Yiu-Man Wong

IPC分类号： B23K1/00 ,  B23K31/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/14 ,  H01L23/48

CPC分类号： B23K35/0238 ,  B23K35/001

摘要： An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.

摘要翻译： 公开了用于实现动力学控制的焊料接合的改进的方法和组合物，其特别适用于制造混合集成电路和光学组件。 该方法包括使用焊料层，淬火层和设置在焊料层和淬火层之间的控制层，其中控制层有利地由铂薄膜组成。 此外，还优选由铂薄膜构成的阻挡层设置在焊料层和待接合部件之间，以防止在焊接过程期间焊料材料的氧化或焊接部件的后续存储。

公开(公告)号：US06342442B1

公开(公告)日：2002-01-29

申请号：US09197074

申请日：1998-11-20

申请人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

发明人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00014

摘要： An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture. The melting temperature of the liquid mixture increases with time as the composition changes until the melting temperature of the liquid mixture is about equal to the bonding temperature thereby soldifying the liquid mixture into a bond. The parts are then held at a holding temperature which is higher than the storage temperature to maintain diffusion of the other one of the first and second chemical element layers into the bond. This forms a quantity of the intermetallic compound in the bond which is sufficient to raise the melting temperature of the bond to a desired usage temperature that is substantially above the first melting temperature. The intermetallic compound is typically composed of a ternary solder composition.

摘要翻译： 用于动力学受控部件粘合的改进的方法和焊料组成。 所述方法包括将金属间化合物的至少第一化学元素层施加到第一部分，并将至少第二化学元素层施加到金属间化合物到第二部分。 将第一和第二部分放置在一起，使得化学元件层彼此接触。 将部件从储存温度加热到稍高于将第一和第二部分之一的化学元素层熔化成液体混合物的第一熔融温度的接合温度。 液体混合物的组成随加热过程中的时间而变化，因为其中的金属间化合物的形成通过将第一和第二化学元素层中的另一个逐渐掺入混合物中而变化。 随着组合物变化，液体混合物的熔融温度随着时间的推移而增加，直到液体混合物的熔融温度大约等于粘结温度，从而将液体混合物装入粘合剂中。 然后将部件保持在高于储存温度的保持温度，以保持第一和第二化学元件层中的另一个的扩散进入粘合。 这形成了一定量的粘结中的金属间化合物，其足以将粘结的熔融温度升高到基本上高于第一熔融温度的所需使用温度。 金属间化合物通常由三元焊料组合物组成。

公开(公告)号：US06184582B2

公开(公告)日：2001-02-06

申请号：US09069396

申请日：1998-04-29

申请人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  Bryan Phillip Segner

发明人： David Gerald Coult ,  Gustav Edward Derkits, Jr. ,  Bryan Phillip Segner

IPC分类号： H01L2348

CPC分类号： H01L23/49811 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： Compliant standoffs are disposed on a support surface of a semiconductor or hybrid semiconductor device. The standoffs extend further from the support surface than other active or passive structures associated with the (hybrid) semiconductor device, and are spaced at least a minimum distance from such associated structures. Each compliant standoff provides a surface at which auxiliary devices, such as optical subassemblies, lightwave circuits and the like, can be attached. Since the compliant standoffs extend further from the support surface than other associated structures, such other associated structures are protected from potentially damaging contact with the auxiliary device(s) being attached to the compliant standoffs. Moreover, since the compliant standoffs are spaced from such other asociated structures, potentially damaging thermal and mechanical stresses (imparted to the standoffs as a result of the contact with an auxiliary device such as during bonding) are substantially dissipated by the compliant standoff and directed into the support rather than the other associated structures. The compliant standoffs advantageously comprise conductive materials such that they may be placed in ohmic electrical contact with at least one active region of the (hybrid) semiconductor device.

摘要翻译： 合适的支座设置在半导体或混合半导体器件的支撑表面上。 与其他与（混合）半导体器件相关联的有源或无源结构，支座从支撑表面进一步延伸，并且与这种相关结构间隔开至少最小的距离。 每个顺应的支座提供了一个表面，在该表面上可附接诸如光学子组件，光波回路等的辅助装置。 由于顺从的支座从支撑表面进一步延伸到其他相关联的结构，所以这种其它相关联的结构被保护以防止与被附接到柔性支座的辅助装置的潜在的破坏性接触。 此外，由于顺应性支座与其他相关结构间隔开，所以潜在的破坏性热力和机械应力（由于与辅助装置的接触而导致的间隙（例如在接合期间）被施加） 支持而不是其他相关的结构。 柔性支座有利地包括导电材料，使得它们可以与（混合）半导体器件的至少一个有源区域欧姆电接触放置。

公开(公告)号：US07009299B2

公开(公告)日：2006-03-07

申请号：US10021174

申请日：2001-10-29

申请人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

发明人： David L. Angst ,  David Gerald Coult ,  John William Osenbach ,  Gustav Edward Derkits, Jr. ,  Brian Stauffer Auker

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/32 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00014

摘要： An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture. The melting temperature of the liquid mixture increases with time as the composition changes until the melting temperature of the liquid mixture is about equal to the bonding temperature thereby soldifying the liquid mixture into a bond. The parts are then held at a holding temperature which is higher than the storage temperature to maintain diffusion of the other one of the first and second chemical element layers into the bond. This forms a quantity of the intermetallic compound in the bond which is sufficient to raise the melting temperature of the bond to a desired usage temperature that is substantially above the first melting temperature. The intermetallic compound is typically composed of a ternary solder composition.

摘要翻译： 用于动力学受控部件粘合的改进的方法和焊料组成。 所述方法包括将金属间化合物的至少第一化学元素层施加到第一部分，并将至少第二化学元素层施加到金属间化合物到第二部分。 将第一和第二部分放置在一起，使得化学元件层彼此接触。 将部件从储存温度加热到稍高于将第一和第二部分之一的化学元素层熔化成液体混合物的第一熔融温度的接合温度。 液体混合物的组成随加热过程中的时间而变化，因为其中的金属间化合物的形成通过将第一和第二化学元素层中的另一个逐渐掺入混合物中而变化。 随着组合物变化，液体混合物的熔融温度随着时间的推移而增加，直到液体混合物的熔融温度大约等于粘结温度，从而将液体混合物装入粘合剂中。 然后将部件保持在高于储存温度的保持温度，以保持第一和第二化学元件层中的另一个的扩散进入粘合。 这形成了一定量的粘结中的金属间化合物，其足以使粘结的熔融温度升高到基本上高于第一熔融温度的所需使用温度。 金属间化合物通常由三元焊料组合物组成。

公开(公告)号：US06489232B1

公开(公告)日：2002-12-03

申请号：US09583699

申请日：2000-05-31

申请人： Gustav Edward Derkits, Jr. ,  Leslie Marchut ,  Franklin R. Nash

发明人： Gustav Edward Derkits, Jr. ,  Leslie Marchut ,  Franklin R. Nash

IPC分类号： H01L214763

CPC分类号： H01L31/105 ,  H01L31/02161 ,  H01L31/107

摘要： A semiconductor device such as a photodetector has a substrate having an active region layer containing an active region of the device. A dielectric layer is disposed on the active region layer, and a metal active region contact is disposed in the dielectric layer above the active region and electrically contacting the active region. A metal electrostatic discharge (ESD) protection structure is disposed in the dielectric layer around the active region contact, wherein the ESD protection structure electrically contacts the active region layer of the substrate to provide an ESD discharge path for charge on the surface of the dielectric layer.

摘要翻译： 诸如光电检测器的半导体器件具有衬底，该衬底具有包含该器件的有源区的有源区。 电介质层设置在有源区上，并且在有源区上方的电介质层中设置有金属有源区接触，并与活性区电接触。 金属静电放电（ESD）保护结构设置在有源区触点周围的电介质层中，其中ESD保护结构与衬底的有源区层电接触以提供用于电介质层表面上的电荷的ESD放电路径 。

公开(公告)号：US5995293A

公开(公告)日：1999-11-30

申请号：US12622

申请日：1998-01-23

申请人： Gustav Edward Derkits, Jr. ,  John VanAtta Gates

发明人： Gustav Edward Derkits, Jr. ,  John VanAtta Gates

IPC分类号： G02B6/36 ,  G02B6/42 ,  G02B7/00 ,  G02B7/02 ,  G02B27/62 ,  G02B27/64 ,  H01L31/0232 ,  H01S5/00 ,  H01S5/022 ,  G02B3/00

CPC分类号： G02B6/3628 ,  G02B27/62 ,  G02B27/648 ,  G02B6/4219 ,  G02B6/4226 ,  G02B7/003 ,  G02B6/3612 ,  G02B6/4204

摘要： A self-orienting optical component advantageous for assembling sub-optical assemblies in which the components must be precisely aligned comprises a component having a magnetic film deposited on a portion of its outer surface so that a magnetic field applied adjacent the optical component will induce the optical component to move to a pre-determined orientation. Advantageously, the optical component also has further layers deposited on portions of its outer surface for aiding in adhesion, soldering, or light transmission. An improved method of assembling an optical subassembly comprises depositing a film of magnetic material over a portion of the outer surface of the optical component and applying a magnetic field to the optical component to induce it to move to a pre-determined orientation to aid in positioning it on a submount.

摘要翻译： 用于组装子组件必须精确对准的子光学组件的自取向光学部件包括具有沉积在其外表面的一部分上的磁性膜的部件，使得邻近光学部件施加的磁场将引起光学 组件移动到预定方向。 有利地，光学部件还具有沉积在其外表面的部分上的另外的层，用于辅助粘合，焊接或光透射。 一种改进的组装光学子组件的方法包括在光学部件的外表面的一部分上沉积磁性材料膜并向光学部件施加磁场以使其移动到预定方向以帮助定位 它在一个基座上。

公开(公告)号：US5861665A

公开(公告)日：1999-01-19

申请号：US853735

申请日：1997-05-13

申请人： Gustav Edward Derkits, Jr. ,  John Lopata ,  Franklin Richard Nash

发明人： Gustav Edward Derkits, Jr. ,  John Lopata ,  Franklin Richard Nash

IPC分类号： G02B6/42 ,  H01L23/26 ,  H01S5/022 ,  H05K5/06 ,  H01L23/20

CPC分类号： H01L23/26 ,  H01S5/02216 ,  H01L2924/0002 ,  H01S5/02204 ,  H01S5/02248 ,  H01S5/0683

摘要： Disclosed is an optical and/or microelectronics hermetic package which includes a member for absorbing hydrogen from the internal package ambient. The member includes a first layer which forms a hydride and, formed thereover, a second layer which forms solvated hydrogen upon exposure to molecular hydrogen in the package. The second layer acts as a one way valve for transporting hydrogen to the first layer which locks up the hydrogen.

摘要翻译： 公开了一种光学和/或微电子封装，其包括用于从内部封装环境吸收氢的部件。 该构件包括形成氢化物并在其上形成第二层的第一层，其在暴露于包装中的分子氢时形成溶剂化氢。 第二层用作将氢气输送到锁定氢气的第一层的单向阀。

公开(公告)号：US5989637A

公开(公告)日：1999-11-23

申请号：US61410

申请日：1998-04-16

申请人： John S. Rizzo ,  Gustav Edward Derkits, Jr. ,  Raymond Frank Gruszka ,  John E. Boyd

发明人： John S. Rizzo ,  Gustav Edward Derkits, Jr. ,  Raymond Frank Gruszka ,  John E. Boyd

IPC分类号： H01S5/02 ,  H01S5/028 ,  H01S5/042 ,  B05D1/32

CPC分类号： H01S5/028 ,  H01S5/0201 ,  H01S5/0425

摘要： A method and apparatus for preventing overspray onto bonding pads of a laser bar during facet coating includes manufacturing inserts with gaskets that are aligned with the laser bar such that the gaskets mask off the bonding pads during the facet coating process so that no overspray onto the bonding pads occurs. The gaskets are preferably made of gold with a thin titanium coating to prevent thermal compression bonding with the bonding pads. The inserts with gaskets are preferably manufactured using standard wafer processing techniques. The gaskets are preferably formed using the compliant layer metalization process described in U.S. Pat. No. 5,559,817.

摘要翻译： 用于在小面涂覆期间防止过度喷涂到激光棒的焊盘上的方法和装置包括制造具有与激光棒对准的垫圈的插入件，使得垫圈在小面涂覆过程期间掩模接合焊盘，使得不会在焊接上过度喷涂 垫发生。 垫片优选由具有薄钛涂层的金制成，以防止与焊盘的热压接。 具有垫圈的插入件优选地使用标准晶片处理技术来制造。 垫圈优选地使用美国专利No.4,615,515中描述的柔顺层金属化方法形成。 第5,559,817号。

公开(公告)号：US5744733A

公开(公告)日：1998-04-28

申请号：US831583

申请日：1997-04-09

申请人： Paul Michael Bridenbaugh ,  Gustav Edward Derkits, Jr. ,  Franklin Richard Nash

发明人： Paul Michael Bridenbaugh ,  Gustav Edward Derkits, Jr. ,  Franklin Richard Nash

IPC分类号： G01N17/00

CPC分类号： G01N17/00

摘要： The specification describes a test procedure for evaluating the susceptibility of electronic and photonic device packages to degradation effects caused by ambient hydrogen in the device package during the service life of the packaged device. The test procedure uses a hydrogen soak in which the subassembly parts are immersed in high concentrations of hydrogen gas at moderately elevated temperatures. The hydrogen gas is preferably diluted with an inert gas such as nitrogen or argon for safety in handling and processing. The test procedure can be used to screen components once their susceptibility to hydrogen attack has been established.

摘要翻译： 本说明书描述了一种用于评估电子和光子器件封装对于在封装器件的使用寿命期间由器件封装中的环境氢引起的降解效应的测试程序。 测试程序使用氢气浸泡，其中将组件部件浸入中等升高的高浓度氢气中。 氢气优选用惰性气体例如氮气或氩气稀释，以便于处理和处理的安全性。 一旦它们对氢气攻击的敏感性已经建立，测试程序可用于筛选组件。