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1.发明授权Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate 有权用于与导热板接触的功率调节器模块和微处理器的热和机械管理的方法和装置公开(公告)号：US06452804B1
公开(公告)日：2002-09-17
申请号：US09802329
申请日：2001-03-08
IPC分类号： H05K720
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2224/0401
摘要： A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
摘要翻译： 公开了一种用于在控制电磁辐射的同时从微处理器供电和去除热量的堆叠组件。 堆叠组件包括具有第一侧和第二侧的VRM电路板或功率调节模块; 诸如具有第一侧和第二侧的蒸气板的导热板，其中所述导热板第一侧热耦合到所述VRM电路板的第二侧; 以及具有第一侧和第二侧的微处理器，所述微处理器第一侧热耦合到所述蒸汽板第二侧。
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2.发明授权公开(公告)号：US06618268B2
公开(公告)日：2003-09-09
申请号：US09801437
申请日：2001-03-08
申请人： Joseph T. Dibene, II , David H. Hartke , Edward J. Derian , Carl E. Hoge , James M. Broder , Jose B. San Andres , Joseph S. Riel
发明人： Joseph T. Dibene, II , David H. Hartke , Edward J. Derian , Carl E. Hoge , James M. Broder , Jose B. San Andres , Joseph S. Riel
IPC分类号： H01R1216
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2924/0002 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.
摘要翻译： 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。
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3.发明授权公开(公告)号：US06556455B2
公开(公告)日：2003-04-29
申请号：US10022454
申请日：2001-10-30
IPC分类号： H01R1216
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/368 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2036 , H01L2924/00
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并且允许大量的电流从一个基板静态或动态地从一个基板传递到下一个基板。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。
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4.发明申请SUPPLY VOLTAGE CONTROL BASED AT LEAST IN PART ON POWER STATE OF INTEGRATED CIRCUIT 审中-公开基于集成电路功率状态的供电电压控制公开(公告)号：US20150109051A1
公开(公告)日：2015-04-23
申请号：US14582799
申请日：2014-12-24
摘要： Disclosed is a switching voltage regulator circuitry controlled to supply a voltage to at least a portion of an integrated circuit (IC). Information corresponding to a current load for a different power state of at least a portion of the IC is received. The switching voltage regulator circuitry is controlled to adjust the voltage to a different value based at least in part on the received information. Disclosed is a voltage received for a power state of at least a portion of an IC having first logic to perform one or more functions and second logic integrated with the first logic. Information corresponding to a current load for a different power state of at least a portion of the IC is sent from the second logic to voltage regulator control logic to adjust the voltage to a different value.
摘要翻译： 公开了一种被控制为向集成电路（IC）的至少一部分提供电压的开关稳压器电路。 接收对应于IC的至少一部分的不同功率状态的当前负载的信息。 控制开关电压调节器电路以至少部分地基于所接收的信息将电压调整到不同的值。 公开了针对具有执行一个或多个功能的第一逻辑的IC的至少一部分的功率状态接收的电压和与第一逻辑集成的第二逻辑。 对应于IC的至少一部分的不同功率状态的当前负载的信息从第二逻辑被发送到电压调节器控制逻辑以将电压调整到不同的值。
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公开(公告)号：US08482269B2
公开(公告)日：2013-07-09
申请号：US13299331
申请日：2011-11-17
IPC分类号： G05F1/40
摘要： Disclosed is a switching voltage regulator circuitry controlled to supply a voltage to at least a portion of an integrated circuit (IC). Information corresponding to a current load for a different power state of at least a portion of the IC is received. The switching voltage regulator circuitry is controlled to adjust the voltage to a different value based at least in part on the received information. Disclosed is a voltage received for a power state of at least a portion of an IC having first logic to perform one or more functions and second logic integrated with the first logic. Information corresponding to a current load for a different power state of at least a portion of the IC is sent from the second logic to voltage regulator control logic to adjust the voltage to a different value.
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公开(公告)号：US06490160B2
公开(公告)日：2002-12-03
申请号：US09921153
申请日：2001-08-02
IPC分类号： H05K720
CPC分类号： H05K7/1092 , F28D15/0233 , F28D15/04 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2924/0002 , H01L2924/15192 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.
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公开(公告)号：US08930741B2
公开(公告)日：2015-01-06
申请号：US13316645
申请日：2011-12-12
CPC分类号： G06F1/26 , H02M3/1584
摘要： Techniques to enable voltage regulators to adjust for coming load changes are presented herein. In some embodiments, a functional block such as a microprocessor core having an associated clock signal is powered by at least one switching-type voltage regulator. When the functional block is about to require an increased level of power, the associated clock is provided to drive the at least one regulator switches overriding their normal drive signal, which has a lower frequency. Thus, the switches are driven at a higher frequency sufficiently prior to (e.g., just ahead of) the load change to reduce the amount of droop that would otherwise occur.
摘要翻译： 本文介绍了使电压调节器能够调整以达到负载变化的技术。 在一些实施例中，诸如具有关联时钟信号的微处理器核心的功能块由至少一个开关型电压调节器供电。 当功能块即将要求增加的功率电平时，相关联的时钟被提供以驱动至少一个调节器开关，以超越其具有较低频率的正常驱动信号。 因此，开关在负载变化之前（例如，刚好在负载变化之前）充分地以更高的频率被驱动以减少否则将发生的下降量。
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公开(公告)号：US08129971B2
公开(公告)日：2012-03-06
申请号：US11957455
申请日：2007-12-15
IPC分类号： G05F1/40
CPC分类号： G05F1/10
摘要： In some embodiments, the number of active cells in a multi-cell voltage regulator is controlled so that the current-per-active-cell approaches a predefined target or to be within an acceptable range so that the active cells operate with suitable efficiency.
摘要翻译： 在一些实施例中，控制多单元电压调节器中的活动单元的数量，使得每个 - 活动单元的电流接近预定义的目标或处于可接受的范围内，使得活动单元以适当的效率工作。
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公开(公告)号：US20110199153A1
公开(公告)日：2011-08-18
申请号：US13094599
申请日：2011-04-26
申请人： Hung-Piao Ma , Alon Naveh , Gil Schwarzband , Annabelle Pratt , Jorge Pedro Rodriguez , Joseph T. Dibene, II , Sean M. Welch , Kosta Luria , Edward R. Stanford
发明人： Hung-Piao Ma , Alon Naveh , Gil Schwarzband , Annabelle Pratt , Jorge Pedro Rodriguez , Joseph T. Dibene, II , Sean M. Welch , Kosta Luria , Edward R. Stanford
IPC分类号： G05F3/02
CPC分类号： H02J1/10 , G11C5/147 , H02J2001/008 , Y10T307/305 , Y10T307/658 , Y10T307/675
摘要： Methods and mechanisms to simultaneously regulate two or more supply voltages provided to an integrated circuit by a voltage regulator. In an embodiment of the invention, a voltage regulation message exchanged between the integrated circuit and the voltage regulator includes an identifier indicating two or more supply voltages selected from a plurality of supply voltages provided to the integrated circuit by the voltage regulator, where the voltage regulation message relates to the indicated two or more supply voltages. In another embodiment, the voltage regulation message indicates a desired supply voltage level to which the indicated two or more supply voltages are to transition.
摘要翻译： 同时调节通过电压调节器提供给集成电路的两个或多个电源电压的方法和机制。 在本发明的一个实施例中，在集成电路和电压调节器之间交换的电压调节消息包括一个标识符，该标识符指示通过电压调节器从提供给集成电路的多个电源电压中选择的两个或多个电源电压，其中电压调节 消息涉及所指示的两个或更多个电源电压。 在另一个实施例中，电压调节消息指示所指示的两个或更多个电源电压要转换到的期望电源电压电平。
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10.发明申请公开(公告)号：US20110161683A1
公开(公告)日：2011-06-30
申请号：US12724084
申请日：2010-03-15
申请人： Peng Zou , Joseph T. Dibene, II , Fernardi Thenus
发明人： Peng Zou , Joseph T. Dibene, II , Fernardi Thenus
IPC分类号： G06F1/26
CPC分类号： G06F1/3203 , G06F1/266 , G06F1/324 , G06F1/3287 , G06F1/3296 , Y02D10/126 , Y02D10/17 , Y02D10/171 , Y02D10/172
摘要： In some embodiments, the invention provides a higher efficiency, real-time platform power management architecture for computing platforms. A more direct power management architecture may be provided using integrated voltage regulators and in some embodiments, a direct power management interface (DPMI) as well. Integrated voltage regulators, such as in-silicon voltage regulators (ISVR) can be used to implement quicker, more highly responsive power state transitions.
摘要翻译： 在一些实施例中，本发明为计算平台提供了更高效率的实时平台电源管理架构。 可以使用集成稳压器提供更直接的功率管理架构，并且在一些实施例中也可以提供直接功率管理接口（DPMI）。 集成稳压器，例如硅片内稳压器（ISVR）可用于实现更快，更高响应的功率状态转换。
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