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公开(公告)号：US06531046B2
公开(公告)日：2003-03-11
申请号：US09738551
申请日：2000-12-15
申请人： Denis Morrissey , David Merricks , Leon R. Barstad , Eugene N. Step , Jeffrey M. Calvert , Robert A. Schetty, III , James G. Shelnut , Mark Lefebvre , Martin W. Bayes , Donald E. Storjohann
发明人： Denis Morrissey , David Merricks , Leon R. Barstad , Eugene N. Step , Jeffrey M. Calvert , Robert A. Schetty, III , James G. Shelnut , Mark Lefebvre , Martin W. Bayes , Donald E. Storjohann
IPC分类号： C25D534
CPC分类号： C25D3/38 , C25D5/34 , C25D7/123 , H01L21/76861 , H01L21/76868 , H01L21/76873
摘要： Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
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公开(公告)号：US06660153B2
公开(公告)日：2003-12-09
申请号：US09982398
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C25D502
CPC分类号： H01L21/76868 , C25D3/38 , C25D5/48 , C25D7/123 , H01L21/2885 , H01L21/76874 , H01L2221/1089 , H05K3/244
摘要： Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.
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公开(公告)号：US06660154B2
公开(公告)日：2003-12-09
申请号：US09981851
申请日：2001-10-17
申请人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
发明人： David Merricks , Denis Morrissey , Martin W. Bayes , Mark Lefebvre , James G. Shelnut , Donald E. Storjohann
IPC分类号： C23C2800
CPC分类号： H01L21/76843 , C23C18/28 , C25D3/38 , C25D5/54 , C25D7/123 , H01L21/288 , H01L21/2885 , H01L21/76868 , H01L21/76873 , H01L21/76877 , H01L2221/1089
摘要： Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
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公开(公告)号：US06824665B2
公开(公告)日：2004-11-30
申请号：US09978797
申请日：2001-10-17
IPC分类号： C23C2802
CPC分类号： H01L21/76868 , C23C18/1671 , C23C18/38 , C23C18/405 , H01L21/288 , H01L21/2885 , H01L21/76843 , H01L21/76874 , H01L2221/1089 , H05K3/181 , H05K3/388 , H05K3/422 , Y10S205/916
摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
摘要翻译： 公开了在具有导电层的基板上沉积铜籽晶层的方法。 这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。
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公开(公告)号：US08053160B2
公开(公告)日：2011-11-08
申请号：US11180184
申请日：2005-07-13
IPC分类号： G03C1/00
摘要： An imaging composition, article and method of imaging are disclosed. The imaging composition is energy sensitive such that upon application of a sufficient amount of energy to the composition a color or shade change is affected. The imaging composition is coated on an article to form an energy sensitive article, which may be used in marking work pieces.
摘要翻译： 公开了成像组合物，制品和成像方法。 成像组合物是能量敏感的，使得当对组合物施加足够量的能量时，颜色或阴影变化受到影响。 将成像组合物涂覆在制品上以形成可用于标记工件的能量敏感物品。
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公开(公告)号：US06616976B2
公开(公告)日：2003-09-09
申请号：US09995890
申请日：2001-11-28
IPC分类号： B05D136
CPC分类号： C23C22/83 , B05D7/14 , B05D7/148 , C08L63/00 , C09J5/02 , C09J2400/163 , C09J2463/00 , C23C22/52 , C23F1/18 , H05K3/383 , H05K3/385 , H05K3/386 , H05K3/4626 , H05K2201/0355 , H05K2201/0358 , H05K2203/0759 , H05K2203/0789 , H05K2203/0796 , H05K2203/124
摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.
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公开(公告)号：US5415762A
公开(公告)日：1995-05-16
申请号：US108976
申请日：1993-08-18
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.
摘要翻译： 一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成导电聚合物膜并在其上电解金属沉积。 导电膜通过从所述聚合物的水性悬浮液沉积到所述表面上而形成。
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公开(公告)号：US08338800B2
公开(公告)日：2012-12-25
申请号：US13479345
申请日：2012-05-24
CPC分类号： C09K11/02 , C09K11/08 , D01F1/04 , D01F8/00 , G01D5/268 , Y10T428/249921 , Y10T428/2964 , Y10T428/2969 , Y10T442/3976
摘要： Disclosed are photoluminescent fibers containing photoluminescent phosphorescent materials and photoluminescent fluorescent materials which emit electromagnetic energies to give an emission signature. Also disclosed are the use of the inventive fibers, fabrics made therefrom, and objects containing the fiber.
摘要翻译： 公开了含有荧光发光材料的光致发光纤维和发射电磁能以产生发射特征的光致发光荧光材料。 还公开了使用本发明的纤维，由其制成的织物和含有纤维的物体。
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公开(公告)号：US08048606B2
公开(公告)日：2011-11-01
申请号：US11378933
申请日：2006-03-17
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/146 , Y10S430/155
摘要： An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
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公开(公告)号：US07977026B2
公开(公告)日：2011-07-12
申请号：US10773989
申请日：2004-02-06
IPC分类号： G03C1/00
CPC分类号： G03C1/73 , G03C1/732 , Y10S430/146 , Y10S430/155
摘要： An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
摘要翻译： 公开了一种成像方法。 将成像组合物涂覆在工件上，然后从3-D成像系统施加足够量的能量以在涂覆的工件上形成图像。 图像可以是用于对准部件的标志或标记。
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