公开(公告)号：US20080057333A1

公开(公告)日：2008-03-06

申请号：US11803039

申请日：2007-05-11

申请人： Fu Hua Chu ,  David Shau Chew Wang ,  Jyh Ming Yu ,  En Tien Yang ,  Kuo Hsun Chen

发明人： Fu Hua Chu ,  David Shau Chew Wang ,  Jyh Ming Yu ,  En Tien Yang ,  Kuo Hsun Chen

IPC分类号： B21D39/00

CPC分类号： H05K1/0373 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/384 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/10106 ,  H05K2203/0307 ,  Y10T428/12472

摘要： A heat dissipation substrate for an electronic device comprises a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. A surface of the first metal layer carries the electronic device, e.g., a light-emitting diode (LED) device. The thermally conductive polymer dielectric insulating layer is stacked between the first metal layer and the second metal layer in a physical contact manner, and interfaces therebetween include at least one micro-rough surface with a roughness Rz larger than 7.0. The micro-rough surface includes a plurality of nodular projections, and the grain sizes of the nodular projections mainly are in a range of 0.1-100 μm. The heat dissipation substrate has a thermal conductivity larger than 1.0 W/m·K, and a thickness smaller than 0.5 mm, and comprises (1) a fluorine-containing polymer with a melting point higher than 150° C. and a volume percentage in a range of 30-60%, and (2) thermally conductive filler dispersed in the fluorine-containing polymer and having a volume percentage in a range of 40-70%.

摘要翻译： 电子器件的散热基板包括第一金属层，第二金属层和导热聚合物介电绝缘层。 第一金属层的表面承载电子装置，例如发光二极管（LED）装置。 导热性聚合物介电绝缘层以物理接触的方式堆叠在第一金属层和第二金属层之间，并且其间的界面包括至少一个粗糙度Rz大于7.0的微粗糙表面。 微粗糙表面包括多个结节状突起，并且结节状突起的粒径主要在0.1〜100μm的范围内。 散热基板的热导率大于1.0W / mK，厚度小于0.5mm，其特征在于，包含：（1）熔点高于150℃的含氟聚合物， 为30〜60％，（2）分散在含氟聚合物中的导热性填料，体积百分比为40〜70％。

公开(公告)号：US20080292857A1

公开(公告)日：2008-11-27

申请号：US12052839

申请日：2008-03-21

申请人： David Shau Chew Wang ,  Kuo Hsun Chen ,  En Tien Yang

发明人： David Shau Chew Wang ,  Kuo Hsun Chen ,  En Tien Yang

IPC分类号： B32B15/08 ,  B32B27/20 ,  C08L27/18 ,  C08K3/20 ,  C08K3/38 ,  C08K3/22 ,  C08K3/28 ,  B32B15/20

CPC分类号： C08K5/5406 ,  B32B15/08 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/269 ,  C08L27/18 ,  C08L27/16

摘要： A heat dissipation material comprises (1) fluorine-containing crystalline polymer having a melting point higher than 150° C., with a weight percentage of around 15-40%; (2) heat conductive fillers dispersed in the fluorine-containing crystalline polymer with a weight percentage of around 60-85%; and (3) coupling agent of 0.5-3% of the heat conductive fillers by weight and having a chemical formula of: where R1, R2 and R3 are alkyl group CaH2a+1, a≧1; X and Y are selected from hydrogen, fluorine, chorine, and alkyl group; and n is a positive integer.

摘要翻译： 散热材料包括（1）熔点高于150℃的含氟结晶聚合物，重量百分比为约15-40％; （2）分散在含氟结晶聚合物中的导热填料，重量百分比约为60-85％; 和（3）0.5-3％的导热填料的偶联剂，其化学式为：其中R1，R2和R3是烷基CaH2a + 1，a> = 1; X和Y选自氢，氟，氯代和烷基; n为正整数。

公开(公告)号：US08652641B2

公开(公告)日：2014-02-18

申请号：US13109284

申请日：2011-05-17

申请人： David Shau Chew Wang ,  Yi An Sha ,  Kuo Hsun Chen

发明人： David Shau Chew Wang ,  Yi An Sha ,  Kuo Hsun Chen

IPC分类号： B32B15/08 ,  B32B27/38

CPC分类号： C09K5/00 ,  F28F7/00 ,  Y02P20/124 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

摘要： A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.

摘要翻译： 导热介电聚合物材料包括聚合物，固化剂和导热填料。 聚合物包括热塑性和热固性环氧树脂。 该热塑性塑料包含导热介电聚合物材料的3％至30％（体积），热固性环氧树脂选自端环氧官能团环氧树脂，侧链环氧官能团环氧树脂，多功能基环氧树脂或 的混合物。 固化剂可以在一定温度下固化热固性环氧树脂。 导热填料均匀地分布在聚合物中，并且包含40体积％至70体积％的导热介电聚合物材料。 导热介电聚合物材料具有互穿网络结构，导热系数大于1.0W / m-K。

公开(公告)号：US20080100979A1

公开(公告)日：2008-05-01

申请号：US11691672

申请日：2007-03-27

申请人： Shau Chew WANG ,  Jyh Ming Yu ,  Kuo Hsun Chen

发明人： Shau Chew WANG ,  Jyh Ming Yu ,  Kuo Hsun Chen

IPC分类号： H02H5/04

CPC分类号： H01C7/027

摘要： A high voltage over-current protection device includes a positive temperature coefficient (PTC) electrically conductive heat-dissipation layer and two metal electrodes. The PTC electrically conductive heat-dissipation layer includes at least one polymer, an electrically conductive filler, and a heat conductive filler. Due to the high thermal conductivity of the heat conductive filler (with a coefficient of thermal conductivity higher than 1 W/mK), the high voltage over-current protection device has a high thermal conduction characteristic, and the withstand voltage thereof can be substantially uniformly distributed in the PTC electrically conductive heat-dissipation layer to enhance its high voltage withstanding characteristic.

摘要翻译： 高电压过电流保护装置包括正温度系数（PTC）导电散热层和两个金属电极。 PTC导电散热层包括至少一种聚合物，导电填料和导热填料。 由于导热性填料的热导率高（导热系数高于1W / mK），所以高压过电流保护装置具有高导热特性，其耐电压基本上均匀 分布在PTC导电散热层中，以提高其耐高压特性。

公开(公告)号：US09340712B2

公开(公告)日：2016-05-17

申请号：US14135849

申请日：2013-12-20

申请人： Kuo Hsun Chen ,  Meng Chun Ko ,  Yi An Sha ,  Hsiang Yun Yang

发明人： Kuo Hsun Chen ,  Meng Chun Ko ,  Yi An Sha ,  Hsiang Yun Yang

IPC分类号： C09J11/04 ,  C09J163/00 ,  C09J113/00 ,  C09J11/06 ,  C09J163/02 ,  C09J163/04 ,  C09J171/12 ,  C09J7/00 ,  C08G59/40 ,  C08G59/50 ,  H01L33/64 ,  H05K7/20 ,  C09J109/02 ,  C08K3/22 ,  C08K3/28

CPC分类号： C09J163/00 ,  C08G59/50 ,  C08G2650/56 ,  C08K3/22 ,  C08K3/28 ,  C08L71/00 ,  C09J109/02 ,  C09J113/00 ,  H01L33/64 ,  H05K7/20

摘要： An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

摘要翻译： 粘合剂材料包括聚合物组分，导热填料和固化剂。 聚合物组分占粘合剂材料的30重量％-60体积％，并且包含热固性环氧树脂和聚合物改性剂，其被配置成改善热固性环氧树脂的耐冲击性。 聚合物改性剂包括热塑性橡胶或其混合物。 聚合物改性剂包含4％-45％体积的聚合物组分。 导热填料均匀地分散在聚合物组分中，并且包含40％-70体积％的粘合剂材料。 固化剂能够在低于140℃的温度下固化热固性环氧树脂。粘合剂材料的导热率大于3W / m-K。

公开(公告)号：US20140035719A1

公开(公告)日：2014-02-06

申请号：US13866611

申请日：2013-04-19

申请人： Wen Feng LEE ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

发明人： Wen Feng LEE ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

IPC分类号： H01C7/00 ,  H01C17/00

CPC分类号： H01C7/008 ,  H01C1/028 ,  H01C1/1406 ,  H01C7/02 ,  H01C17/00 ,  H01C17/02 ,  Y10T29/49085

摘要： An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm.

摘要翻译： 过电流保护装置具有PTC器件，第一和第二电极以及绝缘层。 PTC器件包括第一和第二导电构件和层压在第一和第二导电构件之间的PTC层。 第一和第二电极分别电连接到第一和第二导电构件。 绝缘层设置在第一导电构件的表面上。 该装置是沿着第一方向延伸的堆叠结构，并且包括沿着基本上垂直于第一方向的第二方向延伸的至少一个孔。 孔的覆盖面积除以过流保护装置的形状因子的面积的值不小于2％，并且器件的厚度值除以PIC器件的数量少 大于0.7毫米。

公开(公告)号：US09074127B2

公开(公告)日：2015-07-07

申请号：US14135778

申请日：2013-12-20

申请人： Yu Sian Jhuo ,  Kuo Hsun Chen ,  Yi An Sha

发明人： Yu Sian Jhuo ,  Kuo Hsun Chen ,  Yi An Sha

IPC分类号： C09K5/14 ,  C09K11/02

CPC分类号： C09K11/025 ,  C08K3/22 ,  C08K2003/221 ,  C08K2003/222 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08K2201/014 ,  C09K5/14

摘要： A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 μm and at a temperature of 40° C.

摘要翻译： 散热材料含有10-25重量％的二氧化钛，5-25重量％的二氧化锆，2-30重量％的氧化镁和0.01-0.5重量％的稀土金属氧化物的组分。 散热材料的热导率为0.34-1.35W / m-K，辐射效率等于或大于88％，其红外光谱波长范围为4-14μm，温度为40℃。

公开(公告)号：US08941462B2

公开(公告)日：2015-01-27

申请号：US13866611

申请日：2013-04-19

申请人： Wen Feng Lee ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

发明人： Wen Feng Lee ,  Kuo Hsun Chen ,  Chun Teng Tseng ,  Yi An Sha ,  Ming Hsun Lu

IPC分类号： H01C7/10 ,  H01C7/00 ,  H01C17/00 ,  H01C1/028 ,  H01C1/14 ,  H01C7/02 ,  H01C17/02

CPC分类号： H01C7/008 ,  H01C1/028 ,  H01C1/1406 ,  H01C7/02 ,  H01C17/00 ,  H01C17/02 ,  Y10T29/49085

摘要： An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.

摘要翻译： 过电流保护装置具有PTC器件，第一和第二电极以及绝缘层。 PTC器件包括第一和第二导电构件和层压在第一和第二导电构件之间的PTC层。 第一和第二电极分别电连接到第一和第二导电构件。 绝缘层设置在第一导电构件的表面上。 该装置是沿着第一方向延伸的堆叠结构，并且包括沿着基本上垂直于第一方向的第二方向延伸的至少一个孔。 孔的覆盖面积除以过电流保护装置的形状因子的面积的值不小于2％，并且器件的厚度值除以PTC器件的数量减少 大于0.7毫米。

公开(公告)号：US20150008360A1

公开(公告)日：2015-01-08

申请号：US14135778

申请日：2013-12-20

申请人： Yu Sian JHUO ,  Kuo Hsun Chen ,  Yi An Sha

发明人： Yu Sian JHUO ,  Kuo Hsun Chen ,  Yi An Sha

IPC分类号： C09K11/02 ,  C09K5/14

CPC分类号： C09K11/025 ,  C08K3/22 ,  C08K2003/221 ,  C08K2003/222 ,  C08K2003/2241 ,  C08K2003/2244 ,  C08K2201/014 ,  C09K5/14

摘要： A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 μm and at a temperature of 40° C..

摘要翻译： 散热材料含有10-25重量％的二氧化钛，5-25重量％的二氧化锆，2-30重量％的氧化镁和0.01-0.5重量％的稀土金属氧化物的组分。 散热材料的热导率为0.34-1.35W / m-K，辐射效率等于或大于88％，其红外光谱波长范围为4-14μm，温度为40℃。

公开(公告)号：US09291311B2

公开(公告)日：2016-03-22

申请号：US14135822

申请日：2013-12-20

申请人： Kuo Hsun Chen ,  Hsun Ching Chiang ,  Yi An Sha ,  Hsiang Yun Yang

发明人： Kuo Hsun Chen ,  Hsun Ching Chiang ,  Yi An Sha ,  Hsiang Yun Yang

IPC分类号： F21V29/00 ,  F21K99/00 ,  F21V29/87 ,  F21Y101/02 ,  F21Y111/00

CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21V29/87 ,  F21Y2107/30 ,  F21Y2115/10

摘要： An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm2, and the insulating adhesive layer can withstand a voltage of at least 500 volts.

摘要翻译： 照明装置包括散热器，至少一个光模块和绝缘粘合剂层。 光模块设置在散热器上，并且绝缘粘合剂层设置在光模块和散热器之间，以将光模块与散热器组合。 绝缘粘合剂层包括分散在其中的聚合物组分和导热填料。 该聚合物包括热固性环氧树脂。 绝缘粘合剂层的导热率大于0.5W / m-K，厚度为0.02-10mm。 绝缘粘合剂层与散热器和光模块的结合强度大于300g / cm 2，并且绝缘粘合剂层可承受至少500伏特的电压。