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1.发明申请Reactive composite material structures with electrostatic discharge protection and applications thereof 有权具有静电放电保护功能的反应性复合材料结构及其应用公开(公告)号：US20110070460A1
公开(公告)日：2011-03-24
申请号：US11454091
申请日：2006-06-15
申请人： Timothy P. Weihs , Etienne Besnoin , Ramzi Vincent , Somasundaram Valliappan , Ellen Heian , David Van Heerden , Timothy Ryan Rude , Omar Knio , Ronald Spraker , Yuping Lin
发明人： Timothy P. Weihs , Etienne Besnoin , Ramzi Vincent , Somasundaram Valliappan , Ellen Heian , David Van Heerden , Timothy Ryan Rude , Omar Knio , Ronald Spraker , Yuping Lin
IPC分类号： B32B15/01
CPC分类号： C22C30/00 , C06B21/00 , C06B45/12 , C22C5/04 , C22C19/00 , F42B3/18 , F42B39/14 , Y10T29/30 , Y10T29/302 , Y10T29/49002 , Y10T29/49227 , Y10T428/12493 , Y10T428/12632
摘要： Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.
摘要翻译： 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。
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公开(公告)号：US08882301B2
公开(公告)日：2014-11-11
申请号：US12674804
申请日：2008-08-29
CPC分类号： H01L24/83 , H01L24/33 , H01L31/02002 , H01L33/62 , H01L2224/33104 , H01L2224/335 , H01L2224/80359 , H01L2224/83024 , H01L2224/83095 , H01L2224/83193 , H01L2224/83203 , H01L2224/83232 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H05K1/0203 , H05K1/056 , H05K3/341 , H05K3/3421 , H05K3/3436 , H05K3/3494 , H05K2201/10106 , H05K2201/10689 , H05K2201/10719 , H05K2201/10734 , H05K2201/10969 , H05K2203/0278 , H05K2203/0405 , H05K2203/1163 , Y02P70/613 , Y10S362/80 , H01L2924/00
摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.
摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。
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3.发明授权Reactive composite material structures with electrostatic discharge protection and applications thereof 有权具有静电放电保护功能的反应性复合材料结构及其应用公开(公告)号：US08336457B2
公开(公告)日：2012-12-25
申请号：US11454091
申请日：2006-06-15
申请人： Timothy P. Weihs , Etienne Besnoin , Ramzi Vincent , Somasundaram Valliappan , Ellen Heian , David Van Heerden , Timothy Ryan Rude , Omar Knio , Ronald Spraker , Yuping Lin
发明人： Timothy P. Weihs , Etienne Besnoin , Ramzi Vincent , Somasundaram Valliappan , Ellen Heian , David Van Heerden , Timothy Ryan Rude , Omar Knio , Ronald Spraker , Yuping Lin
IPC分类号： F42B3/18
CPC分类号： C22C30/00 , C06B21/00 , C06B45/12 , C22C5/04 , C22C19/00 , F42B3/18 , F42B39/14 , Y10T29/30 , Y10T29/302 , Y10T29/49002 , Y10T29/49227 , Y10T428/12493 , Y10T428/12632
摘要： Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.
摘要翻译： 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。
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公开(公告)号：US20110089462A1
公开(公告)日：2011-04-21
申请号：US12674804
申请日：2008-08-29
CPC分类号： H01L24/83 , H01L24/33 , H01L31/02002 , H01L33/62 , H01L2224/33104 , H01L2224/335 , H01L2224/80359 , H01L2224/83024 , H01L2224/83095 , H01L2224/83193 , H01L2224/83203 , H01L2224/83232 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H05K1/0203 , H05K1/056 , H05K3/341 , H05K3/3421 , H05K3/3436 , H05K3/3494 , H05K2201/10106 , H05K2201/10689 , H05K2201/10719 , H05K2201/10734 , H05K2201/10969 , H05K2203/0278 , H05K2203/0405 , H05K2203/1163 , Y02P70/613 , Y10S362/80 , H01L2924/00
摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.
摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。
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5.发明申请公开(公告)号：US20080299410A1
公开(公告)日：2008-12-04
申请号：US12103484
申请日：2008-04-15
申请人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
发明人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
IPC分类号： B23K5/00
CPC分类号： B32B15/01 , B23K1/0006 , B23K20/00 , B23K20/165 , C06B45/12 , H05K3/3494 , Y10T156/10 , Y10T428/12222 , Y10T428/12438 , Y10T428/12472 , Y10T428/12986 , Y10T428/31504 , Y10T428/31678
摘要： A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
摘要翻译： 一种用于通过在本体和相邻的易熔材料片之间设置多个基本相邻的反应性复合材料片而在大尺寸的粘结区域上连接材料的组分体的方法。 反应性复合材料的连续片材通过可点燃的桥接材料可操作地连接，使得一片中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个相邻的反应性复合材料片的点燃导致放热热反应传播通过结合区域，熔化任何相邻的可熔材料片并在组分体之间形成结合。
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6.发明申请Assembly For Fabricating Large Dimension Bonds Using Reactive Multilayer Joining 审中-公开使用反应多层连接制造大尺寸债券的装配公开(公告)号：US20080145695A1
公开(公告)日：2008-06-19
申请号：US12029287
申请日：2008-02-11
申请人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
发明人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
IPC分类号： B23K35/22
CPC分类号： B32B15/01 , B23K1/0006 , B23K20/00 , B23K20/165 , C06B45/12 , H05K3/3494 , Y10T156/10 , Y10T428/12222 , Y10T428/12438 , Y10T428/12472 , Y10T428/12986 , Y10T428/31504 , Y10T428/31678
摘要： An assembly for joining component bodies of material over bonding regions of large dimensions including a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
摘要翻译： 一种组件，用于在大尺寸的粘结区域上连接材料的组分体，包括在本体和相邻的易熔材料片之间的多个基本相邻的反应性复合材料片。 反应性复合材料的连续片材通过可点燃的桥接材料可操作地连接，使得一片中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个相邻的反应性复合材料片的点燃导致放热热反应传播通过结合区域，熔化任何相邻的可熔材料片并在组分体之间形成结合。
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7.发明授权Method for fabricating large dimension bonds using reactive multilayer joining 有权使用反应性多层接合制造大尺寸粘结的方法公开(公告)号：US07354659B2
公开(公告)日：2008-04-08
申请号：US11393055
申请日：2006-03-30
申请人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar Knio , Ellen M. Heian , Jai S. Subramanian
发明人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar Knio , Ellen M. Heian , Jai S. Subramanian
CPC分类号： B32B15/01 , B23K1/0006 , B23K20/00 , B23K20/165 , C06B45/12 , H05K3/3494 , Y10T156/10 , Y10T428/12222 , Y10T428/12438 , Y10T428/12472 , Y10T428/12986 , Y10T428/31504 , Y10T428/31678
摘要： A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
摘要翻译： 一种用于通过在本体和相邻的易熔材料片之间设置多个基本相邻的反应性复合材料片而在大尺寸的粘结区域上连接材料的组分体的方法。 反应性复合材料的连续片材通过可点燃的桥接材料可操作地连接，使得一片中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个相邻的反应性复合材料片的点燃导致放热热反应传播通过结合区域，熔化任何相邻的可熔材料片并在组分体之间形成结合。
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8.发明申请Method and Apparatus For Electromagnetic Emission By Reactive Composite Materials 审中-公开通过反应性复合材料进行电磁辐射的方法和装置公开(公告)号：US20090166568A1
公开(公告)日：2009-07-02
申请号：US11425766
申请日：2006-06-22
申请人： Timothy P. Weihs , Somasundaram Valliappan , Timothy Ryan Rude , Ellen M. Heian , David Lunking , Yuwei Xun
发明人： Timothy P. Weihs , Somasundaram Valliappan , Timothy Ryan Rude , Ellen M. Heian , David Lunking , Yuwei Xun
IPC分类号： G01J3/10
摘要： A device and method for emitting electromagnetic radiation utilizing a reactive composite material (RCM) as an emission source. By selective modification of the reactive composite material (RCM), attributes of the emitting device, including the ability to produce specific radiation intensity levels at specific electromagnetic wavelengths, the ability to emit for a specific duration, the avoidance of dangerous reaction products, portability, geometric design flexibility, and simple, safe storage may be selected.
摘要翻译： 一种利用反应性复合材料（RCM）作为发射源发射电磁辐射的装置和方法。 通过选择性修饰反应性复合材料（RCM），发射器件的属性，包括在特定电磁波长下产生特定辐射强度水平的能力，发射特定持续时间的能力，避免危险的反应产物，可携带性， 可以选择几何设计灵活性和简单，安全的存储。
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9.发明申请Method For Fabricating Large Dimension Bonds Using Reactive Multilayer Joining 有权使用反应多层连接制造大尺寸债券的方法公开(公告)号：US20080131700A1
公开(公告)日：2008-06-05
申请号：US12029256
申请日：2008-02-11
申请人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar Knio , Ellen M. Heian , Jai S. Subramanian
发明人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar Knio , Ellen M. Heian , Jai S. Subramanian
CPC分类号： B32B15/01 , B23K1/0006 , B23K20/00 , B23K20/165 , C06B45/12 , H05K3/3494 , Y10T156/10 , Y10T428/12222 , Y10T428/12438 , Y10T428/12472 , Y10T428/12986 , Y10T428/31504 , Y10T428/31678
摘要： A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
摘要翻译： 一种用于通过在本体和相邻的易熔材料片之间设置多个基本相邻的反应性复合材料片而在大尺寸的粘结区域上连接材料的组分体的方法。 反应性复合材料的连续片材通过可点燃的桥接材料可操作地连接，使得一片中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个相邻的反应性复合材料片的点燃导致放热热反应传播通过结合区域，熔化任何相邻的可熔材料片并在组分体之间形成结合。
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10.发明授权Method for fabricating large dimension bonds using reactive multilayer joining 有权使用反应性多层接合制造大尺寸粘结的方法公开(公告)号：US07810704B2
公开(公告)日：2010-10-12
申请号：US12103484
申请日：2008-04-15
申请人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
发明人： Alan Duckham , Jesse E. Newson , Michael V. Brown , Timothy Ryan Rude , Omar M. Knio , Ellen M. Heian , Jai S. Subramanian
IPC分类号： B23K20/08
CPC分类号： B32B15/01 , B23K1/0006 , B23K20/00 , B23K20/165 , C06B45/12 , H05K3/3494 , Y10T156/10 , Y10T428/12222 , Y10T428/12438 , Y10T428/12472 , Y10T428/12986 , Y10T428/31504 , Y10T428/31678
摘要： A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.
摘要翻译： 一种用于通过在本体和相邻的易熔材料片之间设置多个基本相邻的反应性复合材料片而在大尺寸的粘结区域上连接材料的组分体的方法。 反应性复合材料的连续片材通过可点燃的桥接材料可操作地连接，使得一片中的点燃反应将在另一片材中引起点燃反应。 施加均匀的压力和一个或多个相邻的反应性复合材料片的点燃导致放热热反应传播通过结合区域，熔化任何相邻的可熔材料片并在组分体之间形成结合。
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