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    Smart card module and smart card including a smart card module
    1.
    发明授权
    Smart card module and smart card including a smart card module 有权
    智能卡模块和智能卡包括智能卡模块

    公开(公告)号：US06191951B1

    公开(公告)日：2001-02-20

    申请号：US09390494

    申请日：1999-09-03

    申请人： Detlef Houdeau ,  Josef Mundigl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

    发明人： Detlef Houdeau ,  Josef Mundigl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

    IPC分类号： H05K500

    CPC分类号： G06K19/07747 ,  G06K19/07743 ,  H01L2224/16

    摘要： A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

    摘要翻译： 智能卡模块包括导电地连接到形成有接触区域的金属引线框架的半导体芯片。 半导体芯片和接触区域通过设置在施加到半导体芯片的电绝缘保护层的表面上的连接区域导电接触。 该表面背离半导体芯片。 可以通过使用焊接接头或导电粘合剂粘合在连接区域和接触区域之间建立接触。 还提供了包括智能卡模块的智能卡。

    Smart card and semiconductor chip for use in a smart card
    6.
    发明授权
    Smart card and semiconductor chip for use in a smart card 失效
    用于智能卡的智能卡和半导体芯片

    公开(公告)号：US06188580B1

    公开(公告)日：2001-02-13

    申请号：US09246774

    申请日：1999-02-08

    申请人： Michael Huber ,  Peter Stampka ,  Detlef Houdeau

    发明人： Michael Huber ,  Peter Stampka ,  Detlef Houdeau

    IPC分类号： H05K511

    CPC分类号： G06K19/07728 ,  G06K19/07743

    摘要： The smart card has a card body and a plurality of contact areas exposed on a flat surface of the card body. The contact areas are fabricated from electrically conductive material and are electrically connected to contact terminals, which are assigned to an electronic circuit formed on the semiconductor substrate of a semiconductor chip. The contact areas are fabricated as a structured coating on a main surface of the semiconductor chip. The semiconductor chip, after fabrication with the contact areas is inserted and fixed in a receptacle opening in the card body of the smart card in such a way that the contact areas extend essentially flush with the outer face of the card body. In order to ensure sufficiently high mechanical flexibility, the thickness of the silicon substrate of the chip is preferably less than about 100 &mgr;m.

    摘要翻译： 智能卡具有卡体和暴露在卡体的平坦表面上的多个接触区域。 接触区域由导电材料制成并且电连接到接触端子，接触端子被分配给形成在半导体芯片的半导体衬底上的电子电路。 接触区域被制成半导体芯片的主表面上的结构化涂层。 将具有接触区域的制造之后的半导体芯片插入并固定在智能卡的卡体中的插座开口中，使得接触区域基本上与卡体的外表面齐平。 为了确保足够高的机械灵活性，芯片的硅衬底的厚度优选小于约100μm。

    Antenna coil
    7.
    发明授权
    Antenna coil 失效
    天线线圈

    公开(公告)号：US5896111A

    公开(公告)日：1999-04-20

    申请号：US811502

    申请日：1997-03-05

    申请人： Detlef Houdeau ,  Lothar Kiesewetter ,  Josef Mundigl

    发明人： Detlef Houdeau ,  Lothar Kiesewetter ,  Josef Mundigl

    IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H01F27/30 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  H04B5/00 ,  H01Q21/00

    CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00

    摘要： An antenna coil, in particular for a contactless smart card, includes coil turns formed of thin conductor tracks having first and second ends. The first end of a respective one of the conductor tracks is electrically conductively connected to the second end of an adjacent one of the conductor tracks. The conductor tracks include first and last conductor tracks, and the first end of the first conductor track and the second end of the last conductor track form coil connections. The conductor tracks are disposed in parallel on a flexible, non-conductive carrier strip. The carrier strip has bends and forms a polygon containing the connected ends of the conductor tracks. The bends are guided through approximately 180.degree., and the coil turns lie approximately in the same plane.

    摘要翻译： 特别是用于非接触式智能卡的天线线圈包括由具有第一端和第二端的薄导体轨道形成的线圈匝。 导体轨道中的相应一个的第一端导电地连接到相邻导体轨迹的第二端。 导体轨道包括第一和最后导体轨道，并且第一导体轨道的第一端和最后一个导体轨道的第二端形成线圈连接。 导体轨道平行设置在柔性非导电载体条上。 承载带具有弯曲并形成包含导体轨道的连接端的多边形。 弯曲引导约180°，线圈大致在同一平面上。

    Smart card
    9.
    发明授权
    Smart card 有权
    智能卡

    公开(公告)号：US06375083B2

    公开(公告)日：2002-04-23

    申请号：US09354131

    申请日：1999-07-15

    申请人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    发明人： Manfred Fries ,  Frank Püschner ,  Josef Mundigl ,  Jürgen Fischer ,  Detlef Houdeau

    IPC分类号： G06K1906

    CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

    摘要翻译： 一种具有卡载体的智能卡，其上提供有数据处理电路和数据处理电路与外部数据处理站之间的数据无接触通信的连接组件。 在生产现有技术的智能卡的过程中，将集成电路应用于由塑料制成的卡片载体。 之后，沿着现有技术的智能卡的外边缘施加连接到集成电路的相应端子的发送/接收线圈。 在现有技术的智能卡的情况下，缺陷的现有技术的智能卡必须被销毁的事实是不利的。 根据本发明，数据处理电路和连接组件设置在至少一个模块载体的区域中，并且卡载体具有用于容纳模块载体的区域。 这使得首先可以在完成的模块载体合并到卡载体之前对其正常工作进行测试。