公开(公告)号：US20050233478A1

公开(公告)日：2005-10-20

申请号：US10709109

申请日：2004-04-14

申请人： Douglas Coolbaugh ,  Hayden Cranford ,  Terence Hook ,  Anthony Stamper

发明人： Douglas Coolbaugh ,  Hayden Cranford ,  Terence Hook ,  Anthony Stamper

IPC分类号： H01L21/00 ,  H01L23/525 ,  H01L27/08 ,  H01P3/08

CPC分类号： H01L27/0802 ,  H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit having a precision passive circuit element, such as a resistor or a capacitor, with a target value of an electrical parameter is fabricated on a substrate with a plurality of independent parallel-connected passive circuit elements. The plurality of passive circuit elements are designed to have a plurality of values of the electrical parameter which are spaced or offset at or around the target value of the electrical parameter, such as three circuit elements with one having a value at the target value, one having a value above the target value, and one having a value below the target value. Each passive circuit element also has a fuse in series therewith. A reference calibration structure is also fabricated, which can be a passive circuit element having the target value of the electrical parameter, in a reference area of the substrate under the same conditions and at the same time as fabrication of the plurality of passive circuit elements. The actual component value of the reference calibration structure is then measured, and based upon the measurement a single precision passive element of the plurality of parallel passive circuit elements is selected by blowing the fuses of, and thus deselecting, the other independent parallel connected passive circuit elements.

摘要翻译： 在具有多个独立并联无源电路元件的基板上制造具有目标值为电参数的精密无源电路元件（例如电阻器或电容器）的电路。 多个无源电路元件被设计为具有电参数的多个值，其在电参数的目标值处或周围被间隔或偏移，例如具有值在目标值的三个电路元件，一个 具有高于目标值的值，并且具有低于目标值的值。 每个无源电路元件还具有与其串联的保险丝。 还可以在相同条件下的基板的参考区域中以及在制造多个无源电路元件的同时，制造参考校准结构，其可以是具有电参数的目标值的无源电路元件。 然后测量参考校准结构的实际分量值，并且基于测量，多个并联无源电路元件中的单精度无源元件通过吹入另一个独立并联无源电路的熔丝并因此取消选择来选择 元素。

公开(公告)号：US20080018378A1

公开(公告)日：2008-01-24

申请号：US11865432

申请日：2007-10-01

申请人： Douglas Coolbaugh ,  Hayden Cranford ,  Terence Hook ,  Anthony Stamper

发明人： Douglas Coolbaugh ,  Hayden Cranford ,  Terence Hook ,  Anthony Stamper

IPC分类号： H03H7/00

CPC分类号： H01L27/0802 ,  H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A circuit having a precision passive circuit element, such as a resistor or a capacitor, with a target value of an electrical parameter is fabricated on a substrate with a plurality of independent parallel-connected passive circuit elements. The plurality of passive circuit elements are designed to have a plurality of values of the electrical parameter which are spaced or offset at or around the target value of the electrical parameter, such as three circuit elements with one having a value at the target value, one having a value above the target value, and one having a value below the target value. Each passive circuit element also has a fuse in series therewith. A reference calibration structure is also fabricated, which can be a passive circuit element having the target value of the electrical parameter, in a reference area of the substrate under the same conditions and at the same time as fabrication of the plurality of passive circuit elements. The actual component value of the reference calibration structure is then measured, and based upon the measurement a single precision passive element of the plurality of parallel passive circuit elements is selected by blowing the fuses of, and thus deselecting, the other independent parallel connected passive circuit elements.

摘要翻译： 在具有多个独立并联无源电路元件的基板上制造具有目标值为电参数的精密无源电路元件（例如电阻器或电容器）的电路。 多个无源电路元件被设计为具有电参数的多个值，其在电参数的目标值处或周围被间隔或偏移，例如具有值在目标值的三个电路元件，一个 具有高于目标值的值，并且具有低于目标值的值。 每个无源电路元件还具有与其串联的保险丝。 还可以在相同条件下的基板的参考区域中以及在制造多个无源电路元件的同时，制造参考校准结构，其可以是具有电参数的目标值的无源电路元件。 然后测量参考校准结构的实际分量值，并且基于测量，多个并联无源电路元件中的单精度无源元件通过吹入另一个独立并联无源电路的熔丝并因此取消选择来选择 元素。

公开(公告)号：US20080042798A1

公开(公告)日：2008-02-21

申请号：US11848263

申请日：2007-08-31

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

IPC分类号： H01C1/08

CPC分类号： H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

摘要： A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

公开(公告)号：US20060152333A1

公开(公告)日：2006-07-13

申请号：US10905546

申请日：2005-01-10

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Terence Hook ,  Robert Rassel ,  Edmund Sprogis ,  Anthony Stamper ,  William Murphy

IPC分类号： H01C1/08

CPC分类号： H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

摘要： A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

摘要翻译： 提供带散热片的电阻。 散热器包括具有导热性高的金属或其它热导体的导电路径。 为了避免使用热导体将电阻器短路接地，在热导体和电阻体之间插入有一层薄导电电绝缘体。 因此，电阻器可承载大量的电流，因为高导电性热导体将热量从电阻器传导到散热器。 除了降低寄生电容和其他寄生电效应之外，提供各种配置的导热体和散热片，提供良好的导热性能，这将降低电阻器的高频响应。

公开(公告)号：US20080108186A1

公开(公告)日：2008-05-08

申请号：US12002807

申请日：2007-12-19

申请人： Terence Hook ,  Anda Mocuta ,  Jeffrey Sleight ,  Anthony Stamper

发明人： Terence Hook ,  Anda Mocuta ,  Jeffrey Sleight ,  Anthony Stamper

IPC分类号： H01L21/84

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/0251 ,  H01L27/0629 ,  H01L27/1203 ,  H01L27/1207

摘要： In a method of fabricating a CMOS structure, a bulk device can be formed in a first region in conductive communication with an underlying bulk region of the substrate. A first gate conductor may overlie the first region. An SOI device can be formed which has a source drain conduction path in a SOI layer, i.e., a semiconductor layer that is separated from the bulk region by a buried dielectric region. The crystal orientations of the SOI layer and the bulk region can be different. A first diode can be formed in a second region of the substrate in conductive communication with the bulk region. The first diode may be connected in a reverse-biased orientation to a first gate conductor above the SOI layer, such that a voltage on the gate conductor that exceeds the breakdown voltage can be discharged through the first diode to the bulk region of the substrate. A second diode may be formed in a third region of the substrate in conductive communication with the bulk region. The second diode may be connected in a reverse-biased orientation to a source region or a drain region of an NFET.

摘要翻译： 在制造CMOS结构的方法中，本体器件可以形成在与衬底的下面的主体区域导电连通的第一区域中。 第一栅极导体可以覆盖在第一区域上。 可以形成在SOI层中具有源极漏极传导路径的SOI器件，即通过掩埋电介质区域与本体区域分离的半导体层。 SOI层和体区的晶体取向可以不同。 第一二极管可以形成在衬底的与体区导电连通的第二区域中。 第一二极管可以以反向偏置的方式连接到SOI层上方的第一栅极导体，使得超过击穿电压的栅极导体上的电压可以通过第一二极管放电到衬底的主体区域。 第二二极管可以形成在衬底的与体区导电连通的第三区域中。 第二二极管可以以反向偏置的方式连接到NFET的源极区域或漏极区域。

公开(公告)号：US20070228479A1

公开(公告)日：2007-10-04

申请号：US11308513

申请日：2006-03-31

申请人： Terence Hook ,  Anda Mocuta ,  Jeffrey Sleight ,  Anthony Stamper

发明人： Terence Hook ,  Anda Mocuta ,  Jeffrey Sleight ,  Anthony Stamper

IPC分类号： H01L29/94 ,  H01L21/8238

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/0251 ,  H01L27/0629 ,  H01L27/1203 ,  H01L27/1207

摘要： A chip includes a CMOS structure having a bulk device disposed in a first region of a semiconductor substrate in conductive communication with an underlying bulk region of the substrate, the first region and the bulk region having a first crystal orientation. A SOI device is disposed in a semiconductor-on-insulator (“SOI”) layer separated from the bulk region of the substrate by a buried dielectric layer, the SOI layer having a different crystal orientation from the first crystal orientation. In one example, the bulk device includes a p-type field effect transistor (“PFET”) and the SOI device includes an n-type field effect transistor (“NFET”) device. Alternatively, the bulk device can include an NFET and the SOI device can include a PFET. When the SOI device has a gate conductor in conductive communication with a gate conductor of the bulk device, charging damage can occur to the SOI device, except for the presence of diodes in reverse-biased conductive communication with the bulk region. The diodes are operable to conduct a discharge current to the bulk region when either a voltage on the gate conductor or a voltage on the source or drain region of the SOI device exceeds a diode's breakdown voltage.

摘要翻译： 芯片包括CMOS结构，其具有设置在半导体衬底的与衬底的下面的主体区域导电连通的第一区域中的本体器件，第一区域和主体区域具有第一晶体取向。 SOI器件设置在绝缘体上半导体（“SOI”）层中，该绝缘体绝缘体（“SOI”）层通过掩埋电介质层与衬底的主体区域分离，SOI层具有与第一晶体取向不同的晶体取向。 在一个示例中，体器件包括p型场效应晶体管（“PFET”），并且SOI器件包括n型场效应晶体管（“NFET”）器件。 或者，体器件可以包括NFET，并且SOI器件可以包括PFET。 当SOI器件具有与本体器件的栅极导体导通的栅极导体时，除了存在与体区域反向偏置导电连通的二极管之外，SOI器件可能发生充电损坏。 当栅极导体上的电压或SOI器件的源极或漏极区域上的电压超过二极管的击穿电压时，二极管可操作以将放电电流传导到体区。

公开(公告)号：US20070166909A1

公开(公告)日：2007-07-19

申请号：US11275611

申请日：2006-01-19

申请人： Eric Coker ,  Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  Matthew Moon ,  Anthony Stamper

发明人： Eric Coker ,  Douglas Coolbaugh ,  Ebenezer Eshun ,  Zhong-Xiang He ,  Matthew Moon ,  Anthony Stamper

IPC分类号： H01L21/8244

CPC分类号： H01L27/016

摘要： A BEOL thin-film resistor adapted for flexible integration rests on a first layer of ILD. The thickness of the first layer of ILD and the resistor thickness combine to match the nominal design thickness of vias in the layer of concern. A second layer of ILD matches the resistor thickness and is planarized to the top surface of the resistor. A third layer of ILD has a thickness equal to the nominal value of the interconnections on this layer. *Dual damascene interconnection apertures and apertures for making contact with the resistor are formed simultaneously, with the etch stop upper cap layer in the resistor protecting the resistive layer while the vias in the dual damascene apertures are formed.

摘要翻译： 适用于灵活集成的BEOL薄膜电阻依赖于第一层ILD。 ILD的第一层的厚度和电阻器厚度相结合，以匹配所涉及的层中的通孔的标称设计厚度。 第二层ILD匹配电阻器厚度，并平坦化到电阻器的顶表面。 ILD的第三层具有等于该层上互连的标称值的厚度。 同时形成用于与电阻器接触的双镶嵌互连孔和孔，电阻器中的蚀刻停止上盖层保护电阻层，同时形成双镶嵌孔中的通孔。

公开(公告)号：US20050230785A1

公开(公告)日：2005-10-20

申请号：US10709115

申请日：2004-04-14

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Robert Rassel ,  Anthony Stamper

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Robert Rassel ,  Anthony Stamper

IPC分类号： H01C17/26 ,  H01L29/76

CPC分类号： H01C17/267

摘要： A structure for resistors and the method for tuning the same. The resistor comprises an electrically conducting region coupled to a liner region. Both the electrically conducting region and the liner region are electrically coupled to first and second contact regions. A voltage difference is applied between the first and second contact regions. As a result, a current flows between the first and second contact regions in the electrically conducting region. The voltage difference and the materials of the electrically conducting region and the liner region are such that electromigration occurs only in the electrically conducting region. As a result, a void region within the electrically conducting region expands in the direction of the flow of the charged particles constituting the current. Because the resistor loses a conducting portion of the electrically conducting region to the void region, the resistance of the resistor is increased (i.e., tuned).

摘要翻译： 电阻器结构及其调谐方法。 电阻器包括耦合到衬垫区域的导电区域。 导电区域和衬里区域都电耦合到第一和第二接触区域。 在第一和第二接触区域之间施加电压差。 结果，电流在导电区域中的第一和第二接触区域之间流动。 导电区域和衬垫区域的电压差和材料使得电迁移仅在导电区域中发生。 结果，导电区域内的空隙区域在构成电流的带电粒子的流动方向上膨胀。 因为电阻器将导电区域的导电部分损失到空隙区域，电阻器的电阻增加（即调谐）。

公开(公告)号：US20080090407A1

公开(公告)日：2008-04-17

申请号：US11953927

申请日：2007-12-11

申请人： Douglas Coolbaugh ,  Daniel Edelstein ,  Ebenezer Eshun ,  Zhong-Xiang He ,  Robert Rassel ,  Anthony Stamper

发明人： Douglas Coolbaugh ,  Daniel Edelstein ,  Ebenezer Eshun ,  Zhong-Xiang He ,  Robert Rassel ,  Anthony Stamper

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05007 ,  H01L2224/05022 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552

摘要： Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The methods including forming the terminal pads subtractively or by a damascene process.

摘要翻译： 端子焊盘和制造端子焊盘的方法。 所述方法包括在由包括扩散阻挡层的多个电介质层组成的钝化层的内部或与其重叠的导电焊盘下方形成导电扩散阻挡层。 所述方法包括减法地形成端子焊盘或通过镶嵌工艺。

公开(公告)号：US20070187800A1

公开(公告)日：2007-08-16

申请号：US11737304

申请日：2007-04-19

申请人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Robert Rassel ,  Anthony Stamper

发明人： Douglas Coolbaugh ,  Ebenezer Eshun ,  Robert Rassel ,  Anthony Stamper

IPC分类号： H01L29/00 ,  H01L21/20

CPC分类号： H01C17/267

摘要： A structure for resistors and the method for tuning the same. The resistor comprises an electrically conducting region coupled to a liner region. Both the electrically conducting region and the liner region are electrically coupled to first and second contact regions. A voltage difference is applied between the first and second contact regions. As a result, a current flows between the first and second contact regions in the electrically conducting region. The voltage difference and the materials of the electrically conducting region and the liner region are such that electromigration occurs only in the electrically conducting region. As a result, a void region within the electrically conducting region expands in the direction of the flow of the charged particles constituting the current. Because the resistor loses a conducting portion of the electrically conducting region to the void region, the resistance of the resistor is increased (i.e., tuned).

摘要翻译： 电阻器结构及其调谐方法。 电阻器包括耦合到衬垫区域的导电区域。 导电区域和衬里区域都电耦合到第一和第二接触区域。 在第一和第二接触区域之间施加电压差。 结果，电流在导电区域中的第一和第二接触区域之间流动。 导电区域和衬垫区域的电压差和材料使得电迁移仅在导电区域中发生。 结果，导电区域内的空隙区域在构成电流的带电粒子的流动方向上膨胀。 因为电阻器将导电区域的导电部分损失到空隙区域，电阻器的电阻增加（即调谐）。