公开(公告)号：US20070146941A1

公开(公告)日：2007-06-28

申请号：US11679061

申请日：2007-02-26

申请人： EDWIN HARRIS ,  Tushar Vyas ,  Timothy Pachla

发明人： EDWIN HARRIS ,  Tushar Vyas ,  Timothy Pachla

IPC分类号： H02H9/00

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

公开(公告)号：US20070139848A1

公开(公告)日：2007-06-21

申请号：US11679064

申请日：2007-02-26

申请人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla

发明人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla

IPC分类号： H02H9/06

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

公开(公告)号：US20050057867A1

公开(公告)日：2005-03-17

申请号：US10958442

申请日：2004-10-05

申请人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla ,  James Colby

发明人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla ,  James Colby

IPC分类号： H02H9/04 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H02H9/00

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

摘要翻译： 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂和因此VVM是自固化型和适用在使用前，其干燥可涂抹的形式。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂和因此的VVM可以通过诸如筛网或模版印刷的工艺直接应用于许多不同类型的基材，例如刚性FR-4层压板，聚酰亚胺，聚合物或多层PCB。 在一个实施例中，VVM包括两种类型的导电颗粒，其中一个芯和一个没有芯。 VVM还可以具有核 - 壳型半导体颗粒。

公开(公告)号：US07609141B2

公开(公告)日：2009-10-27

申请号：US11679061

申请日：2007-02-26

申请人： Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

发明人： Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

IPC分类号： H01C7/10

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

公开(公告)号：US07843308B2

公开(公告)日：2010-11-30

申请号：US11679064

申请日：2007-02-26

申请人： Timothy Pachla ,  Edwin James Harris ,  Tushar Vyas

发明人： Timothy Pachla ,  Edwin James Harris ,  Tushar Vyas

IPC分类号： H01C7/10

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

公开(公告)号：US07183891B2

公开(公告)日：2007-02-27

申请号：US10958442

申请日：2004-10-05

申请人： Edwin James Harris ,  Tushar Vyas ,  Timothy Pachla ,  James A. Colby

发明人： Edwin James Harris ,  Tushar Vyas ,  Timothy Pachla ,  James A. Colby

IPC分类号： H01C7/10

CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

摘要： A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

摘要翻译： 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂和因此的VVM可以通过诸如筛网或模版印刷的工艺直接应用于许多不同类型的基材，例如刚性FR-4层压板，聚酰亚胺，聚合物或多层PCB。 在一个实施例中，VVM包括两种类型的导电颗粒，一种具有芯和一个不具有芯。 VVM还可以具有核 - 壳型半导体颗粒。

公开(公告)号：US20060152334A1

公开(公告)日：2006-07-13

申请号：US11032442

申请日：2005-01-10

申请人： Nathaniel Maercklein ,  Tushar Vyas ,  Timothy Pachla ,  Stephen Whitney

发明人： Nathaniel Maercklein ,  Tushar Vyas ,  Timothy Pachla ,  Stephen Whitney

IPC分类号： H01C3/06

CPC分类号： H01C7/003 ,  H01C7/12 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2201/09509

摘要： An improved electrical circuit that includes an embedded electrical component and an embedded voltage variable material (“VVM”) is provided. In one embodiment, the embedded VVM is provided as a voltage variable substrate, which is used in combination with an embedded electrical component, such as an embedded resistive material or an embedded capacitive material.

摘要翻译： 提供了包括嵌入式电气部件和嵌入式电压可变材料（“VVM”）的改进的电路。 在一个实施例中，嵌入式VVM被提供为电压可变衬底，其与嵌入式电气部件（例如嵌入式电阻材料或嵌入式电容材料）结合使用。

公开(公告)号：US20070018774A1

公开(公告)日：2007-01-25

申请号：US11186130

申请日：2005-07-20

申请人： Gordon Dietsch ,  Timothy Pachla ,  Stephen Whitney ,  William Rodseth

发明人： Gordon Dietsch ,  Timothy Pachla ,  Stephen Whitney ,  William Rodseth

IPC分类号： H01H85/04

CPC分类号： H01H85/0411 ,  H01H85/046 ,  H01H85/055 ,  H01H85/06 ,  H01H85/10 ,  H01H85/157 ,  H01H2085/0414 ,  H01H2085/466 ,  H01H2300/036

摘要： Reactive fuses that contain reactive fuse elements for use in electrical circuits and other applications are provided. In various exemplary embodiments reactive materials and reactive foils are employed to provide a focused, localized heat source which can by used to open or sever a fuse element, or precisely join one or more metallic components. In particular, reactive material can be utilized to open a fuse element in response to the heat generated by a sustained overload current. Alternatively, reactive material may be utilized in the construction of a reactive fuse to join, for example, metallic components to a base fuse element or fuse cap.

摘要翻译： 提供了包含用于电路和其他应用的反应性熔丝元件的反应式熔断器。 在各种示例性实施例中，反应性材料和反应性箔用于提供聚焦的局部热源，其可以通过用于打开或切断熔丝元件或精确地接合一个或多个金属部件。 特别地，可以利用反应性材料来响应由持续的过载电流产生的热而打开熔丝元件。 或者，反应性材料可以用于构建反应性熔丝，以将例如金属组分连接到基部熔丝元件或熔丝盖。

公开(公告)号：US20060273876A1

公开(公告)日：2006-12-07

申请号：US11144238

申请日：2005-06-02

申请人： Timothy Pachla ,  Stephen Whitney

发明人： Timothy Pachla ,  Stephen Whitney

IPC分类号： H01H61/06 ,  H01H71/18

CPC分类号： H05K1/0201 ,  H05K2201/0308 ,  H05K2203/175

摘要： Over-temperature protection devices, over-temperature applications on substrates, such as printed circuit boards, and over-temperature protection circuits, e.g., over-temperature protection in combination with a fuse or heater are provided. In various embodiments a shape memory alloy member is used, which can either break electrical contact with a conductor (open a circuit) or make electrical contact with a conductor (close a circuit). Upon opening a first circuit, the member can move to contact another conductor and complete a second circuit. The member can close a circuit, which is in parallel with a fused load, to provide a short circuit path that opens a fuse upon an over-temperature condition occurring, e.g., within an electrical device such as a cell phone or battery. Or, the member can be provided in parallel with a heater that energizes upon an overcurrent condition, triggering the member to open a circuit.

摘要翻译： 提供过温保护装置，诸如印刷电路板的衬底上的过温应用以及过温保护电路，例如与保险丝或加热器组合的过温保护。 在各种实施例中，使用形状记忆合金构件，其可以断开与导体的电接触（打开电路）或者与导体（闭合电路）进行电接触。 在打开第一电路时，构件可以移动以接触另一导体并完成第二电路。 该构件可以闭合与熔融负载并联的电路，以提供短路路径，该短路路径在例如在诸如手机或电池的电气装置内发生的过温状态下打开熔断器。 或者，该构件可以与加热器并联设置，该加热器在过电流状态下通电，触发构件打开电路。

公开(公告)号：US20070075822A1

公开(公告)日：2007-04-05

申请号：US11537906

申请日：2006-10-02

申请人： Timothy Pachla ,  Gordon Dietsch

发明人： Timothy Pachla ,  Gordon Dietsch

IPC分类号： H01H85/04

CPC分类号： H01H85/0411 ,  H01H85/0086 ,  H01H85/046 ,  H01H2085/0412 ,  H01H2085/0414 ,  H01H2085/0555

摘要： A surface mount fuse includes a substrate, a fuse element applied to the substrate, first and second terminals applied to substrate, first and second conductors connecting the fuse element electrically with the first and second terminals, and an enclosure coupled to the substrate, the enclosure covering the first and second conductors and defining a cavity overlying at least a portion of the fuse element, the cavity allowing for distortion of the fuse element upon its opening.

摘要翻译： 表面安装保险丝包括衬底，施加到衬底的熔丝元件，施加到衬底的第一和第二端子，将熔丝元件与第一和第二端子电连接的第一和第二导体以及耦合到衬底的外壳 覆盖所述第一和第二导体并且限定覆盖所述熔丝元件的至少一部分的空腔，所述空腔允许所述熔丝元件在其开口时变形。