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1.发明授权公开(公告)号：US11648638B2
公开(公告)日：2023-05-16
申请号：US16638711
申请日：2018-08-20
Applicant: Ebara Corporation
Inventor： Tetsuji Togawa , Kenichi Kobayashi
IPC: B24B37/04 , B24B57/02 , H01L21/306
CPC classification number: B24B37/042 , B24B57/02 , H01L21/30625
Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.
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公开(公告)号：US11607769B2
公开(公告)日：2023-03-21
申请号：US16607649
申请日：2018-04-23
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Hiroshi Sobukawa , Masahiro Hatakeyama
IPC: B24B37/013 , B24B37/015 , B24B37/04 , B24B37/30 , B24B49/12 , B24B53/017
Abstract: A CMP polishing apparatus for flattening a quadrate substrate is provided.
A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.-
公开(公告)号：US20200094371A1
公开(公告)日：2020-03-26
申请号：US16575844
申请日：2019-09-19
Applicant: EBARA CORPORATION
Inventor： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.
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公开(公告)号：US10307882B2
公开(公告)日：2019-06-04
申请号：US15058710
申请日：2016-03-02
Applicant: EBARA CORPORATION
Inventor： Makoto Fukushima , Tetsuji Togawa , Shingo Togashi , Tomoshi Inoue
Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
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公开(公告)号：US20170312879A1
公开(公告)日：2017-11-02
申请号：US15654594
申请日：2017-07-19
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/005 , B24B21/00 , B24B9/06
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
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Patent Agency Ranking
6.发明授权Method of detecting abnormality in polishing of a substrate and polishing apparatus 有权检测基板和研磨装置的抛光异常的方法公开(公告)号：US09248543B2
公开(公告)日：2016-02-02
申请号：US14034488
申请日：2013-09-23
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/005 , B24B9/06
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
Abstract translation: 提供了检测基板的研磨异常的方法。 该方法包括：旋转衬底; 将抛光工具压靠在基板的边缘部分上以抛光边缘部分; 测量所述抛光工具相对于所述衬底的表面的位置; 从抛光工具的位置确定衬底的抛光量; 从所述基板的抛光量计算抛光速率; 并且如果抛光速率在预定范围之外，则判断出已经发生了基板边缘部分的抛光异常。
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7.发明授权公开(公告)号：US12138734B2
公开(公告)日：2024-11-12
申请号：US18297469
申请日：2023-04-07
Applicant: Ebara Corporation
Inventor： Tetsuji Togawa , Kenichi Kobayashi
IPC: B24B37/04 , B24B57/02 , H01L21/306
Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.
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公开(公告)号：US09782869B2
公开(公告)日：2017-10-10
申请号：US14987434
申请日：2016-01-04
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/00 , B24B37/005 , B24B9/06 , B24B21/00
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.
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公开(公告)号：US09561573B2
公开(公告)日：2017-02-07
申请号：US14167129
申请日：2014-01-29
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Tetsuji Togawa
CPC classification number: B24B21/002 , B24B9/065 , B24B21/004 , B24B21/18
Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板。 抛光装置包括用于保持基板并旋转基板的基板保持件，构造成将抛光工具压靠在基板上并对基板进行抛光的按压部件，被配置为控制按压部件的按压力的按压力控制机构 以及配置为限制按压部件的研磨位置的抛光位置限制机构。 抛光带或固定磨料用作抛光工具。
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公开(公告)号：US09399274B2
公开(公告)日：2016-07-26
申请号：US14167898
申请日：2014-01-29
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Atsushi Yoshida , Toshifumi Watanabe
IPC: B24B9/06 , H01L21/463 , B24B21/00
CPC classification number: B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/06 , B24B27/0076 , H01L21/02035 , H01L21/463
Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
Abstract translation: 描述了抛光衬底的装置和方法。 抛光包括：旋转衬底; 将第一抛光工具压靠在基板的边缘部分上以抛光边缘部分; 并且将第二抛光工具压靠在基板的边缘部分上以抛光边缘部分。 相对于基板的径向方向，第二抛光工具位于比第一抛光工具更向内的位置。 第一抛光工具具有比第二抛光工具的抛光表面更粗糙的抛光表面。
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