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1.发明申请公开(公告)号：US20120018832A1
公开(公告)日：2012-01-26
申请号：US12841750
申请日：2010-07-22
申请人： Edward C. COONEY, III , Jeffrey P. GAMBINO , Robert K. LEIDY , Charles F. MUSANTE , John G. TWOMBLY
发明人： Edward C. COONEY, III , Jeffrey P. GAMBINO , Robert K. LEIDY , Charles F. MUSANTE , John G. TWOMBLY
IPC分类号： H01L31/0232 , G06F17/50 , H01L21/30 , H01L31/18
CPC分类号： H01L31/02325 , C23C16/02 , C23C16/0272 , C23C16/402 , C23C16/505 , G06F17/5045 , H01L27/14627 , H01L27/14685
摘要： Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.
摘要翻译： 公开了用于改善成像器微透镜结构保护层附着力的方法，结构和设计结构。 制造半导体结构的方法包括在微透镜和保护氧化物层之间形成界面区域。 界面区域的氧浓度低于保护氧化物层。
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2.发明申请PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES 有权平面CAVITY MEMS及相关结构，制造方法和设计结构公开(公告)号：US20110315527A1
公开(公告)日：2011-12-29
申请号：US12974854
申请日：2010-12-21
申请人： Dinh DANG , Thai DOAN , George A. DUNBAR, III , Zhong-Xiang HE , Russell T. HERRIN , Christopher V. JAHNES , Jeffrey C. MALING , William J. MURPHY , Anthony K. STAMPER , John G. TWOMBLY , Eric J. WHITE
发明人： Dinh DANG , Thai DOAN , George A. DUNBAR, III , Zhong-Xiang HE , Russell T. HERRIN , Christopher V. JAHNES , Jeffrey C. MALING , William J. MURPHY , Anthony K. STAMPER , John G. TWOMBLY , Eric J. WHITE
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.
摘要翻译： 提供了平面腔微机电系统（MEMS）结构，制造方法和设计结构。 该方法包括使用反向镶嵌工艺形成具有平面表面的至少一个微机电系统（MEMS）空腔。
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3.发明申请PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES 有权平面CAVITY MEMS及相关结构，制造方法和设计结构公开(公告)号：US20110314669A1
公开(公告)日：2011-12-29
申请号：US12973381
申请日：2010-12-20
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.
摘要翻译： 形成至少一个微电子机械系统（MEMS）的方法包括：对布线层进行图案化以形成至少一个固定板并在布线层上形成牺牲材料。 该方法还包括在至少一个固定板上形成一层或多层薄膜的绝缘体层，以及下层衬底的暴露部分，以防止在布线层和牺牲材料之间形成反应产物。 该方法进一步包括形成至少一个可在该至少一个固定板上移动的MEMS梁。 该方法还包括排出或剥离牺牲材料以形成至少第一腔。
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