公开(公告)号：US20170125330A1

公开(公告)日：2017-05-04

申请号：US15401778

申请日：2017-01-09

Applicant: FUJIFILM Corporation

Inventor： Yoshinori HOTTA ,  Shunji KUROOKA ,  Kosuke YAMASHITA

IPC: H01L23/498 ,  H05K1/14 ,  H05K1/03

CPC classification number: H01L23/49822 ,  H01L23/32 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/03 ,  H05K1/14 ,  H05K1/144 ,  H01L2924/00

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

公开(公告)号：US20210040370A1

公开(公告)日：2021-02-11

申请号：US17072001

申请日：2020-10-15

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA ,  Kazuto SHIMADA

IPC: C09K5/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C08K3/04 ,  C08K9/02 ,  C08K3/28 ,  C08K7/04 ,  H01L23/373

Abstract: The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2 s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

公开(公告)号：US20160153104A1

公开(公告)日：2016-06-02

申请号：US15019370

申请日：2016-02-09

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA

IPC: C25D1/20 ,  H01L23/00

CPC classification number: C25D1/20 ,  C25D1/006 ,  C25D1/10 ,  C25D3/38 ,  C25D11/045 ,  C25D11/20 ,  C25D11/24 ,  H01L24/27 ,  H01R12/7076 ,  H01R2201/20 ,  H05K3/32 ,  H05K2203/162

Abstract: An object of the present invention is to provide a method for manufacturing a metal-filled microstructure, capable of easily filling micropores with metal and suppressing the generation of residual stress caused by metal filling. A method for manufacturing a metal-filled microstructure according to the present invention includes: an anodic oxidation treatment step of anodically oxidizing a single surface of an aluminum substrate to form an anodic oxidation film on the single surface of the aluminum substrate, the anodic oxidation film including micropores, which are present in a thickness direction, and a barrier layer which is present in a bottom portion of the micropores; a barrier layer removal step of removing the barrier layer of the anodic oxidation film after the anodic oxidation treatment step; a metal filling step of filling the inside of the micropores with metal through an electroplating treatment after the barrier layer removal step; and a substrate removal step of removing the aluminum substrate to obtain a metal-filled microstructure after the metal filling step.

Abstract translation: 本发明的目的是提供一种能够容易地用金属填充微孔并抑制由金属填充引起的残余应力的产生的金属填充微结构的制造方法。 根据本发明的制造金属填充微结构的方法包括：阳极氧化处理步骤，阳极氧化铝基板的单面以在铝基板的单个表面上形成阳极氧化膜，阳极氧化膜 包括存在于厚度方向的微孔和存在于微孔的底部的阻挡层; 在阳极氧化处理步骤之后去除阳极氧化膜的阻挡层的阻挡层去除步骤; 在阻挡层去除步骤之后通过电镀处理用金属填充微孔内部的金属填充步骤; 以及去除铝基板以在金属填充步骤之后获得金属填充的微结构的基板去除步骤。

公开(公告)号：US20220216126A1

公开(公告)日：2022-07-07

申请号：US17699181

申请日：2022-03-21

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA ,  Naotsugu MURO ,  Toshiyuki SAIE ,  Naoki SATO ,  Kazuto SHIMADA

IPC: H01L23/373 ,  H01L21/66

Abstract: There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10−7 m2s−1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.

公开(公告)号：US20200168551A1

公开(公告)日：2020-05-28

申请号：US16775497

申请日：2020-01-29

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA

IPC: H01L23/538 ,  H01L25/16 ,  H01L21/48

Abstract: A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.

公开(公告)号：US20180350769A1

公开(公告)日：2018-12-06

申请号：US16055734

申请日：2018-08-06

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA

IPC: H01L23/00 ,  H01L21/768

CPC classification number: H01L24/83 ,  H01L21/76841 ,  H01L21/76877 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29366 ,  H01L2224/2937 ,  H01L2224/29379 ,  H01L2224/29381 ,  H01L2224/29384 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H05K3/323 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/10378 ,  H05K2203/0278 ,  H01L2224/81 ,  H01L2224/83

Abstract: An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.

公开(公告)号：US20160336262A1

公开(公告)日：2016-11-17

申请号：US15219803

申请日：2016-07-26

Applicant: FUJIFILM Corporation

Inventor： Kosuke YAMASHITA

IPC: H01L23/498 ,  H05K1/11 ,  H01L21/48 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/49838 ,  C23C18/00 ,  C23C18/1653 ,  C23C18/54 ,  C25D3/00 ,  C25D3/38 ,  C25D5/48 ,  C25D11/045 ,  C25D11/08 ,  C25D11/12 ,  C25D11/16 ,  C25D11/20 ,  C25F3/20 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2203/0315

Abstract: The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.

Abstract translation: 本发明提供一种能够在确保精细导电路径的同时提高绝缘基板的耐电压的微结构，多层布线基板，半导体封装以及微结构制造方法。 本发明的微细结构具有绝缘基板，具有多个贯通孔，导电路径由含有填充多个贯通孔的金属的导电材料构成，其中多个通孔的平均开口直径为5nm〜 连接相邻的通孔的最短距离的平均值为10nm〜300nm，水分含量相对于微结构的总质量为0.005％以下。

公开(公告)号：US20140085829A1

公开(公告)日：2014-03-27

申请号：US14030148

申请日：2013-09-18

Applicant: Fujifilm Corporation

Inventor： Kosuke YAMASHITA

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2225/06589 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1461 ,  H01L2924/00

Abstract: The invention provides a multi-layered board and a semiconductor package including the multi-layered board with improved heat dissipation performance of the semiconductor package. A multi-layered board includes an anisotropically-conductive member that includes an insulating base which is an anodized film of an aluminum substrate and in which through-holes are formed in a thickness direction and a plurality of conduction passages which are formed of a conductive material filled in the through-holes and which extend through the insulating base in the thickness direction with the conduction passages insulated from each other, a heat conducting layer that includes heat conducting portions and is disposed on at least one surface of the anisotropically-conductive member, and heat dissipating portions formed of the conductive material and protruding from the insulating base.

Abstract translation: 本发明提供一种多层板和半导体封装，其包括具有改善的半导体封装的散热性能的多层板。 多层板包括各向异性导电构件，其包括作为铝基板的阳极氧化膜的绝缘基底，并且其厚度方向上形成有通孔和由导电材料形成的多个导电通道 填充在所述通孔中，并且所述通孔彼此绝缘的在所述厚度方向上延伸穿过所述绝缘基底;导热层，其包括导热部分并设置在所述各向异性导电部件的至少一个表面上; 以及由导电材料形成并从绝缘基底突出的散热部。