LAMINATE, KIT, AND METHOD FOR PRODUCING LAMINATE

    公开(公告)号:US20200069531A1

    公开(公告)日:2020-03-05

    申请号:US16675412

    申请日:2019-11-06

    Inventor: Yuta SHIGENOI

    Abstract: The present invention provides a laminate having excellent bacteria adhesion suppression performance. The present invention also provides a kit and a method for producing a laminate. A laminate according to the present invention includes a base material, an undercoat layer formed of an undercoat layer forming composition containing a polymer containing a repeating unit containing a polymerizable group and a repeating unit containing a polar group, and a cured film formed of a curable composition containing at least one compound selected from the group consisting of a compound represented by Formula (I), a compound represented by Formula (II), a compound represented by Formula (IV), and a compound represented by Formula (V) in this order.

    COMPOSITION FOR TREATING SEMICONDUCTOR AND METHOD FOR TREATING OBJECT TO BE TREATED

    公开(公告)号:US20230420266A1

    公开(公告)日:2023-12-28

    申请号:US18463754

    申请日:2023-09-08

    CPC classification number: H01L21/32134

    Abstract: The present invention provides a composition for treating a semiconductor in which etching of silicon germanium is suppressed and a ratio of an etching rate of silicon to an etching rate of silicon germanium is large. In addition, the present invention provides a method for treating an object to be treated using a composition for treating a semiconductor. The composition for treating a semiconductor according to the present invention is a composition for treating a semiconductor including a quaternary ammonium salt having a hydroxyl group, a polar organic solvent, at least one nitrogen-containing compound selected from the group consisting of a compound represented by Formula (1), a compound represented by Formula (2), and salts thereof, and water, in which the mass ratio of the nitrogen-containing compound to the quaternary ammonium salt is 0.00001 to 0.1.

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