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1.发明授权公开(公告)号：US06566170B1
公开(公告)日：2003-05-20
申请号：US09701435
申请日：2000-12-18
IPC分类号： H01L2148
CPC分类号： H01L23/10 , B81C1/00269 , B81C3/002 , B81C2203/019 , B81C2203/032 , H01L21/50 , H01L2224/29011 , H01L2224/29013 , H01L2224/73103 , H01L2224/73203 , H01L2224/81191 , H01L2924/01079 , H01L2924/16152 , H01L2924/00012
摘要： Device comprising a carrier (100) and at least one cover (104) able to be bonded to the carrier to form with the carrier at least one cavity (114) having a controlled atmosphere around at least one component (102). In accordance with the invention, at least one of either the cover or the carrier is provided with at least one wedge (110) in fusible material and a strip of insulation (112) formed around said component, and before bonding, the wedge of fusible material is of sufficient thickness to prevent the strip of insulation (112) from coming into contact both with the cover and with the carrier when they are assembled together. Particular application to the encapsulation of electronic, mechanical or electromagnetic components.
摘要翻译： 装置包括载体（100）和至少一个盖子（104），所述至少一个盖子能够与所述载体结合以与所述载体形成至少一个具有围绕至少一个部件（102）的受控气氛的空腔（114）。 根据本发明，覆盖物或载体中的至少一个在易熔材料中设置有至少一个楔形物（110）和围绕所述构件形成的绝缘条（112），并且在粘合之前，可熔融的楔形物 材料具有足够的厚度，以防止绝缘条（112）在组装在一起时与盖和载体接触。特别适用于电子，机械或电磁部件的封装。
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2.发明授权公开(公告)号：US06453553B1
公开(公告)日：2002-09-24
申请号：US09463228
申请日：2000-02-14
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
IPC分类号： H01B4300
CPC分类号： H01R13/2414 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01R43/007 , Y10T29/49126 , Y10T29/49204 , Y10T29/49222 , Y10T29/49227 , H01L2924/00
摘要： A process for manufacturing an anisotropic conducting film including an insulating film in which holes are formed. Conducting inserts are located in the holes. First ends of the inserts project from one side of the insulating film, from a substrate in which compartments are formed on one surface, corresponding to the distribution of inserts on the insulating film, the shape of the compartments being complementary to the shape of the first ends of the inserts. The manufacturing process includes the steps of using a substrate with compartments with a tipped finish, producing an insulating film above the substrate with holes facing the compartments, producing conducting inserts in the holes and the compartments, and separating the insulating film in which the conducting inserts are formed.
摘要翻译： 一种制造各向异性导电膜的方法，其包括形成有孔的绝缘膜。 导电插入件位于孔中。 插入物的第一端从绝缘膜的一侧从与一个表面上形成隔室的基板相对应于绝缘膜上的插入物的分布伸出，隔室的形状与第一 刀片末端。 该制造方法包括以下步骤：使用具有带顶端面的隔室的基板，在基板的上方产生绝缘膜，孔面向隔室，在孔和隔室中产生导电插入件，并且分离绝缘膜，其中导电插入件 形成。
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公开(公告)号：US5828133A
公开(公告)日：1998-10-27
申请号：US760800
申请日：1996-12-05
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
IPC分类号： C25D17/08 , C25D17/10 , C25D17/12 , H01L21/288 , H05K3/24 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/2885 , H05K3/242 , B01J2219/00605 , B01J2219/00621 , B01J2219/00659 , B01J2219/00713 , H05K2201/09781 , H05K2203/105
摘要： Support for an electrochemical deposit, comprising a substrate (120) and, on the latter, a plurality of first conductive surfaces (128) able to form electrodes, at least one second conductive surface (116) for forming a counterelectrode and means (130, 132, 133, 135) for connecting said first conductive surfaces and said second conductive surface to a voltage source.
摘要翻译： 支持电化学沉积物，其包括基底（120），并在其后面形成能够形成电极的多个第一导电表面（128），用于形成反电极的至少一个第二导电表面（116） 132,133,135），用于将所述第一导电表面和所述第二导电表面连接到电压源。
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公开(公告)号：US5796321A
公开(公告)日：1998-08-18
申请号：US689044
申请日：1996-07-30
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
摘要： An apparatus for the propagation of microwaves, particularly ultrahigh frequency waves. A substrate has formed therein a cavity open on one of the sides of the substrate. A membrane is deposited on the substrate above the cavity. At least one transmission line is located on the membrane which is able to propagate an ultrahigh frequency wave. An integrated circuit for rigidifying the membrane is fixed to the transmission line or to the membrane on the side where the line is located.
摘要翻译： 用于传播微波的装置，特别是超高频波。 衬底在其中形成有在衬底的一侧上敞开的空腔。 在空腔上方的衬底上沉积膜。 至少一条传输线位于能够传播超高频波的膜上。 用于硬化膜的集成电路固定到传输线或线路所在一侧的膜。
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公开(公告)号：US4761517A
公开(公告)日：1988-08-02
申请号：US44784
申请日：1987-05-01
申请人： Claude Massit , Gerard Nicolas
发明人： Claude Massit , Gerard Nicolas
CPC分类号： H01B7/0846 , F17C13/008 , H05K1/0201 , H05K1/09 , H05K1/0393 , H05K2201/062
摘要： Flat electrical connecting cable with controlled electrical and thermal resistances.It comprises a flat insulating support, on which are installed connecting lines constituted by two superimposed layers. The first of them is constituted by a poor heat conducting material, such a manganin, while the second is discontinuous andis formed from a very good electric conducting material, such as copper. The segments on which the second layer is installed are thermally insulated an at uniform temperature. It is possible to vary the conductivity of the different layers by acting on the thickness and width thereof.This invention is applicable in industries such as cryogenics and space, as well as all applications functioning between a cold source and hot source, where it is wished to control the heat exchanges.
摘要翻译： 扁平电气连接电缆，具有受控的电气和热电阻。 它包括一个平坦的绝缘支撑，其上安装有由两个重叠层构成的连接线。 它们中的第一个由诸如锰的不良导热材料构成，而第二个是不连续的，并且由非常好的导电材料例如铜形成。 其上安装有第二层的段在均匀的温度下进行绝热。 通过作用于其厚度和宽度可以改变不同层的导电性。 本发明适用于诸如低温和空间等行业，以及希望控制热交换的冷源和热源之间的所有应用。
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公开(公告)号：US5636683A
公开(公告)日：1997-06-10
申请号：US387605
申请日：1995-02-13
申请人： Claude Massit , Gerard Nicolas , Guy Parat
发明人： Claude Massit , Gerard Nicolas , Guy Parat
CPC分类号： H01L24/81 , H01L2224/16225 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19043
摘要： A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.
摘要翻译： 提供了一种加热装置，用于通过熔化材料连接到连接支撑件上的至少一个部件，所述至少一个部件安装在支撑件上的至少一个连接区域的支撑件的外围。 该装置局部加热连接区域中的支撑件和/或部件。 本发明的特别实用性在平面显示屏的生产领域中发现，但是也可以考虑其它实用程序。
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公开(公告)号：US4684181A
公开(公告)日：1987-08-04
申请号：US800362
申请日：1985-11-21
申请人： Claude Massit , Gerard Nicolas , Gerard Turc
发明人： Claude Massit , Gerard Nicolas , Gerard Turc
摘要： A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.
摘要翻译： 具有高密度接触的微型连接器，可以将N个平行电极连接到N个电导体。 微连接器包括能够接收分别连接到N个导体并固定到可相对于所述支撑件移动的绝缘部分的电极，N导电，柔性，弹性线的支撑件，使得导线平行并且每个 当电极安装在支撑体中时，由于绝缘部分的位移，可以与单个电极接触。 提供凸轮以使部件移动以使各个电极和电线之间同时接触。 微型连接器可用于平板显示装置。
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公开(公告)号：US5373189A
公开(公告)日：1994-12-13
申请号：US99663
申请日：1993-07-30
申请人： Claude Massit , Gerard Nicolas
发明人： Claude Massit , Gerard Nicolas
IPC分类号： H01L25/065 , H01L25/10 , H01L23/02 , H05K7/00
CPC分类号： H01L25/105 , H01L25/0652 , H01L25/0655 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06582 , H01L2225/1023 , H01L2225/1052 , H01L2225/1088 , H01L2924/01014 , H01L2924/10253 , H01L2924/15159 , H01L2924/16153 , H01L2924/1627 , H01L2924/19041 , H01L2924/19107
摘要： Three-dimensional multichip module.The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.Application to the association of integrated circuits in microconnection technology.
摘要翻译： 三维多芯片模块。 本发明涉及一种具有多个二维基本电子模块（4a-4d）的三维或三维多芯片模块，每个都包含至少一个芯片（10a-10d），其上放置有支撑件（6a-6d） 所述芯片和覆盖所述支撑件的上表面的导电互连网络或阵列（8a-8d）。 这些基本模块基本上以移位的方式（以阶梯的形式）叠加，并且通过其互连网络和放置在未被上部基本模块覆盖的基本模块的那些部分上的连接焊盘（12a-12d）相互连接 。 应用于微型连接技术中集成电路的关联。
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9.发明授权Assembly of optical components optically aligned and method for making this assembly 有权光学组件的光学校准和制作该组件的方法
公开(公告)号：US6151173A
公开(公告)日：2000-11-21
申请号：US319269
申请日：1999-08-12
CPC分类号： G03F7/70825 , G02B6/4232 , H01L2224/16225
摘要： An optically aligned optical component assembly. Each optical component has a plurality of first fastening studs. The surface of a support is provided with second fastening studs, where the second studs are formed with parts made of a material that can be soldered to the studs. The optical components are assembled onto the support using corresponding parts. The volume of each part is determined so that the components are optically aligned along a direction that is perpendicular to the surface of the support. This is especially used in the field of microelectronics.
摘要翻译： PCT No.PCT / FR97 / 02275第 371日期1999年8月12日 102（e）日期1999年8月12日PCT 1997年12月11日PCT公布。 公开号WO98 / 26318 PCT 日期1998年6月18日光学对准的光学部件组件。 每个光学部件具有多个第一紧固螺柱。 支撑件的表面设置有第二紧固螺柱，其中第二螺柱由能够被焊接到螺柱的材料制成的部件形成。 使用对应的部件将光学部件组装到支撑件上。 确定每个部件的体积，使得部件沿着垂直于支撑件表面的方向被光学对准。 这在微电子领域尤其如此。
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