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1.发明授权公开(公告)号：US06566170B1
公开(公告)日：2003-05-20
申请号：US09701435
申请日：2000-12-18
IPC分类号： H01L2148
CPC分类号： H01L23/10 , B81C1/00269 , B81C3/002 , B81C2203/019 , B81C2203/032 , H01L21/50 , H01L2224/29011 , H01L2224/29013 , H01L2224/73103 , H01L2224/73203 , H01L2224/81191 , H01L2924/01079 , H01L2924/16152 , H01L2924/00012
摘要： Device comprising a carrier (100) and at least one cover (104) able to be bonded to the carrier to form with the carrier at least one cavity (114) having a controlled atmosphere around at least one component (102). In accordance with the invention, at least one of either the cover or the carrier is provided with at least one wedge (110) in fusible material and a strip of insulation (112) formed around said component, and before bonding, the wedge of fusible material is of sufficient thickness to prevent the strip of insulation (112) from coming into contact both with the cover and with the carrier when they are assembled together. Particular application to the encapsulation of electronic, mechanical or electromagnetic components.
摘要翻译： 装置包括载体（100）和至少一个盖子（104），所述至少一个盖子能够与所述载体结合以与所述载体形成至少一个具有围绕至少一个部件（102）的受控气氛的空腔（114）。 根据本发明，覆盖物或载体中的至少一个在易熔材料中设置有至少一个楔形物（110）和围绕所述构件形成的绝缘条（112），并且在粘合之前，可熔融的楔形物 材料具有足够的厚度，以防止绝缘条（112）在组装在一起时与盖和载体接触。特别适用于电子，机械或电磁部件的封装。
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2.发明授权公开(公告)号：US06453553B1
公开(公告)日：2002-09-24
申请号：US09463228
申请日：2000-02-14
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
IPC分类号： H01B4300
CPC分类号： H01R13/2414 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01R43/007 , Y10T29/49126 , Y10T29/49204 , Y10T29/49222 , Y10T29/49227 , H01L2924/00
摘要： A process for manufacturing an anisotropic conducting film including an insulating film in which holes are formed. Conducting inserts are located in the holes. First ends of the inserts project from one side of the insulating film, from a substrate in which compartments are formed on one surface, corresponding to the distribution of inserts on the insulating film, the shape of the compartments being complementary to the shape of the first ends of the inserts. The manufacturing process includes the steps of using a substrate with compartments with a tipped finish, producing an insulating film above the substrate with holes facing the compartments, producing conducting inserts in the holes and the compartments, and separating the insulating film in which the conducting inserts are formed.
摘要翻译： 一种制造各向异性导电膜的方法，其包括形成有孔的绝缘膜。 导电插入件位于孔中。 插入物的第一端从绝缘膜的一侧从与一个表面上形成隔室的基板相对应于绝缘膜上的插入物的分布伸出，隔室的形状与第一 刀片末端。 该制造方法包括以下步骤：使用具有带顶端面的隔室的基板，在基板的上方产生绝缘膜，孔面向隔室，在孔和隔室中产生导电插入件，并且分离绝缘膜，其中导电插入件 形成。
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公开(公告)号：US5796321A
公开(公告)日：1998-08-18
申请号：US689044
申请日：1996-07-30
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
摘要： An apparatus for the propagation of microwaves, particularly ultrahigh frequency waves. A substrate has formed therein a cavity open on one of the sides of the substrate. A membrane is deposited on the substrate above the cavity. At least one transmission line is located on the membrane which is able to propagate an ultrahigh frequency wave. An integrated circuit for rigidifying the membrane is fixed to the transmission line or to the membrane on the side where the line is located.
摘要翻译： 用于传播微波的装置，特别是超高频波。 衬底在其中形成有在衬底的一侧上敞开的空腔。 在空腔上方的衬底上沉积膜。 至少一条传输线位于能够传播超高频波的膜上。 用于硬化膜的集成电路固定到传输线或线路所在一侧的膜。
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公开(公告)号：US5828133A
公开(公告)日：1998-10-27
申请号：US760800
申请日：1996-12-05
申请人： Patrice Caillat , Claude Massit
发明人： Patrice Caillat , Claude Massit
IPC分类号： C25D17/08 , C25D17/10 , C25D17/12 , H01L21/288 , H05K3/24 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/2885 , H05K3/242 , B01J2219/00605 , B01J2219/00621 , B01J2219/00659 , B01J2219/00713 , H05K2201/09781 , H05K2203/105
摘要： Support for an electrochemical deposit, comprising a substrate (120) and, on the latter, a plurality of first conductive surfaces (128) able to form electrodes, at least one second conductive surface (116) for forming a counterelectrode and means (130, 132, 133, 135) for connecting said first conductive surfaces and said second conductive surface to a voltage source.
摘要翻译： 支持电化学沉积物，其包括基底（120），并在其后面形成能够形成电极的多个第一导电表面（128），用于形成反电极的至少一个第二导电表面（116） 132,133,135），用于将所述第一导电表面和所述第二导电表面连接到电压源。
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5.发明申请MULTIPLE ELECTRODE LEAD AND A SYSTEM FOR DEEP ELECTRICAL NEUROSTIMULATION INCLUDING SUCH A LEAD 审中-公开多电极引线和深潜电子系统，包括这样一个引线公开(公告)号：US20110264166A1
公开(公告)日：2011-10-27
申请号：US13176109
申请日：2011-07-05
CPC分类号： A61N1/0529 , A61N1/0531
摘要： A lead for deep electrical neurostimulation, the lead comprising: a rod of biocompatible material; and a blade, also of biocompatible material, secured to one end of said rod and in alignment therewith; in which said blade presents two main faces and a plurality of electrodes disposed on at least one of said two main faces in a two-dimensional configuration, said electrodes being connected to conductor elements disposed inside or on a surface of said rod.A deep electrical neurostimulation system comprising: an electrical pulse generator for deep electrical neurostimulation; and at least one lead of the above-described type, having its electrodes electrically connected to said electrical pulse generator.
摘要翻译： 铅的深电神经刺激，铅包括：生物相容性材料棒; 以及还具有生物相容性材料的刀片，其固定到所述杆的一端并与其对齐; 其中所述刀片具有两个主表面和设置在所述两个主面中的至少一个上的多个电极，所述两个主面以二维构型，所述电极连接到设置在所述杆的内部或表面上的导体元件。 一种深电神经刺激系统，包括：用于深电神经刺激的电脉冲发生器; 以及上述类型的至少一个引线，其电极与所述电脉冲发生器电连接。
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6.发明申请Multiple electrode lead and a system for deep electrical neurostimulation including such a lead 有权多电极引线和用于深电神经刺激的系统，包括这样的引线公开(公告)号：US20090012593A1
公开(公告)日：2009-01-08
申请号：US12216305
申请日：2008-07-02
IPC分类号： A61N1/05
CPC分类号： A61N1/0529 , A61N1/0531
摘要： A lead for deep electrical neurostimulation, the lead comprising: a rod of biocompatible material; and a blade, also of biocompatible material, secured to one end of said rod and in alignment therewith; in which said blade presents two main faces and a plurality of electrodes disposed on at least one of said two main faces in a two-dimensional configuration, said electrodes being connected to conductor elements disposed inside or on a surface of said rod. A deep electrical neurostimulation system comprising: an electrical pulse generator for deep electrical neurostimulation; and at least one lead of the above-described type, having its electrodes electrically connected to said electrical pulse generator.
摘要翻译： 铅的深电神经刺激，铅包括：生物相容性材料棒; 以及还具有生物相容性材料的刀片，其固定到所述杆的一端并与其对齐; 其中所述刀片具有两个主表面和设置在所述两个主面中的至少一个上的多个电极，所述两个主面以二维构型，所述电极连接到设置在所述杆的内部或表面上的导体元件。 一种深电神经刺激系统，包括：用于深电神经刺激的电脉冲发生器; 以及上述类型的至少一个引线，其电极与所述电脉冲发生器电连接。
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公开(公告)号：US06803228B1
公开(公告)日：2004-10-12
申请号：US09868043
申请日：2001-06-14
申请人： Patrice Caillat , Charles Rosilio
发明人： Patrice Caillat , Charles Rosilio
IPC分类号： C12Q168
CPC分类号： G01N33/5438 , B01J19/0046 , B01J2219/00317 , B01J2219/00653 , B01J2219/00659 , B01J2219/00713 , B01J2219/00722 , C12Q1/6837 , C40B40/06 , C40B60/14
摘要： The present invention relates to a method to produce a biochip and to a biochip, said biochip being composed particularly of biological probes grafted onto a conductive polymer. The method according to the invention comprises the following steps: a) structuring of a substrate so as to obtain on said substrate microtroughs comprising in their base a layer of a material capable of initiating and promoting the adhesion onto said layer of a film of a pyrrole and functionalised pyrrole copolymer by electropolymerisation, b) collective electropolymerisation, so as to form an electropolymerised film of a pyrrole and functionalised pyrrole copolymer on the base of said microtroughs, c) direct or indirect fixation of functionalised oligonucleotides by microdeposition or a liquid jet printing technique.
摘要翻译： 本发明涉及一种生产生物芯片和生物芯片的方法，所述生物芯片特别由接枝在导电聚合物上的生物探针组成。本发明的方法包括以下步骤：a）将基底结构化成 在所述基材微通道上获得能够通过电聚合引发和促进在所述吡咯和官能化吡咯共聚物的膜上的粘合层的材料层，b）集体电聚合，以便形成电聚合膜 在所述微通道的基底上的吡咯和官能化的吡咯共聚物，c）通过微沉积或液体喷射印刷技术直接或间接固定官能化的寡核苷酸。
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公开(公告)号：US06630359B1
公开(公告)日：2003-10-07
申请号：US09744252
申请日：2001-01-31
IPC分类号： H01L2100
CPC分类号： C12Q1/001 , B01J2219/00317 , B01J2219/00585 , B01J2219/00596 , B01J2219/00653 , B01J2219/00659 , B01J2219/00713 , C40B60/14 , G01N33/5438
摘要： A chemical or biological analysis multi-point micro-system including a structure equipped with micro-wells, each micro-well being intended to receive a reagent coupled with a conductive polymer. Each micro-well includes a reception electrode on which the reagent is fixed by the conductive polymer with which it is coupled. Each micro-well also includes a counter-electrode arranged so as to be able to apply, in a volume of the micro-well, an electric field between its counter-electrode and its reception electrode. The structure further enables the simultaneous connection of all the reception electrodes to a first electric potential and enables the simultaneous connection of all the counter-electrodes to a second electric potential to be able to set up the electric field.
摘要翻译： 包括装配有微孔的结构的化学或生物分析多点微系统，每个微孔旨在接收与导电聚合物偶联的试剂。 每个微孔包括接收电极，试剂通过其接合的导电聚合物固定在该接收电极上。 每个微孔还包括布置成能够在微孔的体积中施加在其对电极和其接收电极之间的电场的对电极。 该结构还能够将所有接收电极同时连接到第一电位，并且能够将所有对电极同时连接到能够建立电场的第二电位。
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9.发明授权Process for manufacturing an interconnection substrate to connect a chip onto a reception substrate 失效用于制造互连衬底以将芯片连接到接收衬底的工艺
公开(公告)号：US5861322A
公开(公告)日：1999-01-19
申请号：US658684
申请日：1996-06-05
申请人： Patrice Caillat , David Henry
发明人： Patrice Caillat , David Henry
CPC分类号： H01L21/6835 , H01L21/4857 , H01L2221/68345 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/01078 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/16152
摘要： The process includes the following steps: forming a layer of meltable material (102) on an initial substrate (100); forming a first layer of dielectric material (104) and engraving this layer (104) to form openings (106) therein; forming metal blocks (108) in the openings (106); depositing a metal layer (110) covering the blocks; engraving the metal layer (110) to form conducting tracks (112); forming a layer of dielectric material (114) covering the conducting tracks and engraving this layer (114) to form openings therein; forming metal blocks (118) in these openings; separating the interconnection substrate from the initial substrate by heating the meltable material to a temperature equal to or exceeding its melting temperature.
摘要翻译： 该方法包括以下步骤：在初始基底（100）上形成一层可熔化材料（102）; 形成第一层介电材料（104）并雕刻该层（104）以在其中形成开口（106）; 在所述开口（106）中形成金属块（108）; 沉积覆盖块的金属层（110）; 雕刻金属层（110）以形成导电轨道（112）; 形成覆盖所述导电轨道并刻蚀所述层（114）的介电材料层（114）以在其中形成开口; 在这些开口中形成金属块（118） 通过将可熔材料加热至等于或超过其熔融温度的温度，将互连基板与初始基板分离。
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10.发明授权Integrated electronic sensor for characterizing physical quantities and process for producing such a sensor 失效用于表征物理量的集成电子传感器和用于生产这种传感器的过程
公开(公告)号：US5734106A
公开(公告)日：1998-03-31
申请号：US605044
申请日：1996-03-01
申请人： Patrice Caillat
发明人： Patrice Caillat
CPC分类号： B81C1/0023 , G01D11/245 , G01P15/125 , G01P2015/0817
摘要： The integrated electronic sensor for characterizing physical quantities comprises a substrate (5) having a characterizing member (3) and a cover (9) maintained in the vicinity of and in front of the characterizing member (3) by means of at least one ball (11) bearing on the substrate (5), so as to provide a first spacing between the cover (9) and the substrate and is characterized in that the cover has a boss (15) facing the characterizing member (3) so as to define a second spacing between the cover (9) and the member, which is smaller than the spacing between the cover and the substrate.
摘要翻译： PCT No.PCT / FR94 / 01141 Sec。 371日期1996年3月1日 102（e）1996年3月1日PCT PCT 1994年9月29日PCT公布。 出版物WO95 / 09367 日期1995年4月6日用于表征物理量的集成电子传感器包括具有表征构件（3）的基板（5）和保持在特征构件（3）的前方附近的盖（9），借助于 至少一个支撑在所述基底（5）上的球（11），以便在所述盖（9）和所述基底之间提供第一间隔，其特征在于，所述盖具有面向所述表征构件（3）的凸台（15） ），以便限定盖（9）和构件之间的第二间隔，其小于盖和基板之间的间隔。
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