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    Thick-film circuits and metallization process
    1.
    发明授权
    Thick-film circuits and metallization process 有权
    厚膜电路和金属化工艺

    公开(公告)号：US6150041A

    公开(公告)日：2000-11-21

    申请号：US344046

    申请日：1999-06-25

    申请人： Frans Peter Lautzenhiser ,  Joel Franklin Downey ,  Marion Edmond Ellis

    发明人： Frans Peter Lautzenhiser ,  Joel Franklin Downey ,  Marion Edmond Ellis

    IPC分类号： B32B15/01 ,  C23C28/02 ,  H05K1/05 ,  B05D5/12

    CPC分类号： C23C28/021 ,  B32B15/013 ,  B32B15/018 ,  C23C28/023 ,  C23C28/028 ,  H05K1/05 ,  Y10S438/927 ,  Y10T428/12646 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12951 ,  Y10T428/12979

    摘要： 16 A thick-film circuit (10) includes an electrically conductive substrate (12), such as stainless steel, and a first layer of a gold-rich conductor (15) applied directly thereon. The gold layer is fired in a non-oxidizing atmosphere, such as nitrogen, to ensure a solid mechanical and electrical connection between the gold and the substrate. A next layer of a silver composition (20) containing a first proportion of silver to a conductive metal is directly applied to the gold layer (15). Preferably, the composition (20) includes palladium in equal parts with the silver to achieve a secure mechanical and electrical contact with the gold layer with a minimum resistivity. A silver-rich layer (23) is then applied directly onto the intermediate layer. This silver-rich layer (23) is a composition of silver and the conductive metal in a second proportion greater than the first proportion. In one embodiment, this second proportion is three parts silver to one part palladium by weight. The thick-film stack-up (10) provides a minimum resistance conductive path between electrical components mounted on the silver-rich layer (23) and the conductive substrate (12).

    摘要翻译： 16厚膜电路（10）包括诸如不锈钢的导电基底（12）和直接施加在其上的富金导体（15）的第一层。 金层在非氧化性气氛如氮气中烧成，以确保金和基底之间的牢固的机械和电连接。 将含有第一比例的银与导电金属的下一层银组合物（20）直接施加到金层（15）。 优选地，组合物（20）包括与银相等的钯，以实现与金层的最小电阻率的牢固的机械和电接触。 然后将富银层（23）直接施加到中间层上。 该富银层（23）是比第一比例大的第二比例的银和导电金属的组合物。 在一个实施方案中，该第二比例为三份银与一份钯重量。 厚膜堆叠（10）在安装在富含银层（23）和导电衬底（12）之间的电气部件之间提供最小电阻导电路径。

    Print alignment method for multiple print thick film circuits
    4.
    发明授权
    Print alignment method for multiple print thick film circuits 失效
    多打印厚膜电路的打印对准方法

    公开(公告)号：US6143355A

    公开(公告)日：2000-11-07

    申请号：US251248

    申请日：1999-02-16

    申请人： James Edward Walsh ,  John Karl Isenberg ,  Frans Peter Lautzenhiser

    发明人： James Edward Walsh ,  John Karl Isenberg ,  Frans Peter Lautzenhiser

    IPC分类号： H05K1/02 ,  H05K3/12 ,  B05D5/12

    CPC分类号： H05K1/0268 ,  H05K3/12 ,  H05K2201/09781 ,  H05K2203/166

    摘要： An improved method of making a multiple print thick film circuit wherein the alignment between successive conductor print steps is both optically inspectable and electrically testable. The first of two or more successive conductor print layers includes a pair of adjacent alignment features with a non-conductive gap therebetween, and the successive conductor print layer includes a pair of identical alignment features which are printed directly on top of the alignment feature pair of the first print layer. When the successive print layer is properly aligned with the first print layer, the non-conductive gap between the alignment features of the first print layer will be preserved, and test probes brought into contact with the features or associated probe pads will reveal a high or open-circuit impedance therebetween. If the successive print layer is mis-aligned relative to the first print layer, one or more of its alignment feature segments or surfaces will bridge the non-conductive gap between the alignment features of the first print layer, and test probes brought into contact with the features or associated probe pads will reveal a low or short-circuit impedance therebetween. Additionally or alternatively, the gap between adjacent alignment features may be optically inspected.

    摘要翻译： 一种制造多重印刷厚膜电路的改进方法，其中连续导体印刷步骤之间的对准既可光学检查，也可电学测试。 两个或更多个连续的导体印刷层中的第一个包括一对相邻的对准特征，其间具有非导电间隙，并且连续的导体印刷层包括一对相同的对准特征，其直接印刷在对准特征对的顶部上 第一印刷层。 当连续印刷层与第一印刷层正确对准时，第一印刷层的对准特征之间的非导电间隙将被保留，并且与特征或相关联的探针垫接触的测试探针将显示高或 它们之间的开路阻抗。 如果相继的印刷层相对于第一印刷层错位，则其一个或多个对准特征段或表面将桥接第一印刷层的对准特征之间的非导电间隙，以及与 特征或相关的探针焊盘将在其间显示低或短路阻抗。 附加地或替代地，可以光学检查相邻对准特征之间的间隙。

    Method of manufacturing a thick film circuit with improved dielectric feature definition
    6.
    发明授权
    Method of manufacturing a thick film circuit with improved dielectric feature definition 失效
    制造具有改进的介电特征定义的厚膜电路的方法

    公开(公告)号：US6007867A

    公开(公告)日：1999-12-28

    申请号：US106788

    申请日：1998-06-29

    申请人： James Edward Walsh ,  Carl William Berlin ,  Frans Peter Lautzenhiser ,  John Karl Isenberg

    发明人： James Edward Walsh ,  Carl William Berlin ,  Frans Peter Lautzenhiser ,  John Karl Isenberg

    IPC分类号： H01L21/48 ,  H05K3/46 ,  B05D5/12

    CPC分类号： H01L21/4867 ,  H01L21/4857 ,  H05K3/4664 ,  Y10T29/49144

    摘要： An improved method of manufacturing thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The method utilizes a dielectric material that can be co-fired with an underlying conductor, and preferably, that remains porous after firing. A layer of the dielectric material (FDL) is printed atop a dried but not yet fired conductor of the first circuit layer, and then co-fired with the conductor. Spreading of the FDL prior to firing is minimized due to the porosity of the dried but unfired conductor, which absorbs solvent from the FDL. The FDL can be printed in a ring, enclosing a portion of the underlying conductor to form a via definition ring, or VDR. After the FDL and conductor have been co-fired, a relatively thick cover layer of conventional dielectric material is printed over the first circuit layer, partially over-lapping the fired VDR. Again, spreading of the cover layer of dielectric is minimized, this time due to the porosity of the fired VDR, which absorbs solvent from the cover layer dielectric. The cover layer dielectric is then fired, and a second cover layer of conventional dielectric is printed atop the first cover layer to achieve the desired overall dielectric thickness. Spreading of the second cover layer is also inhibited by the fired VDR, resulting in a via with greatly improved definition compared to previously known processes. Alternatively, the FDL can be printed atop a dried but un-fired conductor and then co-fired with the conductor to form a solder stop with significantly improved feature definition. As with the via, the improved definition occurs because the porous un-fired conductor inhibits spreading of the FDL.

    摘要翻译： 一种改进的制造厚膜电路的方法，其有效地消除了厚度和清晰度之间的折衷，允许没有针孔的厚度增加的电介质层，同时更精确地定义介电特征，例如通孔和 焊锡停止。 该方法使用可以与下面的导体共烧的电介质材料，优选在烧制后保持多孔。 将介电材料层（FDL）印刷在第一电路层的干燥但尚未烧结的导体的顶上，然后与导体共烧。 由于干燥但未烧结的导体的孔隙度，FDL在吸收溶剂之前，在烧制之前扩散FDL被最小化。 FDL可以打印成环形，封装底层导体的一部分以形成通孔定义环或VDR。 在FDL和导体已经共烧之后，在第一电路层上印刷相对厚的常规介电材料的覆盖层，部分地重叠烧结的VDR。 再次，电介质覆盖层的铺展最小化，这次是由于从覆盖层电介质吸收溶剂的烧制VDR的孔隙率。 然后烧制覆盖层电介质，并且在第一覆盖层顶部印刷常规电介质的第二覆盖层以实现期望的总电介质厚度。 第二覆盖层的扩展也被烧制的VDR抑制，导致与先前已知的工艺相比具有大大改善的定义的通孔。 或者，FDL可以印刷在干燥但未燃烧的导体的顶上，然后与导体共烧以形成具有显着改善的特征定义的焊料停止。 与通孔一样，由于多孔未燃烧导体抑制FDL的扩散，发生改进的定义。

    Method of manufacture for a thick film multi-layer circuit
    8.
    发明授权
    Method of manufacture for a thick film multi-layer circuit 失效
    厚膜多层电路的制造方法

    公开(公告)号：US5910334A

    公开(公告)日：1999-06-08

    申请号：US991685

    申请日：1997-12-16

    申请人： Frans Peter Lautzenhiser ,  John Karl Isenberg ,  James Edward Walsh ,  Adam Wade Schubring

    发明人： Frans Peter Lautzenhiser ,  John Karl Isenberg ,  James Edward Walsh ,  Adam Wade Schubring

    IPC分类号： H01L21/48 ,  H05K3/46 ,  B05D5/12

    CPC分类号： H01L21/4867 ,  H01L21/4857 ,  H05K3/4664 ,  Y10T29/49144

    摘要： An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features. The thicker dielectric layer provides improved isolation between circuit layers, and the smaller dielectric features increase the available surface area for conductors and components on the upper dielectric layer. Additionally, process robustness is improved, since there is less fine tuning and batch-to-batch variation when used in high volume production.

    摘要翻译： 一种改进的制造多层厚膜电路的方法，其有效地消除了厚度和清晰度之间的折衷，允许没有针孔的厚度增加的电介质层，并且同时更精确地定义介电特征，例如 通过开口和焊料停止。 电介质特征由介电材料的初始薄层精确定义，称为特征定义印刷或FDP。 在FDP已经干燥但尚未被烧制之后，可以通过印刷相当厚的电介质覆盖层来形成通孔，从而重新研磨FDP的边缘。 由于干燥但未燃烧的FDP的多孔性质，其吸收介电覆盖层的溶剂，这阻止了介电覆盖层的扩展。 然后，FDP与第一电介质层共烧，并且如果需要，可以在烧制的第一层的顶部设置第二介电层，以进一步增加整个电介质厚度。 这导致用于相同数量的连续印刷步骤的较厚的介电层，并且同时具有更小的电介质特征。 较厚的电介质层提供了电路层之间的改进的隔离，较小的电介质特征增加了上电介质层上的导体和部件的可用表面积。 此外，改进了工艺稳定性，因为当用于大批量生产时，微调和批批差异较少。

    Squeegee device for screen printing processes
    9.
    发明授权
    Squeegee device for screen printing processes 失效
    用于丝网印刷工艺的刮胶装置

    公开(公告)号：US5680814A

    公开(公告)日：1997-10-28

    申请号：US603143

    申请日：1996-02-20

    申请人： Frans Peter Lautzenhiser ,  James Edward Walsh

    发明人： Frans Peter Lautzenhiser ,  James Edward Walsh

    IPC分类号： B41F15/44 ,  H05K3/12

    CPC分类号： H05K3/1233 ,  B41F15/44 ,  H05K2203/0139

    摘要： A screen printing device for screen printing a thick film ink through a screen so as to form a highly-defined thick film on a surface of a microelectronics circuit. The screen printing device achieves the above by bypassing excess ink that would otherwise accumulate ahead of the squeegee device, thereby limiting the pressure lead length ahead of the device during the screen printing process. As such, the screen is able to form an adequate seal with the surface of the substrate to prevent ink from bleeding out under the screen, i.e., between the screen and substrate. The result is a well-defined thick film on the substrate, and avoids the necessity of stopping the printing operation in order to remove ink from the lower surface of the screen. The screen printing device enables a method by which well-defined films can be readily deposited at high throughput levels, without necessitating additional procedures, equipment and techniques that might otherwise further complicate the printing process.

    摘要翻译： 一种丝网印刷装置，用于通过屏幕丝网印刷厚膜油墨，以在微电子电路的表面上形成高度限定的厚膜。 丝网印刷装置通过绕过否则将积聚在刮板装置前面的多余的油墨来实现上述目的，从而在丝网印刷过程中将装置前的压力引线长度限制在前面。 因此，屏幕能够与基板的表面形成适当的密封，以防止墨在屏幕下方，即屏幕和基板之间渗出。 结果是在基板上形成了明确的厚膜，并且避免了为了从屏幕的下表面去除油墨而停止打印操作的必要性。 丝网印刷装置使得能够以高生产量水平容易地沉积明确定义的膜的方法，而不需要附加的程序，设备和技术，否则可能使打印过程复杂化。