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    Illumination Device
    5.
    发明申请
    Illumination Device 有权
    照明装置

    公开(公告)号：US20080210962A1

    公开(公告)日：2008-09-04

    申请号：US11814595

    申请日：2006-02-21

    申请人： Simon Blumel ,  Franz Schellhorn ,  Gunter Waitl ,  Mario Wanninger

    发明人： Simon Blumel ,  Franz Schellhorn ,  Gunter Waitl ,  Mario Wanninger

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  F21V5/04 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.

    摘要翻译： 一种照明装置，其特征在于包括具有壳体和设置用于产生辐射的至少一个半导体芯片的光电子部件，以及设置用于在光电子部件处固定并具有光轴的单独的光学元件，所述光学元件具有 辐射出射区域和辐射出射区域具有凹曲面部分区域和凸曲面部分区域，其至少部分地围绕与光轴一定距离的凹曲面部分区域，光轴延伸穿过凹曲面部分区域 。

    LED module and methods for producing and using the module
    6.
    发明授权
    LED module and methods for producing and using the module 有权
    LED模块及其制造和使用方法

    公开(公告)号：US06860621B2

    公开(公告)日：2005-03-01

    申请号：US10345442

    申请日：2003-01-10

    申请人： Bernhard Bachl ,  Günter Kirchberger ,  Franz Schellhorn ,  Martin Weigert

    发明人： Bernhard Bachl ,  Günter Kirchberger ,  Franz Schellhorn ,  Martin Weigert

    IPC分类号： F21K99/00 ,  H01L25/075 ,  H01L25/13 ,  H01L33/62 ,  H01L33/64 ,  F21V29/00

    CPC分类号： H01L33/641 ,  H01L25/0753 ,  H01L25/13 ,  H01L33/62 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.

    摘要翻译： LED模块包括具有良好导热性的基板和固定在基板的顶侧上的一个或多个辐射发射半导体部件。 基板的下侧固定在具有高热容量的载体上，其中半导体部件和基板之间的部件固定以及基板和载体主体之间的基板固定具有良好的导热性。 此外，本发明涉及一种用于制造LED模块的方法，其中适合作为蚀刻掩模的金属区域改善了在阳极接合期间所需的电流的压印，并且同时用作接触的接触区域 连接辐射发射半导体组件。 LED模块具有由于载体主体的高热容量而使半导体元件能够进行更高的通电的优点。

    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
    7.
    发明授权
    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
    用于半导体元件的两极SMT微型外壳及其制造方法

    公开(公告)号：US07288831B2

    公开(公告)日：2007-10-30

    申请号：US11463127

    申请日：2006-08-08

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L23/495 ,  H01L31/0203

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

    TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF
    8.
    发明申请
    TWO-POLE SMT MINIATURE HOUSING FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE MANUFACTURE THEREOF 有权
    用于半导体元件的两点式SMT微型外壳及其制造方法

    公开(公告)号：US20060284287A1

    公开(公告)日：2006-12-21

    申请号：US11463127

    申请日：2006-08-08

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L23/495

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向进行，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
    9.
    发明授权
    Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
    用于半导体元件的两极SMT微型外壳及其制造方法

    公开(公告)号：US06716673B2

    公开(公告)日：2004-04-06

    申请号：US10147672

    申请日：2002-05-15

    申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

    IPC分类号： H01L2348

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

    摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

    摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。