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42 条记录 (耗时 0.019 秒)

    Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities
    7.
    发明申请
    Transparent liquid resin material for SMT-enabled LED-applications at higher temperatures and higher luminosities 有权
    透明液体树脂材料，用于在更高温度和更高的照度下使用SMT的LED应用

    公开(公告)号：US20060100397A1

    公开(公告)日：2006-05-11

    申请号：US11305402

    申请日：2005-12-16

    申请人： Klaus Hohn ,  Gunter Waitl ,  Karlheinz Arndt

    发明人： Klaus Hohn ,  Gunter Waitl ,  Karlheinz Arndt

    IPC分类号： C08G59/14 ,  C08L63/00

    CPC分类号： C08G59/38 ,  C08G59/42 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.

    摘要翻译： 作为用于电子和光电子部件，模块和部件的组装和封装材料的浇铸树脂化合物，例如用于在酸酐可固化的环氧化合物，特别是双酚A-二缩水甘油醚的基础上流出光电组件，包含多功能 环氧酚醛清漆树脂，特别是环氧甲酚酚醛清漆。 该铸塑树脂组合物显示出明显提高的玻璃化转变温度，适合批量生产，不会出现健康恶化，并提供可用于汽车行业的具有SMT能力的产品。

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
    8.
    发明申请
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
    发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座

    公开(公告)号：US20060022215A1

    公开(公告)日：2006-02-02

    申请号：US11179028

    申请日：2005-07-18

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

    摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。

    Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
    9.
    发明授权
    Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components 有权
    用于辐射发射部件的导体框架和壳体，辐射发射部件以及使用辐射发射部件的显示和/或照明系统

    公开(公告)号：US07193299B2

    公开(公告)日：2007-03-20

    申请号：US10487576

    申请日：2002-08-02

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl

    IPC分类号： H01L23/495 ,  H01L31/0203

    CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.

    摘要翻译： 用于可表面安装的辐射发射部件的引线框架，优选地是具有至少一个芯片连接区域和至少一个外部连接条的发光二极管部件。 引线框架以平面方式形成，并且在芯片连接区域和外部连接带之间布置有变形元件，优选弹簧元件。 变形元件使得引线框架在引线框平面中的弹性或塑性变形。 进一步规定了外壳，表面安装部件和具有多个这种部件的布置。

    Optoelectronic component
    10.
    发明申请
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US20060049477A1

    公开(公告)日：2006-03-09

    申请号：US10535794

    申请日：2003-11-27

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl ,  Matthias Winter

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl ,  Matthias Winter

    IPC分类号： H01L31/0203

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.

    摘要翻译： 本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44） 向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分 在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。 本发明还涉及包括所述部件的装置。 组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。