公开(公告)号：US20160300788A1

公开(公告)日：2016-10-13

申请号：US14684664

申请日：2015-04-13

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Rahul Agarwal ,  Jens Oswald ,  Sheng Feng Lu ,  Soon Leng Tan ,  Jeffrey Lam

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  G01R31/04

CPC classification number: H01L23/49827 ,  G01R31/04 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68372

Abstract: A method of forming and testing an interposer includes forming vias in a semiconductor material of a wafer having a front side and a back side. The method further includes disposing an electrically conductive layer on the front side of the wafer such that the layer is electrically connected to the vias. The method also includes forming electrically conductive pads on the front side of the wafer, wherein each electrically conductive pad is electrically connected to the electrically conductive layer. The method further includes forming electrically conductive bumps on the back side of the wafer, wherein each electrically conductive bump is electrically connected to at least one via. The method also includes testing electrical connectivity from a first bump to a second bump of the electrically conductive bumps.

Abstract translation: 形成和测试插入件的方法包括在具有正面和背面的晶片的半导体材料中形成通孔。 该方法还包括在晶片的前侧设置导电层，使得该层电连接到通孔。 该方法还包括在晶片的正面上形成导电焊盘，其中每个导电焊盘电连接到导电层。 该方法还包括在晶片的背面形成导电凸块，其中每个导电凸块与至少一个通孔电连接。 该方法还包括测试从导电凸块的第一凸起到第二凸块的电连接。

公开(公告)号：US20150333035A1

公开(公告)日：2015-11-19

申请号：US14709924

申请日：2015-05-12

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Frank Kuechenmeister ,  Christian Klewer ,  Jens Oswald

IPC: H01L23/00

CPC classification number: H01L25/50 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/03009 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/08147 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48097 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/92127 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.

Abstract translation: 本文提供了包含粘结金属结构的物质及其制备方法。 在一个实施方案中，制备包含粘合金属结构的制品的方法包括提供第一基底。 在第一基板上形成第一金属结构和第二金属结构。 第一金属结构和第二金属结构各自包括暴露的接触表面。 在第一金属结构的接触表面上形成接合掩模。 第二衬底通过第二金属结构的暴露的接触表面结合到第一衬底。 在第二衬底与第一衬底接合期间，接合掩模保持设置在第二金属结构的暴露的接触表面上。 线接合到第一金属结构的暴露的接触表面。

公开(公告)号：US09601424B2

公开(公告)日：2017-03-21

申请号：US14684664

申请日：2015-04-13

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Rahul Agarwal ,  Jens Oswald ,  Sheng Feng Lu ,  Soon Leng Tan ,  Jeffrey Lam

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/498 ,  G01R31/04

CPC classification number: H01L23/49827 ,  G01R31/04 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68372

Abstract: A method of forming and testing an interposer includes forming vias in a semiconductor material of a wafer having a front side and a back side. The method further includes disposing an electrically conductive layer on the front side of the wafer such that the layer is electrically connected to the vias. The method also includes forming electrically conductive pads on the front side of the wafer, wherein each electrically conductive pad is electrically connected to the electrically conductive layer. The method further includes forming electrically conductive bumps on the back side of the wafer, wherein each electrically conductive bump is electrically connected to at least one via. The method also includes testing electrical connectivity from a first bump to a second bump of the electrically conductive bumps.

公开(公告)号：US09570430B2

公开(公告)日：2017-02-14

申请号：US14709924

申请日：2015-05-12

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Frank Kuechenmeister ,  Christian Klewer ,  Jens Oswald

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/50 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/03009 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/08147 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48097 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/85002 ,  H01L2224/92127 ,  H01L2224/94 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.

Abstract translation: 本文提供了包含粘结金属结构的物质及其制备方法。 在一个实施方案中，制备包含粘合金属结构的制品的方法包括提供第一基底。 在第一基板上形成第一金属结构和第二金属结构。 第一金属结构和第二金属结构各自包括暴露的接触表面。 在第一金属结构的接触表面上形成接合掩模。 第二衬底通过第二金属结构的暴露的接触表面结合到第一衬底。 在第二衬底与第一衬底接合期间，接合掩模保持设置在第二金属结构的暴露的接触表面上。 线接合到第一金属结构的暴露的接触表面。