公开(公告)号：US20060006386A1

公开(公告)日：2006-01-12

申请号：US10926581

申请日：2004-08-25

申请人： Franz Hirler ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Uwe Wahl ,  Gerald Deboy ,  Ralf Henninger

发明人： Franz Hirler ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Uwe Wahl ,  Gerald Deboy ,  Ralf Henninger

IPC分类号： H01L29/04

CPC分类号： H01L29/407 ,  H01L29/0847 ,  H01L29/0852 ,  H01L29/404 ,  H01L29/4175 ,  H01L29/4232 ,  H01L29/42368 ,  H01L29/4238 ,  H01L29/7393 ,  H01L29/7816 ,  H01L29/7825 ,  H01L29/8611 ,  H01L29/872

摘要： A semiconductor component is described. In one embodiment, the semiconductor component includes a semiconductor body with a first side and a second side. A drift zone is provided, which is arranged in the semiconductor body below the first side and extends in a first lateral direction of the semiconductor body between a first and a second doped terminal zone. At least one field electrode is provided, which is arranged in the drift zone, extends into the drift zone proceeding from the first side and is configured in a manner electrically insulated from the semiconductor body.

摘要翻译： 描述半导体部件。 在一个实施例中，半导体部件包括具有第一侧和第二侧的半导体本体。 提供了漂移区，其布置在第一侧下方的半导体本体中，并且在第一和第二掺杂末端区之间沿半导体本体的第一横向方向延伸。 设置至少一个场电极，其布置在漂移区中，从第一侧延伸到漂移区，并且以与半导体本体电绝缘的方式配置。

公开(公告)号：US06940126B2

公开(公告)日：2005-09-06

申请号：US10654683

申请日：2003-09-04

申请人： Gerald Deboy ,  Uwe Wahl ,  Armin Willmeroth

发明人： Gerald Deboy ,  Uwe Wahl ,  Armin Willmeroth

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/808 ,  H01L29/76 ,  H01L21/336

CPC分类号： H01L29/7802 ,  H01L29/0634 ,  H01L29/7838 ,  H01L29/8083

摘要： A semiconductor component has at least one first terminal zone of a first conductivity type in a semiconductor body. The first terminal zone is contact-connected by a first terminal electrode. A drift zone of the first conductivity type is adjoined by a second terminal zone of the second conductivity type. A channel zone of a second conductivity type is formed between the at least one first terminal zone and the drift zone. A control electrode is insulated from the semiconductor body and adjacent to the channel zone. A first channel is formed by the channel zone in a region adjacent to the control electrode, the first channel conducts only upon application of a control voltage that is not equal to zero between the control electrode and the first terminal zone. The first terminal electrode is connected to the drift zone via at least one second channel of the first conductivity type, which already conducts in the event of a control voltage equal to zero.

公开(公告)号：US07777278B2

公开(公告)日：2010-08-17

申请号：US12020197

申请日：2008-01-25

申请人： Franz Hirler ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Gerald Deboy ,  Ralf Henninger ,  Uwe Wahl

发明人： Franz Hirler ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Gerald Deboy ,  Ralf Henninger ,  Uwe Wahl

IPC分类号： H01L21/336

CPC分类号： H01L29/407 ,  H01L29/0847 ,  H01L29/0852 ,  H01L29/404 ,  H01L29/4175 ,  H01L29/4232 ,  H01L29/42368 ,  H01L29/4238 ,  H01L29/7393 ,  H01L29/7816 ,  H01L29/7825 ,  H01L29/8611 ,  H01L29/872

摘要： A semiconductor component is described. In one embodiment, the semiconductor component includes a semiconductor body with a first side and a second side. A drift zone is provided, which is arranged in the semiconductor body below the first side and extends in a first lateral direction of the semiconductor body between a first and a second doped terminal zone. At least one field electrode is provided, which is arranged in the drift zone, extends into the drift zone proceeding from the first side and is configured in a manner electrically insulated from the semiconductor body.

摘要翻译： 描述半导体部件。 在一个实施例中，半导体部件包括具有第一侧和第二侧的半导体本体。 提供了漂移区，其布置在第一侧下方的半导体本体中，并且在第一和第二掺杂末端区之间沿半导体本体的第一横向方向延伸。 设置至少一个场电极，其布置在漂移区中，从第一侧延伸到漂移区，并且以与半导体本体电绝缘的方式配置。

公开(公告)号：US20050029581A1

公开(公告)日：2005-02-10

申请号：US10654683

申请日：2003-09-04

申请人： Gerald Deboy ,  Uwe Wahl ,  Armin Willmeroth

发明人： Gerald Deboy ,  Uwe Wahl ,  Armin Willmeroth

IPC分类号： H01L29/06 ,  H01L29/78 ,  H01L29/808 ,  H01L29/76 ,  H01L21/336

CPC分类号： H01L29/7802 ,  H01L29/0634 ,  H01L29/7838 ,  H01L29/8083

摘要： A semiconductor component has at least one first terminal zone of a first conductivity type in a semiconductor body. The first terminal zone is contact-connected by a first terminal electrode. A drift zone of the first conductivity type is adjoined by a second terminal zone of the second conductivity type. A channel zone of a second conductivity type is formed between the at least one first terminal zone and the drift zone. A control electrode is insulated from the semiconductor body and adjacent to the channel zone. A first channel is formed by the channel zone in a region adjacent to the control electrode, the first channel conducts only upon application of a control voltage that is not equal to zero between the control electrode and the first terminal zone. The first terminal electrode is connected to the drift zone via at least one second channel of the first conductivity type, which already conducts in the event of a control voltage equal to zero.

摘要翻译： 半导体部件在半导体本体中具有至少一个第一导电类型的第一端子区域。 第一端子区由第一端子电极接触连接。 第一导电类型的漂移区由第二导电类型的第二端区连接。 在所述至少一个第一端子区域和所述漂移区域之间形成第二导电类型的沟道区域。 控制电极与半导体本体绝缘并且与沟道区相邻。 第一通道由与控制电极相邻的区域中的通道区形成，第一通道仅在控制电极和第一端子区域之间施加不等于零的控制电压时才导通。 第一端子电极经由至少一个第一导电类型的第二沟道连接到漂移区，其在控制电压等于零的情况下已经导通。

公开(公告)号：US20130193525A1

公开(公告)日：2013-08-01

申请号：US13362038

申请日：2012-01-31

申请人： Rolf Weis ,  Gerald Deboy ,  Michael Treu ,  Armin Willmeroth ,  Hans Weber

发明人： Rolf Weis ,  Gerald Deboy ,  Michael Treu ,  Armin Willmeroth ,  Hans Weber

IPC分类号： H01L27/06

CPC分类号： H01L27/0207 ,  H01L21/84 ,  H01L21/845 ,  H01L27/06 ,  H01L27/0629 ,  H01L27/088 ,  H01L27/0886 ,  H01L27/1211 ,  H01L29/4236 ,  H01L29/78 ,  H03K17/063 ,  H03K17/102

摘要： A semiconductor device arrangement includes a first semiconductor device having a load path and a plurality of second semiconductor devices, each having a load path between a first and a second load terminal and a control terminal. The second semiconductor devices have their load paths connected in series and connected in series to the load path of the first semiconductor device. Each of the second semiconductor devices has its control terminal connected to the load terminal of one of the other second semiconductor devices, and one of the second semiconductor devices has its control terminal connected to one of the load terminals of the first semiconductor device. Each of the second semiconductor devices has at least one device characteristic. At least one device characteristic of at least one of the second semiconductor devices is different from the corresponding device characteristic of others of the second semiconductor devices.

公开(公告)号：US20090224302A1

公开(公告)日：2009-09-10

申请号：US12043429

申请日：2008-03-06

申请人： Armin Willmeroth ,  Winfried Kaindl ,  Carolin Tolksdorf ,  Anton Mauder ,  Holger Kapels ,  Gerald Deboy ,  Franz Hirler

发明人： Armin Willmeroth ,  Winfried Kaindl ,  Carolin Tolksdorf ,  Anton Mauder ,  Holger Kapels ,  Gerald Deboy ,  Franz Hirler

IPC分类号： H01L29/94 ,  H01L21/8238

CPC分类号： H01L27/0733 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device with inherent capacitances and method for its production. The semiconductor device has an inherent feedback capacitance between a control electrode and a first electrode. In addition, the semiconductor device has an inherent drain-source capacitance between the first electrode and a second electrode. At least one monolithically integrated additional capacitance is connected in parallel to the inherent feedback capacitance or in parallel to the inherent drain-source capacitance. The additional capacitance comprises a first capacitor surface and a second capacitor surface opposite the first capacitor surface. The capacitor surfaces are structured conductive layers of the semiconductor device on a front side of the semiconductor body, between which a dielectric layer is located and which form at least one additional capacitor.

摘要翻译： 具有固有电容的半导体器件及其制造方法。 半导体器件在控制电极和第一电极之间具有固有的反馈电容。 此外，半导体器件在第一电极和第二电极之间具有固有的漏极 - 源极电容。 至少一个单片集成附加电容与固有反馈电容并联连接，或与固有漏 - 源电容并联连接。 附加电容包括与第一电容器表面相对的第一电容器表面和第二电容器表面。 电容器表面是半导体器件的前侧上的半导体器件的结构化导电层，介电层位于其之间，并形成至少一个附加电容器。

公开(公告)号：US20050024925A1

公开(公告)日：2005-02-03

申请号：US10629107

申请日：2003-07-29

申请人： Gerald Deboy ,  Armin Willmeroth

发明人： Gerald Deboy ,  Armin Willmeroth

IPC分类号： G11C11/00 ,  H01L23/62 ,  H01L27/02 ,  H01L29/76 ,  H03K17/08

CPC分类号： H01L27/0248

摘要： The invention relates to a configuration for generating a low-voltage signal proportional to the high voltage present between the source and the drain of a power transistor. For this purpose, a capacitive voltage divider including the source-gate capacitance serving as a low-voltage tap and the source-drain capacitance serving as a high-voltage element is situated in a voltage sense region.

摘要翻译： 本发明涉及一种用于产生与功率晶体管的源极和漏极之间存在的高电压成比例的低电压信号的配置。 为此，包括用作低电压抽头的源极 - 栅极电容和用作高电压元件的源极 - 漏极电容的电容分压器位于电压感测区域中。

公开(公告)号：US08569842B2

公开(公告)日：2013-10-29

申请号：US13275151

申请日：2011-10-17

申请人： Rolf Weis ,  Franz Hirler ,  Matthias Stecher ,  Armin Willmeroth ,  Gerald Deboy ,  Martin Feldtkeller

发明人： Rolf Weis ,  Franz Hirler ,  Matthias Stecher ,  Armin Willmeroth ,  Gerald Deboy ,  Martin Feldtkeller

IPC分类号： H01L27/06 ,  H01L27/088 ,  H01L27/098 ,  H01L29/161 ,  H01L29/20 ,  H01L29/778 ,  H01L29/788

CPC分类号： H01L27/0207 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823437 ,  H01L27/0623 ,  H01L27/0629 ,  H01L27/0727 ,  H01L27/088 ,  H01L27/0883 ,  H01L27/0886 ,  H01L27/098 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/4236 ,  H01L29/4238 ,  H01L29/78 ,  H01L29/7817 ,  H01L29/7824 ,  H01L29/7825 ,  H01L29/7835 ,  H01L29/7838 ,  H03K17/06

摘要： A semiconductor device arrangement includes a first semiconductor device having a load path, and a number of second transistors, each having a load path between a first and a second load terminal and a control terminal. The second transistors have their load paths connected in series and connected in series to the load path of the first transistor. Each of the second transistors has its control terminal connected to the load terminal of one of the other second transistors. One of the second transistors has its control terminal connected to one of the load terminals of the first semiconductor device.

摘要翻译： 半导体器件布置包括具有负载路径的第一半导体器件和多个第二晶体管，每个具有第一和第二负载端子与控制端子之间的负载路径。 第二晶体管的负载路径串联连接并与第一晶体管的负载路径串联连接。 每个第二晶体管的控制端连接到其它第二晶体管的负载端子。 第二晶体管中的一个具有其控制端子连接到第一半导体器件的负载端子之一。

公开(公告)号：US06812524B2

公开(公告)日：2004-11-02

申请号：US10013999

申请日：2001-12-11

申请人： Dirk Ahlers ,  Jens-Peer Stengl ,  Jenoe Tihanyi ,  Hans Weber ,  Gerald Deboy ,  Helmut Strack ,  Armin Willmeroth

发明人： Dirk Ahlers ,  Jens-Peer Stengl ,  Jenoe Tihanyi ,  Hans Weber ,  Gerald Deboy ,  Helmut Strack ,  Armin Willmeroth

IPC分类号： H01L2976

CPC分类号： H01L29/7802 ,  H01L29/0619 ,  H01L29/0623 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/7816

摘要： A semiconductor component includes first and second connection zones formed in a semiconductor body, a channel zone surrounding the second connection zone in the semiconductor body, and a drift path that is formed between the channel zone and the first connection zone and contains a compensation zone. The compensation zone has a complementary conduction type with respect to the drift zone and includes at least two segments. A distance between the two adjacent segments is chosen such that the punch-through voltage between these segments lies in a voltage range that corresponds to the voltage range assumed by the voltage drop across the drift path at currents situated between the rated current and twice the rated current.

摘要翻译： 半导体部件包括形成在半导体本体中的第一和第二连接区域，围绕半导体主体中的第二连接区域的沟道区域以及形成在沟道区域和第一连接区域之间并且包含补偿区域的漂移路径。 补偿区相对于漂移区具有互补导电类型并且包括至少两个段。 选择两个相邻段之间的距离，使得这些段之间的穿通电压位于对应于位于额定电流和额定电流两倍之间的电流处的漂移路径上的电压降所假定的电压范围的电压范围 当前。

公开(公告)号：US06667514B2

公开(公告)日：2003-12-23

申请号：US10190119

申请日：2002-07-03

申请人： Dirk Ahlers ,  Gerald Deboy ,  Hans Weber ,  Armin Willmeroth

发明人： Dirk Ahlers ,  Gerald Deboy ,  Hans Weber ,  Armin Willmeroth

IPC分类号： H01L2976

CPC分类号： H01L29/7802 ,  H01L29/0634 ,  H01L29/41766

摘要： A semiconductor component includes a charge compensation structure wherein locations with a maximum local field strength are positioned in a compensation edge region of the charge compensation structure. Thus, an electrical parameter such as the on resistance of the semiconductor component can be substantially improved without influencing or impairing further parameters such as the breakdown voltage and the robustness with respect to TRAPATT oscillations. Methods of fabricating a semiconductor component with a charge compensation structure are also provided.

摘要翻译： 半导体部件包括电荷补偿结构，其中具有最大局部场强的位置位于电荷补偿结构的补偿边缘区域中。 因此，可以显着地改善诸如半导体部件的导通电阻的电参数，而不影响或削弱诸如击穿电压和相对于TRAPATT振荡的鲁棒性的其它参数。 还提供了制造具有电荷补偿结构的半导体部件的方法。