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117 条记录 (耗时 0.024 秒)

    Method of protecting a non-planar feature using compressive pads and apparatus thereof
    1.
    发明授权
    Method of protecting a non-planar feature using compressive pads and apparatus thereof 失效
    使用压缩垫保护非平面特征的方法及其装置

    公开(公告)号：US06179951B2

    公开(公告)日：2001-01-30

    申请号：US09263965

    申请日：1999-03-05

    申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Suresh D. Kadakia ,  Abubaker S. Shagan

    发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Suresh D. Kadakia ,  Abubaker S. Shagan

    IPC分类号： B32B3120

    CPC分类号： B32B37/0023 ,  B32B37/26 ,  B32B2315/02 ,  H01L21/4857

    摘要： The present invention relates generally to a new apparatus and method for forming non-planar surfaces in substrates. More particularly, the invention encompasses an apparatus and a method for fabricating non-planar surfaces in semiconductor substrates wherein at least one zero compression set pad, such as a closed cell porous pad in combination with at least one elastic pad is placed over the non-planar surface prior to lamination and is caused to conform to the contour of the non-planar surface, thus preventing collapse of, or damage to, the non-planar features, such as, shelves or corners during the lamination process. After the lamination process, the zero compression set pad are conveniently removed from the non-planar surface area without causing any damage to the non-planar surface features, such as, shelves or corners or having any paste pull-outs. These zero compression set pads can be reused multiple number of times to form these MLC cavity substrates or similar other structures or features.

    摘要翻译： 本发明一般涉及用于在基片中形成非平面表面的新装置和方法。 更具体地说，本发明包括一种用于在半导体衬底中制造非平面表面的装置和方法，其中至少一个零压缩固定衬垫，例如与至少一个弹性衬垫组合的闭孔多孔垫， 平坦表面，并且使其符合非平面表面的轮廓，从而防止在层压过程期间非平面特征（例如，搁板或角部）的塌陷或损坏。 在层压过程之后，零压缩固定垫可以方便地从非平面表面区域移除，而不会对非平面表面特征（例如，搁板或角落）或具有任何糊状物拉出造成任何损坏。 这些零压缩设定焊盘可以重复使用多次以形成这些MLC腔体衬底或类似的其他结构或特征。

    Greensheet carriers and processing thereof
    4.
    发明授权
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US06607620B2

    公开(公告)日：2003-08-19

    申请号：US09757071

    申请日：2001-01-08

    申请人： John U. Knickerbocker ,  Govindarajan Natarajan

    发明人： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC分类号： B32B3118

    CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

    摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

    Ceramic structure using a support sheet
    6.
    发明授权
    Ceramic structure using a support sheet 有权
    陶瓷结构使用支撑片

    公开(公告)号：US06726984B2

    公开(公告)日：2004-04-27

    申请号：US10403239

    申请日：2003-03-28

    申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

    发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

    IPC分类号： B32B300

    CPC分类号： H01L21/486 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09581 ,  H05K2203/0152 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T156/1057 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

    摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在多层陶瓷封装的制造中筛选，堆叠和处理非常薄的生片和/或具有非常密集金属化图案的生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。